电子计算机名词缩写.docx
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电子计算机名词缩写.docx
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电子计算机名词缩写
电子计算机名词缩写
1、CPU
3DNow!
(3Dnowaiting,无须等待的3D处理)
AAM(AMDAnalystMeeting,AMD分析家会议)
ABP(AdvancedBranchPrediction,高级分支预测)
ACG(AggressiveClockGating,主动时钟选择)
AIS(AlternateInstructionSet,交替指令集)
ALAT(advancedloadtable,高级载入表)
ALU(ArithmeticLogicUnit,算术逻辑单元)
Aluminum(铝)
AGU(AddressGenerationUnits,地址产成单元)
APC(AdvancedPowerControl,高级能源控制)
APIC(AdvancedrogrammableInterruptController,高级可编程中断控制器)
APS(AlternatePhaseShifting,交替相位跳转)
ASB(AdvancedSystemBuffering,高级系统缓冲)
ATC(AdvancedTransferCache,高级转移缓存)
ATD(AssemblyTechnologyDevelopment,装配技术发展)
BBUL(BumplessBuild-UpLayer,内建非凹凸层)
BGA(BallGridArray,球状网阵排列)
BHT(branchpredictiontable,分支预测表)
Bops(BillionOperationsPerSecond,10亿操作/秒)
BPU(BranchProcessingUnit,分支处理单元)
BP(BrachPediction,分支预测)
BSP(BootStrapProcessor,启动捆绑处理器)
BTAC(BranchTargetAddressCalculator,分支目标寻址计算器)
CBGA(CeramicBallGridArray,陶瓷球状网阵排列)
CDIP(CeramicDual-In-Line,陶瓷双重直线)
CenterProcessingUnitUtilization,中央处理器占用率
CFM(cubicfeetperminute,立方英尺/秒)
CMT(course-grainedmultithreading,过程消除多线程)
CMOS(ComplementaryMetalOxideSemiconductor,互补金属氧化物半导体)
CMOV(conditionalmoveinstruction,条件移动指令)
CISC(ComplexInstructionSetComputing,复杂指令集计算机)
CLK(ClockCycle,时钟周期)
CMP(on-chipmultiprocessor,片内多重处理)
CMS(CodeMorphingSoftware,代码变形软件)
co-CPU(cooperativeCPU,协处理器)
COB(Cacheonboard,板上集成缓存,做在CPU卡上的二级缓存,通常是内核的一半速度))
COD(CacheonDie,芯片内核集成缓存)
Copper(铜)
CPGA(CeramicPinGridArray,陶瓷针型栅格阵列)
CPI(cyclesperinstruction,周期/指令)
CPLD(ComplexProgrammableLogicDevice,复杂可程式化逻辑元件)
CPU(CenterProcessingUnit,中央处理器)
CRT(CooperativeRedundantThreads,协同多余线程)
CSP(ChipScalePackage,芯片比例封装)
CXT(ChoopereXTend,增强形K6-2内核,即K6-3)
DataForwarding(数据前送)
dB(decibel,分贝)
DCLK(DotClock,点时钟)
DCT(DRAMController,DRAM控制器)
DDT(DynamicDeferredTransaction,动态延期处理)
Decode(指令解码)
DIB(DualIndependentBus,双重独立总线)
DMT(DynamicMultithreadingArchitecture,动态多线程结构)
DP(DualProcessor,双处理器)
DSM(DedicatedStackManager,专门堆栈管理)
DSMT(DynamicSimultaneousMultithreading,动态同步多线程)
DST(DepletedSubstrateTransistor,衰竭型底层晶体管)
DTV(DualThresholdVoltage,双重极限电压)
DUV(DeepUltra-Violet,纵深紫外光)
EBGA(EnhancedBallGridArray,增强形球状网阵排列)
EBL(electronbeamlithography,电子束平版印刷)
EC(EmbeddedController,嵌入式控制器)
EDEC(EarlyDecode,早期解码)
EmbeddedChips(嵌入式)
