DellReliabilityQualification.docx
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DellReliabilityQualification.docx
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DellReliabilityQualification
DellReliabilityEngineering
QualificationProgramRequirements
For
NotebookCircuitBoards
Author:
CliffWhite
1.Purpose
ThisspecificationdefinesthereliabilityrequirementstoqualifyacircuitboardforshipmentinaDellportable/notebook/laptopcomputer.
Thisspecificationaddress:
∙Productreliabilityrequirements
∙Reliabilityrelatedengineeringanalysis&tasks
∙Productqualificationtests
∙Roles&responsibilitiesforeachanalysis,taskandqualificationtest
∙DeliverablestoDellreliabilityengineeringforverificationandapproval
2.Scope
QualificationprogramstodemonstratecompliancewiththisspecificationwillbeimplementedasaJointReliabilityQualificationProgram(JRQP)betweenDellreliabilityengineeringandtheOEM/ODM/TP’sdesignatedteamofengineeringandtestpersonnel.
Forthepurposeofthisdocument,theterm“supplier”willdefinetheappropriateDelldevelopmentpartnerteaminlieuofthephrasesOEM,ODMorTP.
Dellreliabilityengineeringreservestherighttoperiodicallyauditthesupplier’stasksanddeliverablestogainconfidenceintheproductdesignandtheexecutionofthedefinedtasks.
Sustainingandpost-RTSreliabilityauditprojectswillfollowthisprocessorasubsetthereof,basedonthechangestotheoriginalproject.
Additionalengineeringtasksandqualificationtestsmaybedefinedandassignedtomeetanyidentifieduniquereliabilityneedsofaparticularperipheral.
3.ImplementationProcess
Thenormalimplementationprocessforthesequalificationprogramsis:
1.Kickoffmeeting
∙Scheduledimmediately(withintwoweeks)aftercontractaward
∙Providesopportunityfordetaileddiscussionsofrequirements
∙IdentifiesteammembersresponsibletoimplementtheJRQP
∙Establishesthescheduleconstraints
∙Identifyopportunitiestouseexistingtestdataorreliabilitiesanalysestoreducescopeofprogram
∙Thedesigndocumentationdeliverablesdefinedinsection4.1isaprerequisiteforthismeeting
∙Mayrequiremorethanonemeetingtofullyimplementalltheexpectedtasks
2.ReliabilityProgramPlanReview
∙Scheduledwithintwo-threeweeksafterKickoffMeeting
∙SupplierteampresentstheirPeripheralReliabilityQualificationPlan(PRQP)toimplementthisqualificationprogramwhich
∙IncludesadequatedetailsofeachtaskandtestforreviewandeventualapprovalbyDellreliabilityengineering
∙Providesspecificproceduresorreferencesexistingsupplier’sproceduresforeachtaskortest.
∙Providesascheduleforeachtaskandtest
∙OnceapprovedbyDellreliabilityengineering,theapprovedPRQP:
∙Becomestheroadmapforprogramimplementation
∙IssubmittedtotheDellprogrammanagerforincorporationintotheoverallprogramplansandschedules
2.Statusreviews
∙Thequalificationprogramstatusisreportedintheregularscheduledprogramreviewsandnotinreliabilityspecificstatusmeetingsunlessrequiredbyprogramuniquecircumstances
∙Reports(deliverables)aresubmittedtoDellreliabilityengineeringaseachanalysis,taskandtestiscompleted.
∙Thesereports(deliverables)willincludeadequatecontentforavalidreviewandeventualapproval
3.FinalReviewandReport
∙AfinalreviewofthePQRPisconductedonceeachandeverydeliverablehasbeensubmittedtoDellreliabilityengineering
∙DellreliabilityengineeringwillsubmitafinalreporttotheDellprogrammanagerafterthisreview
4.ReliabilityEngineeringRequirements可靠性工程需求
4.1DesignDocumentation設計文檔
Thesupplier’sinitialtaskistoprovidecopiesofthefollowingdesigndocumentationtoDellreliabilityengineer:
∙Schematic
∙BOM
∙Drawingpackagewhichshowsphysicallocationofeachcomponentwithreferencedesignator
∙Componentspecificationsfor:
uniquesemiconductors,connectors,fansandaluminumelectrolyticcapacitors
∙Productspecificationswhichdefine:
∙Operationalandstorageenvironmentalenvironments
∙Maximumspecifiedcriticalcomponentsurfacetemperaturesforguaranteedfullperformance
∙Typicalandmaximumpowerdissipation
∙IdentificationofeachtargetedDellcomputerplatformforthisproduct
∙Photographs(softcopies)ofbothsidesoftheproductwithandwithouttheheatsinks
ThedesigndocumentationpackageisadeliverabletoDellreliabilityengineeringwhichisduebeforethefinalKickoffmeeting.
4.2PeripheralReliabilityQualificationPlan(PRQP)
周邊可靠性鑑定計劃(PRQP)
Thesupplier’staskistogenerateaperipheralreliabilityqualificationplan(PRQP)specifictothisproduct.ThisplanisakeydeliverableandaperquisitefortheReliabilityProgramReview.
