电子元件标准规范中英文对照.docx
- 文档编号:9998928
- 上传时间:2023-02-07
- 格式:DOCX
- 页数:38
- 大小:35.01KB
电子元件标准规范中英文对照.docx
《电子元件标准规范中英文对照.docx》由会员分享,可在线阅读,更多相关《电子元件标准规范中英文对照.docx(38页珍藏版)》请在冰豆网上搜索。
电子元件标准规范中英文对照
电子元件标准规范中英文对照
1GB/T1772-1979电子元器件失效率试验方法Determinationoffailurerateofelectronicelementsandcomponents
2GB/T2036-1994印制电路术语Termsforprintedcircuits
3GB/T2413-1980压电陶瓷材料体积密度测量方法Piezoelectricceramicmaterials--Measuringmethodsfordeterminationofvolumedensity
4GB/T2470-1995电子设备用固定电阻器、固定电容器型号命名方法Typedesignationsystemforfixedresistorsandfixedcapacitorsforuseinelectronicequipment
5GB/T2471-1995电阻器和电容器优先数系Preferrednumberseriesforresistorsandcapacitors
6GB/T2472-1981电子设备用固定式电容器工作电压系列Fixedcapacitorsforelectronicequipments--Workingvoltageseries
7GB/T2473-1981电子设备用矩形金属外壳电容器外形尺寸系列Capacitorswithrectangularmetalenclosureforelectronicequipments--Outlinedimensionsseries
8GB/T2474-1981电子设备用圆形金属外壳电容器外形尺寸系列Capacitorswithdiscmetalenclosureforelectronicequipments--Outlinedimensionsseries
9GB/T2658-1995小型交流风通用机技术条件A.C.miniatureblowers,generalspecificationfor
10GB/T2693-1990电子设备用固定电容器第一部分:
总规范(可供认证用)Fixedcapacitorsforuseinelectronicequipment—Part1:
Genericspecification
11GB/T2775-1993手控电子元件的轴端尺寸Dimensionsofspendleendsformanuallyoperatedelectroniccomponents
12GB/T3351-1982人造石英晶体的型号命名Designationsforsyntheticquartzcrystals
13GB/T3388-1982压电陶瓷材料型号命名方法Designationsfortypesofpiezoelectricceramics
14GB/T3389.3-1982压电陶瓷材料性能测试方法居里温度Tc的测试Testmethodsforthepropertiesofpiezoelectricceramics--TestforCurietemperatureTc
15GB/T3389.4-1982压电陶瓷材料性能测试方法柱体纵向长度伸缩振动模式Testmethodsforthepropertiesofpiezoelectricceramics--Longitudinallengthextensionvibrationmodeforrod
16GB/T3389.7-1986压电陶瓷材料性能测试方法强场介电性能的测试Testmethodsforthepropertiesofpiezoelectricceramics--Testfordielectricpropertiesinhighelectricfield
17GB/T3389.8-1986压电陶瓷材料性能测试方法热释电系数的测试Testmethodsforthepropertiesofpiezoelectricceramics--Testforthepyroelectriccoefficient
18GB/T3664-1986电容器非线性测量方法Methodofmeasurementofnon-linearityincapacitors
19GB/T3788-1995真空电容器通用技术条件Generalspecificationforvacuumcapacitors
20GB/T4071-1983光致荧光粉测试方法Measuringmethodforthephosphorexcitedbylight
21GB/T4072-1983阴极射线致荧光粉测试方法Measuringmethodofthephosphorexcitedbycathodrays
22GB/T4098.1-1983射频电缆电晕试验方法Testmethodofcoronaforradio-frequencycables
23GB/T4098.2-1983射频电缆电容和电容不平衡测量方法Methodsofmeasurementofcapacitanceandcapacitanceunbalanceforradio-freguencycables
24GB/T4098.3-1983射频电缆特性阻抗测量方法Methodsofmeasurementofcharacteristicimpedanceforradio-frequencycables
25GB/T4098.4-1983射频电缆衰减常数测量方法Methodsofmeasurementofattenuationconstantforradio-frequencycables
26GB/T4098.5-1983射频电缆电容稳定性试验方法Testmethodofcapacitancestabilityforradio-frequencycables
27GB/T4098.6-1983射频电缆衰减稳定性试验方法Testmethodofattenuationstabilityforradio-frequencycables
28GB/T4098.7-1983射频电缆高温试验方法Testmethodofhigh-temperatureforradio-frequencycables
29GB/T4098.8-1983射频电缆低温试验方法Testmethodoflow-temperatureforradio-frequencycables
30GB/T4098.9-1983射频电缆流动性试验方法Testmethodofflowforradio-frequencycables
31GB/T4098.10-1983射频电缆尺寸稳定性试验方法Testmethodofdimensionalstabilityforradio-frequencycables
