世界半导体生产机台安全设计验收标准.docx
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世界半导体生产机台安全设计验收标准.docx
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世界半导体生产机台安全设计验收标准
世界半导体生产机台安全设计验收标准
精品汇编资料
GlobalSemiconductorSafetyServices,LLC
SEMIS2-93AProductSafetyAssessment
FinalReport
世界半导体生产机台安全设计验收标准
AppliedMaterials
ChemicalMechanicalPolishingSystem
Model:
MirraTrak
CMP工艺应用材料
June19,1998
Preparedfor:
AppliedMaterials
3111CoronadoDrive
SantaClara,CA95054
Preparedby:
GlobalSemiconductorSafetyServices,LLC
1313GenevaDrive
Sunnyvale,CA94089
GS3JobNo.980029
GS3DocumentNo.980029F2
Client-Confidential
保密合约
TheinformationusedtopreparethisreportwasbasedoninterviewswithAppliedMaterials’engineers.TheinformationwasalsobasedoninspectionsoftheChemicalMechanicalPolishingSystem,Model:
MirraTrak.ThisinformationwasgatheredovertheperiodbetweenFebruary2,1998andFebruary4,1998,andduringare-inspectionofthesystemonJune3,1998.ApreliminaryassessmentofthesystemwasalsoperformedonSeptember25,1996throughSeptember26,1996andtheresultsofthisevaluationwerealsoused.AllobservationsandrecommendationsarebasedonconditionsanddescriptionsoftheChemicalMechanicalPolishingSystem,Model:
MirraTrak,duringthetimeofdatacollectionanduponinformationmadeavailabletoGlobalSemiconductorSafetyServices.Thisreport'ssignificanceissubjecttotheadequacyandrepresentativecharacteristicsoftheChemicalMechanicalPolishingSystem,Model:
MirraTrak,andtothecomprehensivenessofthetests,examinationsand/orsurveysmade.
ReferencetoGlobalSemiconductorSafetyServices,includingreproductionofGlobalSemiconductorSafetyServices’servicemark,inpromotionalmaterials,ispermittedonlywithGlobalSemiconductorSafetyServices’expresswrittenconsent.
Theserviceperformedhasbeenconductedinaccordancewiththestandardscurrentlyacceptedinourprofession,andatthehighlevelofskillandcareexercisedbyGlobalSemiconductorSafetyServices’staff.
Lastly,thisreporthasbeenpreparedasaClient-Confidentialdocument,intendedfortheexclusiveuseofAppliedMaterialsandforthepurposeofdocumentationtoSEMIS2-93A.Therefore,nooutsidedistributionwilloccurunlesswrittenauthorizationisprovidedbytheclient.
TABLEOFCONTENTS
SectionPageNo.
SectionMANAGEMENTSUMMARY(管理摘要)
SectionSCOPE(范围)
SectionSYSTEMDESCRIPTION(系统描述)
SectionASSESSMENT&TESTINGMETHODOLOGIES(试验方法)
SectionSAFETYASSESSMENT(安全评估)
PURPOSE(目的)
SCOPE(适用范围)
SAFETYPHILOSOPHY(安全体系)
GENERALGUIDELINES(指导方针)
SAFETY-RELATEDINTERLOCKS(安全互锁)
CHEMICALS(化学品)
IONIZINGRADIATION
NON-IONIZINGRADIATION
NOISE(噪音)
VENTILATIONANDEXHAUST(通风与排凤)
ELECTRICAL
EMERGENCYSHUTDOWN(紧急停机)
HEATEDCHEMICALBATHS
HUMANFACTORSENGINEERING
ROBOTICAUTOMATION
HAZARDWARNING(危险警告)
EARTHQUAKEPROTECTION(地震警告)
DOCUMENTATION(文件)
FIREPROTECTION(消防保护)
ENVIRONMENTALGUIDELINES(环境方针)
SectionRECOMMENDATIONS
Section-ILLUSTRATIONS
ILLUSTRATION1-MirraTrakSystemLayout
