PCB工程英文.docx
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PCB工程英文.docx
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PCB工程英文
工程英文确认常用词及常用语句汇总
厚度
公差
线路层
孔层
阻焊层
字符层
外形层
叠层
单词
1.附件:
attached
2.样品:
sample
3.承认:
approval
4.答复:
answer;reply
5.规格:
spec
6.与...同样的:
thesameas
7.前版本:
previousversion(oldversion)
8.生产:
production
9.确认:
confirm
10.再次确认:
doubleconfirm
11.工程问题:
engineeringquery(EQ)
12.尽快:
ASAP(assoonaspossible)
13.生产文件:
productiongerber
14.联系某人:
contactsomebody
15.提交样板:
submitsample
16.交货期:
deliverydate
17.电测成本:
ET(electricaltest)cost
18.通断测试:
Openandshorttesting
19.参考:
referto
20.IPC标准:
IPCstandard
21.IPC二级:
IPCclass2
22.可接受的:
acceptable
23.允许:
permit
24.制造:
manufacture
25.修改:
revision
26.公差:
tolerance
27.忽略:
ignore(omit)
28.工具孔:
toolinghole
29.安装孔:
mountinghole
30.元件孔:
componenthole
31.槽孔:
slot
32.邮票孔:
snapoffhole
33.导通孔:
via
34.盲孔:
blindvia
35.埋孔:
buriedvia
36.金属化孔:
PTH(platingthroughhole)
37.非金属化孔:
NPTH(noplatingthroughhole)
38.孔位:
holelocation
39.避免:
avoid
40.原设计:
originaldesign
41.修改:
modify
42.按原设计:
leaveitasitis
43.附边:
wastetab
44.铜条:
copperstrip
45.拼板强度:
panelstrong
46.板厚:
boardthickness
47.删除:
remove(delete)
48.削铜:
shavethecopper
49.露铜:
copperexposure
50.光标点:
fiducialmark
51.不同:
bedifferentfrom(differfrom)
52.内弧:
insideradius
53.焊环:
annularring
54.单板尺寸:
singlesize
55.拼板尺寸:
panelsize
56.铣:
routing
57.铣刀:
router
58.V-cut:
scoring
59.哑光:
matt
60.光亮的:
glossy
61.锡珠:
solderball(solderplugs)
62.阻焊:
soldermask(solderresist)
63.阻焊开窗:
soldermaskopening
64.单面开窗:
singlesidemaskopening
65.补油:
touchupsoldermask
66.补线:
trackwelds
67.毛刺:
burrs
68.去毛刺:
deburr
69.镀层厚度:
platingthickness
70.清洁度:
cleanliness
71.离子污染:
ioniccontamination
72.阻燃性:
flammabilityretardant
73.黑化:
blackoxidation
74.棕化:
brownoxidation
75.红化:
redoxidation
76.可焊性:
solderability
77.焊料:
solder
78.包装:
packaging
79.角标:
cornermark
80.特性阻抗:
characteristicimpedance
81.正像:
positive
82.负片:
negative
83.镜像:
mirror
84.线宽:
conductorwidth
85.线距:
conductorspacing
86.做样:
buildsample
87.按照:
asper
88.成品:
finished
89.做变更:
makethechange
90.相类似:
similarto
91.规格:
specification
92.下移:
shiftdown
93.垂直地:
vertically
94.水平的:
horizontally
95.增大:
increase
96.缩小:
decrease
97.表面处理:
SurfaceFinishing
98.波峰焊:
wavesolder
99.钻孔数据:
drillingdate
100.标记:
Logo
101.Ul标记:
UlMarking
102.蚀刻标记:
etchedmarking
103.周期:
datecode
104.翘曲:
bowandtwist
105.外层:
outerlayer
106.内层:
internallayer
107.顶层:
toplayer
108.底层:
bottomlayer
109.元件面:
componentside
