三电子组装精品文档17页.docx
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三电子组装精品文档17页.docx
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三电子组装精品文档17页
三、电子组装(Assembly)
IPC-T-50FTermsandDefinitionforInterconnectingandPackagingElectronicCircuits电子电路互连与封装的定义和术语
IPC-S-100StandardsandSpecificationsManual标准和详细说明汇编手册
IPC-E-500IPCElectronicDocumentCollection已出版的IPC标准电子文档资料合订本
IPC-TM-650TestMethodsManual试验方法手册
IPC-ESD-20-20AssociationStandardfortheDevelopmentofanESDControlProgram静电释放控制过程(由静电释放协会制定)
IPC/EIAJ-STD-001CRequirementsforSolderedElectrical&ElectronicAssemblies电气与电子组装件锡焊要求
IPC-HDBK-001HandbookandGuidetoSupplementJ-STD-001—IncludesAmendment1J-STD-001辅助手册及指南及修改说明1
IPC-A-610CAcceptabilityofElectronicAssemblies印制板组装件验收条件
IPC-HDBK-610HandbookandGuidetoIPC-A-610(IncludesIPC-A-610BtoCComparisonIPC-610手册和指南(包括IPC-A-610B和C的对比)
IPC-EA-100-KElectronicAssemblyReferenceSet电子组装成套手册,包括:
IPC/EIAJ-STD-001C,IPC-HDBK-001,IPC-A-610C。
IPC/WHMA-A-620RequirementsandAcceptanceforCableandWireHarnessAssemblies电缆和引线贴装的要求和验收
IPC/EIAJ-STD-012ImplementationofFlipChipandChipScaleTechnology倒装芯片及芯片级封装技术的应用
IPC-SM-784GuidelinesforChip-on-BoardTechnologyImplementation芯片直装技术实施导则
IPC/EIAJ-STD-026SemiconductorDesignStandardforFlipChipApplications倒装芯片用半导体设计标准
J-STD-027MechanicalOutlineStandardforFlipChipandChipSizeConfigurationsFC(倒装片)和CSP(芯片级封装)的外形轮廓标准
IPC/EIAJ-STD-028PerformanceStandardforConstructionofFlipChipandChipScaleBumps倒装芯片及芯片级凸块结构的性能标准
SMC-WP-003ChipMountingTechnology芯片贴装技术
J-STD-013ImplementationofBallGridArrayandOtherHighDensityTechnology球栅阵列(BGA)及其它高密度封装技术的应用
IPC-7095DesignandAssemblyProcessImplementationforBGAs球栅阵列的设计与组装过程的实施
IPC/EIAJ-STD-032PerformanceStandardforBallGridArrayBallsBGA球形凸点的标准规范
IT-98000JPLChipScalePackagingGuidelinesJPL发布的CSP导则注:
IT(TheCaliforniaInstituteofTechnology)JPL(TheJetPropulsionLaboratory)
IT-98080JPLBallGridArrayPackagingGuidelinesJPL发布的BGA封装导则
IT-98093ITRIChipCarrier,Phase1ReportITRI关于芯片载体的报告ITRI(TheInterconnectTechnologyResearchInstitute)
IPC-MC-790GuidelinesforMultichipModuleTechnologyUtilization多芯片组件技术应用导则
IPC-M-108CleaningGuidesandHandbookManual清洗导则和手册
IPC-TP-1113CircuitBoardIonicCleanlinessMeasurement:
WhatDoesItTellUs?
电路板离子洁净度测量:
它告诉我们什么?