EPA(edgepinarray,边缘针脚阵列)
EPF(EmbeddedProcessorForum,嵌入式处理器论坛)
EPL(electronprojectionlithography,电子发射平版印刷)
EPM(EnhancedPowerManagement,增强形能源管理)
EPIC(explicitlyparallelinstructioncode,并行指令代码)
EUV(ExtremeUltraViolet,紫外光)
EUV(extremeultravioletlithography,极端紫外平版印刷)
FADD(FloationgPointAddition,浮点加)
FBGA(Fine-PitchBallGridArray,精细倾斜球状网阵排列)
FBGA(flipchipBGA,轻型芯片BGA)
FC-BGA(Flip-ChipBallGridArray,反转芯片球形栅格阵列)
FC-LGA(Flip-ChipLandGridArray,反转接点栅格阵列)
FC-PGA(Flip-ChipPinGridArray,反转芯片针脚栅格阵列)
FDIV(FloationgPointDivide,浮点除)
FEMMS:
FastEntry/ExitMultimediaState,快速进入/退出多媒体状态
FFT(fastFouriertransform,快速热欧姆转换)
FGM(Fine-GrainedMultithreading,高级多线程)
FID(FID:
Frequencyidentify,频率鉴别号码)
FIFO(FirstInputFirstOutput,先入先出队列)
FISC(FastInstructionSetComputer,快速指令集计算机)
flip-chip(芯片反转)
FLOPs(FloatingPointOperationsPerSecond,浮点操作/秒)
FMT(fine-grainedmultithreading,纯消除多线程)
FMUL(FloationgPointMultiplication,浮点乘)
FPRs(floating-pointregisters,浮点寄存器)
FPU(FloatPointUnit,浮点运算单元)
FSUB(FloationgPointSubtraction,浮点减)
GFD(GoldfingerDevice,金手指超频设备)
GHC(GlobalHistoryCounter,通用历史计数器)
GTL(GunningTransceiverLogic,射电收发逻辑电路)
GVPP(GenericVisualPerceptionProcessor,常规视觉处理器)
HL-PBGA:
表面黏著,高耐热、轻薄型塑胶球状网阵封装
HTT(Hyper-ThreadingTechnology,超级线程技术)
Hz(hertz,赫兹,频率单位)
IA(IntelArchitecture,英特尔架构)
IAA(IntelApplicationAccelerator,英特尔应用程序加速器)
ICU(InstructionControlUnit,指令控制单元)
ID(identify,鉴别号码)
IDF(IntelDeveloperForum,英特尔开发者论坛)
IEU(IntegerExecutionUnits,整数执行单元)
IHS(IntegratedHeatSpreader,完整热量扩展)
ILP(InstructionLevelParallelism,指令级平行运算)
IMM:
IntelMobileModule,英特尔移动模块
InstructionsCache,指令缓存
InstructionColoring(指令分类)
IOPs(IntegerOperationsPerSecond,整数操作/秒)
IPC(InstructionsPerClockCycle,指令/时钟周期)
ISA(instructionsetarchitecture,指令集架构)
ISD(inbuiltspeed-throttlingdevice,内藏速度控制设备)
ITC(InstructionTraceCache,指令追踪缓存)
ITRS(InternationalTechnologyRoadmapforSemiconductors,国际半导体技术发展蓝图)
KNI(KatmaiNewInstructions,Katmai新指令集,即SSE)
Latency(潜伏期)
LDT(LightningDataTransport,闪电数据传输总线)
LFU(LegacyFunctionUnit,传统功能单元)
LGA(landgridarray,接点栅格阵列)
LN2(LiquidNitrogen,液氮)
LocalInterconnect(局域互连)
MAC(multiply-accumulate,累积乘法)
mBGA(MicroBallGridArray,微型球状网阵排列)
nm(namometer,十亿分之一米/毫微米)
MCA(machinecheckarchitecture,机器检查体系)
MCU(Micro-ControllerUnit,微控制器单元)
MCT(MemoryController,内存控制器)
MESI(Modified,Exclusive,Shared,Invalid:
修改、排除、共享、废弃)
MF(MicroOpsFusion,微指令合并)
