PCBA检验规范.docx
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PCBA检验规范.docx
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PCBA检验规范
PCBA检验规范
编号:
版本:
V1、0
生效日期:
1.修订情况表
修订历史
版本
说明
作者
审核
批准
生效日期
2.术语表
术语表
名称
说明
5、职责(RESPONSIBILITY)………………………………………………………………………、……………1
6、作业流程及内容(Flowchartandcontent)……………………………………………………………、、…、1
7、修订权限(AUTHORITYOFMODIFICATION)………………………………………………………………2
8、附件(ATTACHMENT)…………………………………………………………………………………………、2
8、1附件一(PCBA)……………………………………………………………………………………、、、4
8、2附件二(机构类)……………………………………………………………………………………、42
8、3附件三(其它)………………………………………………………………………………………、52
PCBA检验规范
1目得(Purpose)
建立产品外观目视检验标准,使产品检验之判定有所依循,同时藉由检验资料得回馈分析建立良好得workmanship,防止不良之发生、
Toestablishthestandardinspectionofproductcosmeticforoperationtofollow,andestablishwellworkmanshipbyfeedbackandanalyzingtheinspectiondocumenttovoidfailure、
2范围(Scope)
本规范适用于所有产品(含半成品及成品PCBA)得外观目视检验,包含自行生产制造之PCBA,委托外包生产制造之PCBA,以及外购入厂组立或单独包装出货之PCBA等、
Itfitsallproduct(containingproductandPCBA)appearanceinspection,includingPCBAmadebyselforbyotherpanyandother、
3名词解释(Wordsexplanation)
无(None)
4参考文件(Referencedocument)
ANS/IPC-A-610D
5职责(Responsibility)
5.1生产单位(Productionunit):
负责产品检验之执行、
Beresponsiblefordoingproductinspection
5.2质量管理部(Qualityunit):
负责产品规格之制定及产品品质之抽样检验管制
Beresponsibleformakingproductspecificationandcontrollingthespotcheckofproductquality
6作业流程及内容(Flowchartandcontent)
6、1检验前得准备(preparationforinspecting):
检验前须先确认所使用得工具,材料,胶,清洁剂等,就是否合乎规定、检验PCBA时必须配戴防静电手套或防静电手环,而成品有外壳部分则不在此限、
Beforeinspecting,besureofthetool,material,glue,cleanser,etc、OperatorshouldhavewriststraporelectrostaticgloveforpreventionESD(ElectronicstaticDischarge),butthefinishedgoodwith。
6、2
若有检验标准未规范得异常现象发生时,不代表该产品允收或拒收,应向值班工程师询问。
Itisnotmeanstheproductacceptorrejectthatthestandardofinspectionhavesomeabnormal,butshouldfeedbacktoengineertoconfirm、
6、3
检验环境要求光线充足,以目视为主,辅以放大镜与卡尺
6、4
外观检验项目基准参见附件一~三。
TheitemofcosmeticinspectionstandardreferenceAppendix1to3、
7修订权限(Authorityofmodification)
本规范由质量管理部工程师撰写,经研发单位及生产单位会签,由质量管理部最高主管核准后实施,修改程序亦同、
ThiscriteriaispreparedbyQualityunitengineerandsignedoffwithR&D(ResearchandDevelopdepartment)andProductionunit,andthenapprovebyQualitymanager、Modifyprocedureasthesameabove、
8附件Attachment(含记录表单)
8、1附件一:
PCBA
Appendix1:
PCBA
8、2附件二:
机构类
Appendix2:
Mechanical
8、3附件三:
其它
Appendix3:
Other
附件预览总表
附件一:
PCBA类
附件二:
机构类(Mechanical)
附件三:
其它(Other)
1SMT零件(SMTponent)
1-1焊点规格(Soldering
SPEC)
1-2焊点异常(Soldering
abnormal)
1-3零件损坏(ponent
damage)
1-4点胶(Stakingadhesive
gluing)
1外壳(Housing)
1标签(Label)
2托架,承座(Chassis)
2Barcode
3铭板(Overlay)
3包装袋(PEbag)
4散热片(Heatsink)
4外箱(Carton)
5绝缘片(Insulator)
5Housing
6螺丝,螺帽,垫片(Screwnut)
7DCseriesconverter系列成品外观检验标准
2Dip零件(DIPponent)
2-1焊点规格(DIPSPEC)
2-2引脚突出(Leadprotrusion)
2-3通孔(PTH)
2-4插件外观(Appearance)
2-5点胶(Adhesivegluing)
2-6DIP高翘(DIPponent
lifted)
8Transformer
9Shieldingcover外观检验标准
