IGBT模块应用中的寿命和可靠性.docx
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IGBT模块应用中的寿命和可靠性.docx
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IGBT模块应用中的寿命和可靠性
IGBT模块应用中的寿命和可靠性
系统寿命与可靠性关系:
可靠性:
产品在一定条件下无故障完成规定功能的能力或可能性
IGBT模块的失效模式:
功率周次Powercycling:
功率周次用于评估绑定线和Die焊层的机械寿命
Powercyclingcanestimatethebondingwireanddiesolder’slifetime
测试方法:
加载自加热,周期≤3秒,测试ΔTvj
Testmethod:
Selfheatingbyload,T_cycle≤3seconds,measureΔTvj
失效判据:
饱和压降Vcesat增大+5%
Failurecriteria:
Vcesatincreasemorethan5%
温度周次Thermalcycling
温度周次用于评估DCB下焊接层的寿命
ThermalcyclingcanestimateDCBsolder’slifetime
测试方法:
通电加热,周期5分钟,测量ΔTc
Testmethod:
Selfheatingbyload,5min/,measureΔTc
失效判据:
热阻Rthjc增大+20%
Failurecriteria:
R_thjcincrease20%
失效机理是两种材料不同的膨胀系数
(Differentmaterial’sCTE)[ppm/K]
不同应用下IGBT模块的寿命
LifetimeofIGBTmoduleindifferentapplication
Therearemanyapplicationsandsimilartypesofpowermodules.
Mainobjectiveis:
howtoselectanactivedeviceinordertoreachdesiredsystemlifetime?
Isitpossibletohavepowermodulesuitingtoallapplications?
由周期内系统工况变化获得温度变化
Getthetemperatureprofilebypowerprofileinacycle
温度变化导致的失效模式
FailuremodeswithΔT
Therearetwokeyfactorsintheselectionoftheappropriatepowermodule:
1)thermal:
Tvjop 2)reliability: wearoutmechanismswhichdeterminemodulelifetimeasresultofmodule reliabilitycurvesandthermalstresses Note: RBSOAandotherelectricalphenomenaarenotcoveredinthepresentation. Factorsandimpacts: 1)TjFWDmax≤Tvjop TjIGBTmax≤Tviop NowadaysTvjop=150°C 2)DTjFWD&DTjIGBTrefertoPowerCyclingreliabilitycurves ΔTCreferstoThermalCyclingreliabilitycurves Reliabilitycurvesarealwaysgivenbypowermodulemanufacturer 绑定线老化——功率周次曲线 Bondwiredegradation–PCcurve 功率周次曲线修正因数 PCcurvecorrectionfactor 基板焊层老化——热循环曲线 Solderonbaseplatedegradation–TCcurve 功率温度循环(PC)次数评估计算 No.ofcycleestimationcalculationwithPowercyclingcurve 实例: 稳态周期系统的寿命估算 Simplemissioncycle--exampleoflifetimeestimation Forrelativesimplemissioncyclesthemodulelifetimebasedonthethreepresentedreliability curvesandpowerlossesconvertedintoajunctionandcasetemperatureswingcanbeeasily estimated.PrimePACK™moduleinuse: FF900R12IP4D 实例: 稳态周期系统的寿命估算 Simplemissioncycle--exampleoflifetimeestimation Questionfromlastpage: howtoestimatethepowermodulelifetimeunderthemissioncycle, hastoberepeatedagain.Let’scalculatethemodulewearoutasafunctionofmissioncycleandtime. Finallifetimemoduleestimation: wearout/year=0,3%+5.8%+4,38ppm+8,76ppm≌6.1% Asreliabilitycurvesaregivenfor100%lifetimethemodulecanworkintheexampleapplication for: 100%/6.1%≌16.4years Note: ThesecalculationsaremadeforIGBTonly.FWDhastobecalculatedseparately. 动态负载周期的寿命估算方法 Dynamicloadcycle–lifetimeestimate MatlabcalculateslossesforgivennumberoftheloadcyclesandappliesthemtothethermalnetworksspecificforselectedmoduleinSimulink.AsaresultthejunctiontemperatureprofileforIGBT,Diodeandtheprofileofthesoldertemperatureisobtained. Inthatcase,thesimulationwillbestopped.Overthegraphtheinformationsays,whichelementhashighertemperaturethanallowed.Ifitsbelow.. 雨流计数法---随机负载谱转化为变幅或恒幅的负载谱 •把负载变化周次种类减少 •根据有限的试验数据推算整个寿命周期的变化规律,获得典型谱 Fromthetemperatureprofileanalysisthelifetime(andwearofthelifetimein%)foreachelementandsolderwillbecalculated.ThegraphswillshowthelifetimewearforeachdeltaT.Thesumofthepercentsiscalculatedandalsoshownonthegraph. IGBT4模块的性能提升 HighperformanceofIGBT4module IGBT4模块的150度最高允许工作结温,源于内部焊线工艺的改进,使其可靠性指标-功率周次(PC)数大幅增加! 铜绑定线CopperBondingWire--EconoDUAL™3600A 真正实现EconoDUAL™3最大输出电流能力 ---@TC=100°C,Tvj=175°C 降低引线电阻RCC‘EE‘ 保证功率周次,满足风力发电,电动汽车需求 提供焊接/PressFIT两种兼容版本 提供650V,1200V,1700VIGBT4全系列,便于现有设计的功率升级 PressFIT端子压接技术 Press+FIT=PressFIT PressFITTechnology 无铅以达到RoHS环保要求 简易无焊接安装节约生产组装的成本和时间 高可靠性减少工人焊接端子中失误导致的过温和静电损坏 可靠性已在多个高端客户的产品中得到验证 超声波焊接的功率端子Ultrasonicweldedterminals 功率端子采用超声波焊接 Internalterminalconnectionsultrasonicwelded -可增加模块端子的鲁棒性Increasedmechanicalrobustness -可增加模块端子电流通过能力Higherterminalcurrentspossible -无焊料可增加热传导能力maximumtemperatureevenreduced 已应用在以下的模块封装中: PrimePACK,IHM-BTractionseries,EconoPACK™4 模块基板和衬底材料的选择以提高温度周次
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