mm(micronmetric,微米)
MMX(MultiMediaExtensions,多媒体扩展指令集)
MMU(MultimediaUnit,多媒体单元)
MMU(MemoryManagementUnit,内存管理单元)
MN(modelnumbers,型号数字)
MFLOPS(MillionFloationgPoint/Second,每秒百万个浮点操作)
MHz(megahertz,兆赫)
mil(PCB或晶片布局的长度单位,1mil=千分之一英寸)
MIPS(MillionInstructionPerSecond,百万条指令/秒)
MOESI(Modified,Owned,Exclusive,SharedorInvalid,修改、自有、排除、共享或无效)
MOF(MicroOpsFusion,微操作熔合)
Mops(MillionOperationsPerSecond,百万次操作/秒)
MP(Multi-Processing,多重处理器架构)
MPF(MicroprocessorForum,微处理器论坛)
MPU(MicroprocessorUnit,微处理器)
MPS(MultiProcessorSpecification,多重处理器规范)
MSRs(Model-SpecificRegisters,特别模块寄存器)
MSV(MultiprocessorSpecificationVersion,多处理器规范版本)
NAOC(no-accountOverClock,无效超频)
NI(Non-Intel,非英特尔)
NOP(nooperation,非操作指令)
NRE(Non-RecurringEngineeringcharge,非重复性工程费用)
OBGA(OrganicBallGridArral,有机球状网阵排列)
OCPL(OffCenterPartingLine,远离中心部分线队列)
OLGA(OrganicLandGridArray,有机平面网阵包装)
OoO(OutofOrder,乱序执行)
OPC(OpticalProximityCorrection,光学临近修正)
OPGA(OrganicPinGridArray,有机塑料针型栅格阵列)
OPN(OrderingPartNumber,分类零件号码)
PAT(PerformanceAccelerationTechnology,性能加速技术)
PBGA(PlasticPinBallGridArray,塑胶球状网阵排列)
PDIP(PlasticDual-In-Line,塑料双重直线)
PDP(ParallelDataProcessing,并行数据处理)
PGA(Pin-GridArray,引脚网格阵列),耗电大
PLCC(PlasticLeadedChipCarriers,塑料行间芯片运载)
Post-RISC(加速RISC,或后RISC)
PR(PerformanceRate,性能比率)
PIB(ProcessorInaBox,盒装处理器)
PM(Pseudo-Multithreading,假多线程)
PPGA(PlasticPinGridArray,塑胶针状网阵封装)
PQFP(PlasticQuadFlatPackage,塑料方块平面封装)
PSN(ProcessorSerialnumbers,处理器序列号)
QFP(QuadFlatPackage,方块平面封装)
QSPS(QuickStartPowerState,快速启动能源状态)
RAS(ReturnAddressStack,返回地址堆栈)
RAW(ReadafterWrite,写后读)
REE(RapidExecutionEngine,快速执行引擎)
RegisterContention(抢占寄存器)
RegisterPressure(寄存器不足)
RegisterRenaming(寄存器重命名)
Remark(芯片频率重标识)
Resourcecontention(资源冲突)
Retirement(指令引退)
RISC(ReducedInstructionSetComputing,精简指令集计算机)
ROB(Re-OrderBuffer,重排序缓冲区)
RSE(registerstackengine,寄存器堆栈引擎)
RTL(RegisterTransferLevel,暂存器转换层。
硬体描述语言的一种描述层次)
SC242(242-contactslotconnector,242脚金手指插槽连接器)
SE(SpecialEmbedded,特别嵌入式)
SEC(SingleEdgeConnector,单边连接器)
SECC(SingleEdgeContactCartridge,单边接触卡盒)
SEPP(SingleEdgeProcessorPackage,单边处理器封装)
Shallow-trenchisolation(浅槽隔离)
SIMD(SingleInstructionMultipleData,单指令多数据流)
SiO2F(FluoridedSiliconOxide,二氧氟化硅)
SMI(SystemManagementInterrupt,系统管理中断)
SMM(SystemManagementMode,系统管理模式)
SMP(SymmetricMulti-Processing,对称式多重处理架构)
SMT(Simultaneousmultithreading,同步多线程)