IPC-CH-65AGuidelinesforCleaningofPrintedBoards&Assemblies印制板及组装件清洗导则
IPC-SC-60APostSolderSolventCleaningHandbook锡焊后溶剂清洗手册
IPC-SA-61PostSolderSemi-aqueousCleaningHandbook锡焊后半水溶剂清洗手册
IPC-AC-62AAqueousPostSolderCleaningHandbook锡焊后水溶液清洗手册
IPC-TR-476AElectrochemicalMigration:
ElectricallyInducedFailuresinPrintedCircuitAssemblies电化学迁移:
印制电路组件的电气诱发故障
IPC-TR-580CleaningandCleanlinessTestProgramPhase1TestResults清洗及清洁度试验计划1阶段试验结果
IPC-TR-582CleaningandCleanlinessTestProgramfor:
Phase3--LowSolids,FluxesandPastesProcessedinAmbientAirIPC第3阶段非清洗助焊剂研究
IPC-TR-583AnIn-DepthLookAtIonicCleanlinessTesting深入离子洁净度测试
IPC-9201SurfaceInsulationResistanceHandbook表面绝缘电阻手册
IPC-TP-104KCleaning&CleanlinessTestProgram,Phase3WaterSolubleFluxes,Part1&Part2第3阶段水溶性助焊剂清洗,第一和第二部分
IPC-M-109ComponentHandlingManual元件处理手册
IPC/JEDECJ-STD-020BMoisture/ReflowSensitivityClassificationforNonhermeticSolidStateSurfaceMountDevices非密封固态表面贴装器件湿度/再流焊敏感度分类
IPC/JEDECJ-STD-033AHandling,Packing,ShippingandUseofMoisture/ReflowSensitiveSurfaceMountDevices对湿度、再流焊敏感表面贴装器件的处置、包装、发运和使用
IPC/JEDECJ-STD-035AcousticMicroscopyforNon-HermeticEncapsulatedElectronicComponents非气密封装电子元件用声波显微镜
IPC-9500-KSetoffourdocuments9501-95049501至9504手册合订本
IPC-DRM-18FComponentIdentificationDeskReferenceManual零件分类标识手册
IPC-DRM-SMT-CSurfaceMountSolderJointEvaluationDeskReferenceManual接插件焊接点评价手册
IPC-DRM-40EThrough-HoleSolderJointEvaluationDeskReferenceManual接插件焊接点评价手册
IPC-DRM-56WirePreparation&CrimpingDeskReferenceManual导线和端子预成形参考手册
IPC-DRM-53IntroductiontoElectronicsAssemblyDeskReferenceManual电子组装基础介绍手册
IPC-M-103StandardsforSurfaceMountAssembliesManual所有SMT标准合订本
IPC-M-104StandardsforPrintedBoardAssemblyManual10种常用印制板组装标准合订本
IPC-TA-722TechnologyAssessmentofSoldering锡焊技术精选手册
IPC-TA-723TechnologyAssessmentHandbookonSurfaceMounting表面安装技术精选手册
IPC-TA-724TechnologyAssessmentSeriesonCleanRooms清洁室技术精选系列
IPC-SM-780ComponentPackagingandInterconnectingwithEmphasisonSurfaceMounting以表面安装为主的元件封装及互连导则
IPC-SM-785GuidelinesforAcceleratedReliabilityTestingofSurfaceMountAttachments表面安装焊接件加速可靠性试验导则
IPC-PD-335ElectronicPackagingHandbook电子封装手册
IPC-7525StencilDesignGuidelines网版设计导则
IPC-TR-581IPCPhaseIIIControlledAtmosphereSolderingStudyIPC第3阶段受控气氛焊接研究
IPC-MI-660IncomingInspectionofRawMaterialsManual原材料接收检验手册
IPC/EIAJ-STD-004RequirementsforSolderingFluxes-IncludesAmendment1锡焊焊剂要求(包括修改单1)
IPC/EIAJ-STD-005RequirementsforSolderingPastes-IncludesAmendment1焊膏技术要求(包括修改单1)
IPC-HDBK-005GuidetoSolderPasteAssessment焊膏性能评价手册
IPC/EIAJ-STD-006ARequirementsforElectronicGradeSolderAlloysandFluxedandNon-FluxedSolidSolders电子设备用电子级锡焊合金、带焊剂及不带剂整体焊料技术要求
IPC-SM-817GeneralRequirementsforDielectricSurfaceMountingAdhesives表面安装用介电粘接剂通用要求
IPC-CA-821GeneralRequirementsforThermallyConductiveAdhesives导热胶粘剂通用要求
IPC-3406GuidelinesforElectricallyConductiveSurfaceMountAdhesives表面贴装导电胶使用指南
IPC-3408GeneralRequirementsforAnisotropicallyConductiveAdhesivesFilms各向异性导电胶膜的一般要求
IPC-CC-830BQualificationandPerformanceofElectricalInsulatingCompoundforPrintedWiringAssemblies印制板组装电气绝缘性能和质量手册
IPC-HDBK-830GuidelineforDesign,SelectionandApplicationofConformalCoatings敷形涂层的设计,选择和应用手册