ThispurposeofthisplanistodemonstratetoDellreliabilityengineeringthat:
∙TheselectedOEM/ODMteamunderstandstherequirements
∙TheOEM/ODMhasthecapability-resourcestoimplementthequalificationprogram
∙Providesthebasisforthefinalqualificationplanuponapproval
Thisscheduleforthisplan:
∙IsgeneratedbytheOEM/ODMteamaftertheKickoffmeeting
∙DeliveredtoDellreliabilityengineeringpriortotheReliabilityProgramReview
∙BecomestheplanofrecordonceapprovedbyDellreliabilityengineering
Thecontentofthisplanshall:
∙BewrittenintheOEM/ODM’sselectedformattofacilitateefficientimplementation,statusreportsandtestreports
∙Shallbestructuredtomatchtheallocation-distributionofdefinedanalyses,tasksandteststhroughouttheOEM/ODM’sresources
∙Definetheteammembersandresourcesresponsibleforimplementationofeachanalyses,taskandtest
∙Definestheprocess-procedureforeachreliabilityengineeringanalysestask
∙IdentifyeachtargetedDellcomputerplatformforthisproduct
SpecificPRQPrequirementsaredefinedinthefollowingsectionsforeachreliabilityengineeringanalyses,taskandqualificationtest.
4.3ThermalProfileTest
散熱剖面測試
Thepurposeofthistestisto:
∙Measurethesurfacetemperatureforeachcriticalcomponent
∙Measure–estimatetheambienttemperatureforeveryothercomponent
Datafromthistestisusedto:
∙Calculatecomponentfailurerates(StressBasedReliabilityPrediction(MTBF))
∙Calculatecomponentthermalstresslevels(ThermalandElectricalStressAnalysis)
∙Calculateexpectedusefullifeforlimitedlifeitems(LimitedLifeComponentIdentification&Analysis)
Thistaskisimplementedusingthefollowingsequence:
1.Thermal-couplesareattachedtothesurfaceofeachcriticalcomponent
2.TheidentityofeachcriticalcomponentisdocumentedinthePRQPandreviewedintheReliabilityProgramPlanReview
3.Thecircuitboardisthen
∙Partitionedoffintosectors(bothsidesifcomponentsareinstalledonthereverseside)
∙Andinstrumentedwiththermal-couplestomeasureambientairtemperaturesfortheremainingcomponents
4.TheinstrumentedcircuitboardisinstalledinaTestEnclosure
∙ThisTestEnclosureservestominimizeanycoolingeffectofthetestchamber’scirculationaircurrentsandartificiallycoolthetestsample
∙Thetestsampleisconnectedtotestequipmentviacablesoutside
5.Thermalmeasurementsarerecordedwhilethetestsamples(installedintheTestEnclosure)arerunningtestsoftwareforbothnominalexpecteduseandreasonableworstcasepowerdissipation
6.ThetestsoftwareusedinthistestwillbedocumentedinthePQRPandreviewedintheReliabilityProgramPlanReview
Thegeneralrequirementsforthistestare:
∙Threesamplesboardswillbeinstrumentedandtested
∙Oneofthesampleswillincludereworkedcomponents
∙ThecomponentstobereworkedwillbeselectedintheKickoffmeeting
∙Testreportswillincludephotographsofthetestsampleswiththermocouplesattached
∙Thesephotographsofthetestsamples(withthermocouplesattached)andofthetestsamplesinstalledintheTestEnclosurewillbesuppliedtoDellreliabilityengineeringpriortostartofthistestprogram
∙Testsamplesaretestedanddatacollectedformultiplevaluesofchamberairtemperature:
30°C,35°C,40°C,45°C,50°C,55°C
∙Thetestsoftwareandtestroutinesusedinthesetestsshallbe:
∙IdentifiedanddocumentedinthePRQPandreviewedintheReliabilityProgramPlanReview
∙Selectedtoloadthetestsamplestorepresentbothnormalextendeduseandexpectedreasonableworstcaseusethermalstresses
∙ThesesampleswillbeusedlaterintheThermalDesignMarginTest
ThethermaltestdatafromthistaskisaprogramdeliverableandshallbedocumentedinareportsubmittedtoDellreliabilityengineeringforreviewandapproval.
4.4Thermal&ElectricalStressAnalysis
散熱和電氣應力分析
Thepurposeofthistaskistodetermineanddocumentthethermalandelectricalstresslevelsappliedtoeachcomponent.Thisisanengineeringanalysiswhichisperformedusingsomecombinationofthefollowing:
∙Analysisofschematicsandlogicdiagramsandintendeduse
∙Measurementsofappliedelectricalstresslevels
∙Measurementsofcomponentsurfacetemperatures
∙DatafromtheThermalProfileTest
∙Analysisofcomponentspecifications
Thisstressanalysisshallestimatecomponentstresslevelsforthefollowinguseconditions:
∙Reasonableworstcasestresscondition(combinationofoperationalenvironment,computercoolingairflowandapplicationsoftware)
∙ThisstressdatawillbeusedtoverifycompliancewithDell’sderatingrequirements
∙Nominalextendeduseenvironment
∙Thisdatawillbeusedtosupporttheassumptionsinthe(StressBasedReliabilityPrediction(MTBF))
ThePRQPshallidentifytheteammemberorcontractorselectedtoperformthisreliabilityanalyses.
ThisanalysisisaprogramdeliverableandshallbedocumentedinareportsubmittedtoDellreliab
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