SOI(Silicon-on-insulator,绝缘体硅片)
SOIC(PlasticSmallOutline,塑料小型)
SONC(Systemonachip,系统集成芯片)
SPGA(StaggeredPinGridArray、交错式针状网阵封装)
SPEC(SystemPerformanceEvaluationCorporation,系统性能评估测试)
SQRT(SquareRootCalculations,平方根计算)
SRQ(SystemRequestQueue,系统请求队列)
SSE(StreamingSIMDExtensions,单一指令多数据流扩展)
SFF(SmallFormFactor,更小外形格局)
SS(SpecialSizing,特殊缩放)
SSP(Slipstreamprocessing,滑流处理)
SST(SpecialSizingTechniques,特殊筛分技术)
SSOP(ShrinkPlasticSmallOutline,缩短塑料小型)
STC(SpaceTimeComputing,空余时间计算)
Superscalar(超标量体系结构)
TAP(TestAccessPort,测试存取端口)
TBGA(TieBallGridArray,带状球形光栅阵列)
TCP:
TapeCarrierPackage(薄膜封装),发热小
TDP(ThermalDesignPower,热量设计功率)
Throughput(吞吐量)
TLB(TranslateLooksideBuffers,转换旁视缓冲器)
TLP(Thread-LevelParallelism,线程级并行)
TMP(ThreadedMulti-Path,线程多通道)
TPI(TruePerformanceInitiative/index,真实性能为先/指标)
TQFP(ThinPlasticQuadFlatPack,薄型方面平面封装)
Trc(RowCycleTime,列循环时间)
TrD(TransistorDensity,晶体管密度)
TSOP(ThinSmallOutlinePlastic,薄型小型塑料)
USWC(UncacheabledSpeculativeWriteCombination,无缓冲随机联合写操作)
VALU(VectorArithmeticLogicUnit,向量算术逻辑单元)
VFSD(VertexFrequencyStreamDivider,顶点频率流分隔)
VID(VID:
Voltageidentify,电压鉴别号码)
VLIW(VeryLongInstructionWord,超长指令字)
VPU(VectorPermutateUnit,向量排列单元)
VPU(vectorprocessingunits,向量处理单元,即处理MMX、SSE等SIMD指令的地方)
VSA(VirtualSystemArchitecture,虚拟系统架构)
VTF(VIATechnicalForum,威盛技术论坛)
XBar(Crossbar,交叉口闩仲载逻辑单元)
XP(Experience,体验)
XP(Extraperformance,额外性能)
XP(eXtremePerformance,极速性能)
散热器
TFT(TinyFinTechnology,微型鳍片技术)
2、主板
3GIO(ThirdGenerationInput/Output,第三代输入输出技术)
ACR(AdvancedCommunicationsRiser,高级通讯升级卡)
ADIMM(advancedDualIn-lineMemoryModules,高级双重内嵌式内存模块)
AGTL+(AssistedGunningTransceiverLogic,援助发射接收逻辑电路)
AHCI(AdvancedHostControllerInterface,高级主机控制器接口)
AIMM(AGPInlineMemoryModule,AGP板上内存升级模块)
AMR(Audio/ModemRiser;音效/调制解调器主机板附加直立插卡)
AHA(AcceleratedHubArchitecture,加速中心架构)
AOI(AutomaticOpticalInspection,自动光学检验)
APU(AudioProcessingUnit,音频处理单元)
ARF(AsynchronousReceiveFIFO,异步接收先入先出)
ASF(AlertStandardsForum,警告标准讨论)
ASKIR(AmplitudeShiftKeyedInfra-Red,长波形可移动输入红外线)
AT(AdvancedTechnology,先进技术)
ATX(ATExtend,扩展型AT)
BIOS(BasicInput/OutputSystem,基本输入/输出系统)
CNR(CommunicationandNetworkingRiser,通讯和网络升级卡)
CSA(CommunicationStreamingArchitecture,通讯流架构)
CSE(ConfigurationSpaceEnable,可分配空间)
COAST(Cache-on-a-stick,条状缓存)
DASP(DynamicAdaptiveSpecu
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