32GB/T4165-1984电子设备用可变电容器的使用导则Guidetotheuseofvariablecapacitorsinelectronicequipment
33GB/T4166-1984电子设备用可变电容器的试验方法Methodsoftestofvariablecapacitorsinelectronicequipment
34GB/T4210-1984电子设备用机电元件名词术语Termsofelectromechanicalcomponentsforelectronicequipment
35GB/T4475-1995敏感元器件术语Termsofsensor
36GB/T4588.1-1996无金属化孔单双面印制板分规范Sectionalspecification:
singleanddoublesidedprintedboardswithplainholes
37GB/T4588.2-1996有金属化孔单双面印制板分规范Sectionalspecification:
singleanddoublesidedprintedboardswithplated-throughholes
38GB/T4588.3-1988印制电路板设计和使用Designanduseofprintedboards
39GB/T4588.4-1996多层印制板分规范Seetionalspocification--Multilayerprintedboards
40GB/T4588.10-1995印制板第10部分:
有贯穿连接的刚挠双面印制板规范Printedboards--Part10:
Specificationforflex-rigiddouble-sidedprintedboardswiththroughconnections
41GB/T4596-1984电子设备用三相变压器形铁心E-coresforthree-phasetransformersforuseinelectronicequipment
42GB/T4677.1-1984印制板表层绝缘电阻测试方法Testmethodofsurfaceinsulationresistanceforprintedboards
43GB/T4677.2-1984印制板金属化孔镀层厚度测试方法微电阻法Micro-resistancetestmethodofplatingthicknessofplatedthroughholesforprintedboards
44GB/T4677.3-1984印制板拉脱强度测试方法Testmethodsofpullstrengthforprintedboards
45GB/T4677.4-1984印制板抗剥强度测试方法Testmethodsofpeelstrengthforprintedboards
46GB/T4677.5-1984印制板翘曲度测试方法Testmethodsofplatnessforprintedboards
47GB/T4677.6-1984金属和氧化覆盖层厚度测试方法截面金相法Testmethodsforthicknessofmetalandoxidecoatingbymicroscopicalexaminationofcross-section
48GB/T4677.7-1984印制板镀层附着力试验方法胶带法Testmethodofplatingadhesionbyadhesivetypeforprintedboards
49GB/T4677.8-1984印制板镀涂覆层厚度测试方法β反向散射法Testmethodofplatingandcoatingthicknessbybetabackscatteringforprintedboards
50GB/T4677.9-1984印制板镀层孔隙率电图象测试方法Theelectrographictestmethodofplatingporosityforprintedboards
51GB/T4677.10-1984印制板可焊性测试方法Testmethodofsolderabilityforprintedboards
52GB/T4677.11-1984印制板耐热冲击试验方法Testmethodsofthermalshockforprintedboards
53GB/T4677.12-1988印制板互连电阻测试方法Testmethodofinterconnectionresistanceforprintedboards
54GB/T4677.13-1988印制板金属化孔电阻的变化热循环测试方法Testmethodofchangeinresistanceofplated-throughholes--Thermalcyclingforprintedboards
55GB/T4677.14-1988印制板蒸汽-氧气加速老化试验方法Testmethodofsteam/oxygenacceleratedageingofprintedboard
56GB/T4677.15-1988印制板绝缘涂层耐溶剂和耐焊剂试验方法Testmethodforsolventandfluxresistanceofinsulatingcoatingonprintedboards
57GB/T4677.16-1988印制板一般检验方法Generalexaminationmethodforprintedboards
58GB/T4677.17-1988多层印制板内层绝缘电阻测试方法Testmethodforinsulationresistancewithininnerlayersofmultilayerprintedboards
59GB/T4677.18-1988多层印制板层间绝缘电阻测试方法Testmethodforinsulationresistancebetweenlayersofmultilayerprintedboards
60GB/T4677.19-1988印制板电路完善性测试方法Testmethodforelectricalintegrityofprintedboards
61GB/T4677.20-1988印制板镀层附着性试验方法摩擦法Testmethodforplatingadhesionofprintedboards--Burnishing
62GB/T4677.21-1988印制板镀层孔隙率测试方法气体暴露法Testmethodforplatingporosityofprintedboards--Thegasexposuremethod
63GB/T4677.22-1988印制板表面离子污染测试方法Testmethodforsurfaceioniccontaminationofprintedboards
64GB/T4677.23-1988印制板阻燃性能测试方法Testmethodforflammabilityofprintedboards