IPC-SM-840CQualificationandPerformanceofPermanentSolderMask-IncludesAmendment1永久性阻焊剂的鉴定及性能(包括修改单1)
IPC-HDBK-840GuidetoSolderPasteAssessment焊膏性能评价手册
IPC-TP-1114TheLayman’sGuidetoQualifyingaProcesstoJ-STD-001基于J-STD-001组装工艺雷氏选择法
IPC-TR-467SupportingData&NumericalExamplesforJ-STD-001(ControlofFluxes)J-STD-001(焊剂控制)的支持数据及数字实例
IPC-AJ-820Assembly&JoiningHandbook装联手册
IPC-7530GuidelinesforTemperatureProfilingforMassSoldering(Reflow&Wave)Processes大规模焊接(回流焊与波峰焊)过程温度曲线指南
IPC-9701PerformanceTestMethodsandQualificationRequirementsforSurfaceMountSolderAttachments表面安装锡焊件性能试验方法与鉴定要求
IPC-TP-1090TheLayman’sGuidetoQualifyingNewFluxes新型助焊剂雷氏选择法
IPC-TP-1115SelectionandImplementationStrategyforaLow-ResidueNo-CleanProcess低残留不清洗工艺的选择和实施
IPC-S-816SMTProcessGuideline&Checklist表面安装技术过程导则及检核表
IPC-TR-460ATrouble-ShootingChecklistforWaveSolderingPrintedWiringBoards印制板波峰焊故障排除检查表
IPC-CM-770DComponentMountingGuidelinesforPrintedBoards印制板元件安装导则
IPC-7912CalculationofDPMO&ManufacturingIndicesforPrintedBoardAssemblies印制板和电子组装件每百万件缺陷数(DPMO)和制造指数的计算
IPC-9261In-ProcessDPMOandEstimatedYieldforPWAs印制板组装过程中每百万件缺陷数(DPMO)及合格率估计
IPC-9501PWBAssemblyProcessSimulationforEvaluationofElectronicComponents电子元件的印制板组装过程模拟评价
IPC-9502PWBAssemblySolderingProcessGuidelineforElectronicComponents电子元件的印制板组装焊接过导则
IPC-9503MoistureSensitivityClassificationforNon-ICComponents非集成电路元件的湿度敏感度分级
IPC-9504AssemblyProcessSimulationforEvaluationofNon-ICComponents(PreconditioningNon-ICComponents)非集成电路元件的组装过程模拟评价(非集成电路元件预处理)
IPC-9850-KSurfaceMountPlacementEquipmentCharacterization-KIT表面贴装设备性能检测方法的描述(附Gerber格式CD盘)
IPC-9850-TM-KW,IPC-9850-TM-KTestMaterialsKitforSurfaceMountPlacementEquipmentStandardization表面贴装设备性能测试用的标准工具包•
IPC-9850PlacementAccuracyVerificationPanels•1IPC-9850CMMMeasurementVerificationPanels•
IPC-9850QFP-100GlassComponents•130IPC-9850QFP-208GlassComponents•150IPC-9850BGA-228GlassComponents•NISTTraceableMeasurementCertificate•CustomStorageCase
IPC-7711/217711&7721Package合订本
IPC-7711ReworkofElectronicAssemblies电子组装件的返工
IPC-7721RepairandModificationofPrintedBoardsandElectronicAssemblies印制板和电子组装件的修复与修正
IPC/EIAJ-STD-002BSolderabilityTestsforComponentLeads,Terminations,Lugs,TerminalsandWires元件引线、端子、焊片、接线柱及导线可焊性试验
IPC/EIAJ-STD-003SolderabilityTestsforPrintedBoards印制板可焊性试验
IPC-TR-461Trouble-ShootingChecklistforWaveSolderingPrintedWiringBoards印制板波峰焊故障排除检查表
IPC-TR-462SolderabilityEvaluationofPrintedBoardswithProtectiveCoatingsOverLong-termStorage带保护性涂层印制板长期贮存的可焊性评价
IPC-TR-464AcceleratedAgingforSolderabilityEvaluations可焊性加速老化评价(附修订)
IPC-TR-465-1RoundRobinTestonSteamAgerTemperatureControlStability蒸汽老化器温度控制稳定性联合试验
IPC-TR-465-2TheEffectofSteamAgingTimeandTemperatureonSolderabilityTestResults蒸汽老化时间与温度对可焊性试验结果的影响
IPC-TR-465-3EvaluationofSteamAgingonAlternativeFinishes,PhaseIIA替代涂覆层的蒸汽老化评价
IPC-TR-466TechnicalReport:
WettingBalanceStandardWeightComparisonTest技术报告:
润湿天平称重标准对比测试
SMC-WP-001SolderingCapabilityWhitePaperReport可焊性工艺导论
SMC-WP-005PCBSurfaceFinishes印制电路板表面清洗
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