ATTACHMENTONE-SURFACELEAKAGECURRENTTEST(泄漏测试)
ATTACHMENTTWO-GROUNDINGRESISTANCETEST(接地电阻测试)
ATTACHMENTTHREE-VERIFICATIONOFEMO(紧急按钮确认)
ATTACHMENTFOUR-SOUNDPRESSURELEVELSURVEY(声压测试)
ATTACHMENTFIVE-ERGONOMICCHECKLIST(人体功力检查表)
ATTACHMENTSIX-MANUALHANDLINGLIFTANALYSIS(手动操作分析)
ATTACHMENTSEVEN-揥HAT-IF”HAZARDANALYSIS(危险分析)
ATTACHMENTEIGHT-SEMIS10-1296RISKASSESSMENTGUIDELINEMETHODOLOGY
CONCLUSION
SectionMANAGEMENTSUMMARY
Afollow-upsafetyassessmentoftheAppliedMaterials’ChemicalMechanicalPolishingSystem,Model:
MirraTrak(hereafterreferredtoastheMirraTrak),wasperformedfromFebruary2,1998throughFebruary4,1998.Afurtherre-inspectionofthesystemwasperformedonJune3,1998.ApreliminaryevaluationofthesystemwasalsoperformedonSeptember25,1996throughSeptember26,1996,andtheresultsofthisevaluationwerealsoutilizedinthisreport.Notethatthisreportcoversonlytheconcernsraisedbyintegratingthreeseparatesystems,theAppliedMaterialsFABSandMirraCMP,andtheOnTrakSynergyIntegra,whichtogetherformtheMirraTraksystem.Forfurtherinformationconcerningtheindividualcomponents,referencetheindividualSEMIS2-93Areportsfortheseunits.(GS3ReportNo.970668TF,datedJanuary30,1998fortheFABSsystem;GS3ReportNo.7-0100,datedSeptember2,1997fortheMirraCMPsystem;andGS3ReportNo.980094F,fortheOnTrakSynergyIntegra.)ThisreviewwasperformedusingthecriteriaestablishedbytheSemiconductorEquipmentandMaterialsInternationalSafetyGuidelinesforSemiconductorManufacturingEquipment(SEMIS2-93AGuidelines).
GS3hasusedtheSEMIS10-1296GuidelineMethodologytoperformaRiskAssessmentofanyIssuesremainingafterthereviewoftheinformationprovidedbyAppliedMaterials.NotethattheseveritywasrankedbyGS3;theLikelihood(expectedrateofoccurrence)wasprovidedbyAppliedMaterials.Itemswhichwererankedonlyasa揕ow”or揝light”riskassessmentcategorymaybeconsideredasacceptablewithoutcorrectiveaction,baseduponcriteriaintheSEMIS10-1296Guidelines.
DuringthesafetyassessmentofMirraTrak,GS3identifiedseveralpositiveengineeringdesigns,aswellasseveralissuesthatwillneedtobeaddressedinordertoachievefullcompliancewithSEMIS2-93AGuidelines.Thisdescriptionofbothpositiveengineeringdesignandnon-conformanceissuesarecomprehensivelydescribedinSectionofthisreport.ReferenceSectionforasummaryoftheoutstandingitems.
SectionSCOPE
GS3wascontractedbyAppliedMaterialstoconductaSEMIS2-93AProductSafetyAssessmentoftheMirraTrak.NotethatthisreportcoversonlytheadditionalconcernsraisedbyintegratingtheAppliedMaterialsFABSandMirraCMPandtheOnTrakSynergyIntegratogethertoformtheMirraTraksystem.Forfurtherinformationconcerningtheindividualcomponents,referencetheindividualSEMIS2-93Areportsfortheseunits.(GS3ReportNo.970668T3F,datedJanuary30,1998fortheFABS;GS3ReportNo.7-0100,datedSeptember2,1997fortheMirraCMP;andGS3ReportNo.980094FfortheOnTrakSynergyIntegra).