65GB/T4721-1992印制电路用覆铜箔层压板通用规则Generalrulesforcopper-cladlaminatedsheetsforprintedcircuits
66GB/T4722-1992印制电路用覆铜箔层压板试验方法Testmethodsforcopper-cladlaminatedsheetsforprintedcircuits
67GB/T4723-1992印制电路用覆铜箔酚醛纸层压板Phenoliccellulosepapercopper-cladlaminatedsheetsforprintedcircuits
68GB/T4724-1992印制电路用覆铜箔环氧纸层压板Epoxidecellulosepapercopper-cladlaminatedsheetsforprintedcircuits
69GB/T4725-1992印制电路用覆铜箔环氧玻璃布层压板Epoxidewovenglassfabriccopper-cladlaminatedsheetsforprintedcircuits
70GB/T4779.1-1984彩色显象管用荧光粉Y22-G3荧光粉Phosphorsforcolorpicturetubesuse--PhosphorY22-G3
71GB/T4779.2-1984彩色显象管用荧光粉Y22-B2荧光粉Phosphorsforcolorpicturetubesuse--PhosphorY22-B2
72GB/T4779.3-1984彩色显象管用荧光粉Y22-R4荧光粉Phosphorsforcolorpicturetubesuse--PhosphorY22-R4
73GB/T4825.1-1984印制板导线局部放电测试方法Testmethodforpartialdischargeofconductorsonprintedboards
74GB/T4825.2-1984印制板导线载流量测试方法Testmethodforcurrentcarryingcapacityofconductorsonprintedboards
75GB/T4874-1985直流固定金属化纸介电容器总规范Genericspecificationforfixedmetallizedpaperdielectriccapacitorsfordirectcurrent
76GB/T5076-1985具有两个轴向引出端的圆柱体元件的尺寸测量Measurementofthedimensionsofacylindricalcomponenthavingtwoaxialterminations
77GB/T5077-1985电容器和电阻器的最大外形尺寸Maximumcasedimensionsforcapacitorsandresistors
78GB/T5078-1985单向引出的电容器和电阻器所需空间的测定方法Methodforthedeterminationofthespacerequiredbycapacitorsandresistorswithunidirectionalterminations
79GB/T5489-1985印制板制图Printedboarddrawing
80GB/T5594.1-1985电子元器件结构陶瓷材料性能测试方法气密性测试方法Testmethodsforpropertiesofstructureceramicusedinelectroniccomponents--Testmethodforgas-tightness
81GB/T5594.2-1985电子元器件结构陶瓷材料性能测试方法杨氏弹性模量、泊松比测试方法Testmethodsforpropertiesofstructureceramicusedinelectroniccomponents--TestmethodforYoungselasticmodulusandPoissonratio
82GB/T5594.3-1985电子元器件结构陶瓷材料性能测试方法平均线膨胀系数测试方法Testmethodsforpropertiesofstructureceramicusedinelectroniccomponents--Testmethodformeancoefficientoflinearexpansion
83GB/T5594.4-1985电子元器件结构陶瓷材料性能测试方法介质损耗角正切值的测试方法Testmethodsforpropertiesofstructureceramicusedinelectroniccomponents--Testmethodfordielectriclossangletangentvalue
84GB/T5594.5-1985电子元器件结构陶瓷材料性能测试方法体积电阻率测试方法Testmethodsforpropertiesofstructureceramicusedinelectroniccomponents--Testmethodforvolumeresistivity
85GB/T5594.6-1985电子元器件结构陶瓷材料性能测试方法化学稳定性测试方法Testmethodsforpropertiesofstructureceramicusedinelectroniccomponents--Testmethodforchemicaldurability
86GB/T5594.7-1985电子元器件结构陶瓷材料性能测试方法透液性测定方法Testmethodsforpropertiesofstructureceramicusedinelectroniccomponents--Testmethodforliquidpermeability
87GB/T5594.8-1985电子元器件结构陶瓷材料性能测试方法显微结构的测定Testmethodsforpropertiesofstructureceramicusedinelectroniccomponents--Determinationofmicrostructure
88GB/T5598-1985氧化铍瓷导热系数测定方法Testmethodforthermalconductivityofberylliumoxideceramics
89GB/T5729-1994电子设备用固定电阻器第一部分:
总规范Fixedresistorsforuseinelectronicequipment--Part1:
Genericspecification
90GB/T5730-1985电子设备用固定电阻器第二部分:
分规范:
低功率非线绕固定电阻器(可供认证用)Fixedresistorsforuseinelectronicequipment--Part2:
Sectionals
- 配套讲稿:
如PPT文件的首页显示word图标,表示该PPT已包含配套word讲稿。双击word图标可打开word文档。
- 特殊限制:
部分文档作品中含有的国旗、国徽等图片,仅作为作品整体效果示例展示,禁止商用。设计者仅对作品中独创性部分享有著作权。
- 关 键 词:
- 电子元件 标准规范 中英文 对照