6PCB
3-1marking
3-2外观(Surface
appearance)
3-3焊锡性(Solderability)
7Connector,PIN&金手
指(Goldenfinger)
8其它(Other)
5-1螺丝(Screw)
5-2跳线(Jump)
附件一:
PCBA类
1SMT零件(SMTponent)
1-1焊点规格(SolderingSPEC)
1-1-1Chip零件(Chipponent)
Defect
Sideoverhang(D)isgreaterthan50%ponentterminationwidth(W)or50%landwidth(P)whicheverisless
零件偏移D>50%W或D>50%P拒收
Defect
Sideoverhang(D)isgreaterthan50%ponentterminationwidth(W)or50%landwidth(P)whicheverisless
零件偏移D>50%W或D>50%P拒收
Defect
Anyendoverhang(B)
零件超出pad拒收
Defect
ponentinreservedtolacquertogotocircuittoformashortcircuit
零件在有保护漆之线路上造成短路拒收
Acceptable
Endjointwidth(C)isminimum50%ofponentterminationwidth(W)or50%landwidth(P)whicheverisless
零件焊点宽度C>50%WorC>50%P允收
Acceptable
Maximumfilletheight(E)mayoverhangthelendorextendontotheoftheendcapmetallization,butnotextendfurtherontotheponentbody
锡高超过金属端,但未延伸至零件本体允收
Defect
Solderfilletextendsontotheponentbody
锡延伸到零件本体上拒收
Defect
Minimumfillethigh(F)islessthan25%terminationhigh(H),orfillethigh(F)islessthan0、5mm
Highvoltagecapacitanceminimumfillethigh(F)islessthan50%terminationhigh(H),orfillethigh(F)islessthan0、75mm
爬锡高度F<25%H或F<0、5mm拒收
高压电容爬锡高度F<50%H或F<0、75mm拒收
Defect
Insufficientsolder
锡不足拒收
Defect
Insufficientendoverlap
空焊拒收
1-1-2圆柱体零件(CylindricalEndCapTermination)
Defect
Sideoverhang(A)isgreaterthan50%ofponentdiameter,(W),orlandwidth(P),whicheverisless
零件直径突出A>50%Wor>50%P、拒收
Defect
Anyendoverhang(B)
零件超出pad拒收
Acceptable
Endjointwidth(C)isminimum50%ponentdiameter(W)orlandwidth(P),whicheverisless
零件连接直径宽度C≧50%Wor50%P允收
Acceptable
Sidejointlength(D)isminimum50%lengthofponenttermination(T)orlandlength(S),whicheverisless
侧面焊点长度D≧50%Tor50%S允收
Defect
Solderfilletextendsontotheponentbody
锡延伸到零件本体上拒收
Acceptable
Minimumfilletheitht(F)issolderthickness(G)plus25%diameter(W)oftheponentendcap
焊锡高度F≧25%(G+W)允收
Acceptable
Endoverlap(J)betweentheponentterminationandthelandisminimum50%thelengthoftheponenttermination(T)
零件末端与PAD重叠部分J≧50%T允收
Defect
Endoverlap(J)islessthan50%ofthelengthofponent
零件末端与PAD重叠部分J<50%T拒收
1-1-3Leadlesschip
Defect
Sideoverhang(A)exceeds50%castellationwidth(W)
侧面偏移A>50%W拒收
Defect
Endjointwidth(C)islessthan50%castellationwidth(W)
零件末端焊点宽度C<50%W拒收
Defect
Minimumsidejointlength(D)islessthan50%minimumfilletheight(F)orlandlengthexternaltopackage(S),whicheverisless
零件末端焊点长度D<50%S或50%F拒收
Defect
Minimumfilletheight(F)is25%castellationheight(H)
焊锡高度F<25%H拒收
Defect
Anyendoverhang(B)
零件超出pad拒收
Defect
Minimumfilletheight(F)is25%castellationheight(H)
焊锡高度F<25%H拒收
1-1-4扁平、L型与翼型引脚(FlatRibbon,L,andGullWingLeads)
Acceptable
Maximumoverhang(A)isnotgreaterthan50%leadwidth(W)
侧面偏移A≦50%W允收
Defect
Sideoverhang(A)isgreaterthan50%leadwidth(W)
侧面偏移A>50%W拒收
Defect
Minimumendjointwidth(C)isless50%leadWidth(W)
焊点宽度C<50%W拒收
Defect
Sidejointlength(D)islessthan80%ofleadlength(L)
焊锡长度D<4/5L拒收
Defect