GS3isajointventurepartnershipbetweenIntertekTestingServices,.,(ITS)andEnvironmentalandOccupationalRiskManagement,Inc.(EORM).GS3isfocusedonprovidingriskmanagement-basedequipmentsafetyconsultingandtestingservicestosupportabroadrangeofsafetyneedsspecifictosemiconductormanufacturingequipmentanddevicemanufacturers.
TheMirraTrakwasevaluatedforcompliancewiththeapplicablecodesandrequirementsoftheUnitedStates.
There-inspectionassessmentwasperformedbyMr.AndrewKileyandMr.MichaelVargaofGS3andreviewedbyMr.PavolBrederandMr.AndrewMcIntyre,CIH,alsoofGS3.
Thesafetyassessmentwasbasedonanin-plantinspectionoftheMirraTrak,discussionswithMs.LisaPowellofAppliedMaterials,aswellasareviewofthesystem'smanuals.
STANDARDSUSED
Theassessmentwasconductedinaccordancewiththeapplicableportionsofthefollowingcodesandstandards:
A)SEMIS2-93A,SafetyGuidelinesForSemiconductorManufacturingEquipment(1996Edition)
B)ANSI,MethodsfortheMeasurementofSoundPressureLevels(1986Edition)
C)ANSI/UL1262,SafetyStandardforLaboratoryEquipment(ThirdEdition)
D)ANSI/NFPA79,ElectricalStandardforIndustrialMachinery(1994Edition)
E)ANSI/NFPA70,NationalElectricalCode(1996Edition)
F)UL50,SafetyStandardforEnclosuresforElectricalEquipment(TenthEdition)
G)SEMIDoc.S8-95,SafetyGuidelineforErgonomics/HumanFactorsEngineeringofSemiconductorManufacturingEquipment.(1995Edition)
H)SEMIS1-90,SafetyGuidelineforVisualHazardAlerts(1993Edition)
I)ANSI/UL73,SafetyStandardforMotor-OperatedAppliances(EighthEdition)
J)ANSI/,SpecificationsforAcousticalCalibrators
K)21CFR,CodeofFederalRegulations,Part1000to1050.
L)ANSI/UL3101-1,SafetyStandardforElectricalEquipmentforLaboratoryUse(FirstEdition)
M)SEMIS10-1296,SafetyGuidelinesforRiskAssessment(1996Edition)
TESTSPERFORMED
InordertoverifycompliancewithSEMIS2-93AGuidelinesandtheotherapplicablestandards,thefollowingtestswereperformed:
A)SurfaceLeakageCurrentTest
B)GroundingResistanceTest
C)VerificationofEMOs
D)SoundPressureLevelSurvey
Notethatonlythetestsnotedabovewererepeated,asthetestingoftheindividualassemblies(FABS,Mirra,andOnTrakSynergyIntegra)wasperformedasapartoftheindividualevaluationsforeach.Referencetheindividualreportsforeachfortestresults.
SectionSYSTEMDESCRIPTION
TheMirraTrakconsistsofaFABSwaferhandlingmodule,aMirraChemicalMechanicalPolisher(CMP),andanOnTrakSynergyIntegra.Anoperatorcanloaduptofour8”wafercassettesatthefrontoftheFABSmoduleatonetime.CassettesmaybemovedintopositionforhandlingbytheFABSusinganoptionalergoloaderorbymanualrotationofthecassette.TheFABSrobotthenpicksupthewafersfromthecassettes,placestheminanalignmenttool,andthenpassesthewaferstotheCMP抯extendedrobotwaferhandlingmoduleforconveyancetotheCMP.
TheCMPsystemismodularandconsistsofawaferhandlingmodule(whichmovesbetweentheFABS,SynergyIntegra,andCMP),apolishingmodule,aslurrydeliverymodule,andacontrolsystemmodule.Thesystemusesde-ionizedwater,cleandryair(CDA),nitrogen,vacuum,andslurry.Theslurryisprovidedbytheend-usertothesystemthroughabulkheadfacilityconnection.TheCMPisdesignedforoxideetchingandmetaletchingandisintendedforusewithavarietyofslurrychemistries,includingbasicandacidicslurries,butthissystemwasdesignedonlyfortheuseofapotassiumhydrox
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