IC封装大全及世界各大品牌.docx
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- 上传时间:2022-12-10
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IC封装大全及世界各大品牌.docx
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IC封装大全及世界各大品牌
IC封装介绍
BGA
BallGridArray
EBGA680L
LBGA160L
PBGA217L
PlasticBallGridArray
SBGA192L
TSBGA680L
CLCC
CNR
CommunicationandNetworkingRiserSpecificationRevision1.2
CPGA
CeramicPinGridArray
DIP
DualInlinePackage
DIP-tab
DualInlinePackagewithMetalHeatsink
FBGA
FDIP
FTO220
FlatPack
HSOP28
ITO220
ITO3p
JLCC
LCC
LDCC
LGA
LQFP
PCDIP
PGA
PlasticPinGridArray
PLCC
PQFP
PSDIP
LQFP100L
METALQUAD100L
PQFP100L
QFP
QuadFlatPackage
SOT220
SOT223
SOT223
SOT23
SOT23/SOT323
SOT25/SOT353
SOT26/SOT363
SOT343
SOT523
SOT89
SOT89
Socket603
Foster
LAMINATETCSP20L
ChipScalePackage
TO252
TO263/TO268
SODIMM
SmallOutlineDualIn-lineMemoryModule
SOCKET370
Forintel370pinPGAPentiumIII&CeleronCPU
SOCKET423
Forintel423pinPGAPentium4CPU
SOCKET462/SOCKETA
ForPGAAMDAthlon&DuronCPU
SOCKET7
ForintelPentium&MMXPentiumCPU
QFP
QuadFlatPackage
TQFP100L
SBGA
SC-705L
SDIP
SIP
SingleInlinePackage
SO
SmallOutlinePackage
SOJ32L
SOPEIAJTYPEII14L
SOT220
SSOP16L
SSOP
TO18
TO220
TO247
TO264
TO3
TO5
TO52
TO71
TO72
TO78
TO8
TO92
TO93
TO99
TSOP
ThinSmallOutlinePackage
TSSOPorTSOPII
ThinShrinkOutlinePackage
uBGA
MicroBallGridArray
uBGA
MicroBallGridArray
ZIP
Zig-ZagInlinePackage
TEPBGA288L
TEPBGA288L
C-BendLead?
CERQUAD
CeramicQuadFlatPack
CeramicCase
LAMINATECSP112L
ChipScalePackage
GullWingLeads?
J-STD
J-STD
JointIPC/JEDECStandards
JEP
JEP
JEDECPublications
JESD
JESD
JEDECStandards
LLP8La
PCI32bit5V
PeripheralComponentInterconnect
PCI64bit3.3V
PeripheralComponentInterconnect
PCMCIA
PDIP
PLCC
PS/2
PS/2
mouseportpinout
SIMM30
SIMM30
Pinout
SIMM30
SingleIn-lineMemoryModule
SIMM72
SIMM72
Pinout
SIMM72
SingleIn-lineMemoryModule
SIMM72
SingleIn-lineMemoryModule
SLOT1
ForintelPentiumIIPentiumIII&CeleronCPU
SLOTA
ForAMDAthlonCPU
SNAPTK
SNAPTK
SNAPZP
SOH
ICBrand
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- 关 键 词:
- IC 封装 大全 世界 品牌
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