Soldertouchesthebodyorendsealofhigh-leadconfigurationponent
焊锡延伸至零件本体上或封装末端拒收
Acceptable
爬锡高度:
Fillet接触到正面吃锡面允收
Defect
Soldertouchespackagebody
锡延伸到零件本体上拒收
Acceptable
Transformerhighvoltagepin’ssolderisovertheAcornerportion,butexnofunctionpin(forallinverters,exceptspecialcase)
变压器高压Pin吃锡度已达到A处(第一弯角处)允收
Acceptable
SolderisovertheBportion(forallinverters,exceptspecialcase)
吃锡度超出B处允收
Defect
SolderisalreadyovertheBportion,andbobbinhadBeendamagedbyiron、
Bobbin被烙铁烫伤拒收
Defect
Minimumheelfilletheight(F)islessthan25%leadthickness(T)
焊锡高度F<25%T拒收
Defect
Sideoverhang(A)isgreaterthan50%leadwidth/diameter(W)
零件偏移A>50%W拒收
Defect
Minimumendjointwidth(C)islessthan50%leadwidth/diameter(W)
焊锡宽度C<50%W拒收
Defect
Sidejointlength(D)islessthan80%leadlength
焊锡长度D小于4/5引脚长度拒收
Defect
Soldertouchesthepackageorendseal
焊锡延伸至零件本体上或封装末端拒收
Defect
Minimumsidejointheight(Q)islessthansolderthickness(G)plus50%diameter(W)ofroundleador50%thicknessofleadatjointside(T)forcoinedlead
焊锡高度Q 1-1-6J形引脚(JLeads) Defect Sideoverhang(A)isgreaterthan50%W 偏移宽度A>50%W拒收 Acceptable Minimumendjointwidth(C)is50%leadwidth(W) 焊锡宽度C≧50%W允收 Defect Sidejointfillet(D)lessthan150%leadwidth 焊锡宽度(D)小于150%引脚宽度(W)拒收 Defect Solderfillettouchespackagebody 焊锡延伸至零件本体上拒收 1-1-7I形引脚(Butt/IJoints) Defect Anytoeoverhang(B) 侧边突出拒收 Defect Endjointwidth(C)islessthan75%leadwidth(W) 焊锡宽度C<75%W拒收 Defect Soldertouchespackagebody 焊锡延伸至零件本体上拒收 Defect Filletheight(F)islessthan0、5mm[0、02inch] 焊锡高度(F)小于0、5mm拒收 1-1-8向内L型引脚(InwardformedL-shapedribbonleads) Defect Endjointwidth(C)islessthan50%leadwith(W) Sideoverhang(A)isgreaterthan50%W Minimumfilletheight(F)islessthan25%E 焊锡宽度C<50%W拒收 偏移宽度A>50%W拒收 焊锡高度F<25%拒收 Acceptable Minimumendjointwidth(C)isgreaterthan50%leadwith(W) 焊锡宽度C≧50%W允收 1-1-9BGA零件(Areaarray/Ballgridarray) Defect Morethan50%overhang 偏移50%拒收 Defect Solderbridge 锡桥拒收 DarkspotsinX-Rayviewthebridgebetweensolderjoints 在X-Ray下焊点间桥接或拒收 Solderopen 锡散开拒收 Missingsolder 漏锡拒收 Solderball(S)thatbridgemorethan25%ofthedistancebetweentheleads 锡珠超出焊点间距25%拒收 Defect Fracturesolderconnection 锡裂拒收 1-2焊点异常(Solderingabnormal) 1-2-1侧立(Mountingonside) Defect Chipresistancemountingonside 电阻侧立拒收 Acceptable Chipcapacitance&Inductanceminimumtypeislessthan1206,mountingonsideandnomorethanfive(5)chiponeachassemblyaremountedsideways 电容,电感类零件小于1206(含)以下,且单面少于5pcs允收 1-2-2翻件(Mountingupsidedown) Acceptable ElementofchipponentwithexposeddepositedelectricalElementismountedtowardboard 能导通允收 1-2-3墓碑(Tombstone) Defect Chipponentstandingontheirterminalend(Tombstone) 墓碑拒收 1-2-4共平面(Coplanarity) Defect Oneleadorseriesofleadsonponentisoutalignmentandfailstomakepropercontactwiththeland 零件得一个或多个引脚变形,不能与pad正常接触拒收 1-2-5锡未完全熔化(Reflownotplete) Defect Inpletereflowofsolderpaste 锡未完全熔化拒收 1-2-6空焊(Nonwetting) Defect Solderhasnotwettedtothelandortermination
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