110.焊接面:
solderside
111.阻焊层:
soldermasklayer
112.丝印层:
legendlayer(silkscreenlayeroroverlayer)
113.兰胶层:
peelableSMlayer
114.贴片层:
pastemasklayer
115.碳油层:
carbonlayer
116.外形层:
outlinelayer(profilelayer)
117.白油:
whiteink
118.绿油:
greenink
119.喷锡:
hotairleveling(HAL)
120.水金:
flashgold
121.插头镀金:
platedgoldedge-boardcontacts
122.金手指:
Gold-finger
123.防氧化:
Entek(OSP)
124.沉金:
Immersiongold(chem.Gold)
125.沉锡:
ImmersionTin(chem.Tin)
126.沉银:
ImmersionSilver(chem.silver)
127.单面板:
singlesidedboard
128.双面板:
doublesidedboard
129.多层板:
multilayerboard
130.刚性板:
rigidboard
131.挠性板:
flexibleboard
132.刚挠板:
flex-rigidboard
133.铣:
CNC(mill,routing)
134.冲:
punching
135.倒角:
beveling
136.倒斜角:
chamfer
137.倒圆角:
fillet
138.尺寸:
dimension
139.材料:
material
140.介电常数:
Dielectricconstant
141.菲林:
film
142.成像:
Imaging
143.板镀:
PanelPlating
144.图镀:
PatternPlating
145.后清洗:
FinalCleaning
146.叠层:
layup(stack-up)
147.污染焊盘:
contaminatepad
148.度数:
degree
149.被…覆盖:
becoveredwith
150.负公差:
minustolerance
151.标靶盘:
targetpad
152.外形公差:
routingtolerance
153.芯板:
core
154.蓝胶:
Peelablesoldermask
155.亚光黑:
MattBlack
156.工艺边:
Strip;Frame;breakaway
157.飞测:
Fly-probe
158.叠层顺序:
theorderoflayers
159.槽宽度:
slotwidth
160.过孔:
Vias
161.挡点:
Blockpadwardring
162.分孔图:
drillchart
163.钻带:
drilltape
常用语句
-、厚度
1.要求孔内铜厚0.001"太紧对我们的生产,建议按IPC二级0.0008"。
Thecopperthicknessofthewalloftheplated-throughholesisspecified0.001".It'stootightforourproduction.WesuggestasperIPCclass2.that'stosay,It's0.0008".
2.要求金手指镀金厚度为1.2-1.5um,我们加工太困难,建议按我们常规0.45um。
TheplatingthicknessofAuinedgecontactisspecified1.2-1.5um,itistootoughforus,wesuggestfollowingournormalstandard,thatistosay0.45uminstead.
3.建议所要求的铜厚2OZ为成品铜厚,而且我们将用基铜1.5OZ电镀到2OZ。
Thecopperthicknessisspecified2OZ.Wesuggestthefinishedcopperthickness2OZ.Andwewillusethebasematerialwith1.5OZcopperthicknessandplateto2OZforourproduction.
4.要求锡厚为0.0005-0.003",我们做不到这么厚,建议按IPC二级,即保证可焊性,
Thesolderthicknessisrequiredtoplated0.0005-0.003",Wecannotreachtherequirement.WesuggestfollowingIPCclass2forthesolderthicknessandwewillassurethesolderability.
二、公差
1.XXX.的尺寸公差为+/-0.005,这要求是太紧对我们生产,建议公差放松到+/-0.008"。
ThetoleranceofdimensionisspecifiedXXX.+/-0.005".Itistightforourproduction.Wesuggest+/-0.008"instead。
2.在*.pdf文件中要求外形公差为+/-0.005",建议按IPC二级+/-0.01"代替。
Theprofiletoleranceisspecified+/-0.005"in*.pdffile.WesuggestasperIPCclass2,thatistosay,itis+/-0.01".
3.在叠层图中要求板厚公差为+/-0.007",而notes1中要求板厚公差为+/-0.005",他们是不同的,建议0.062"+/-0.007"是可接受的,因为+/-0.005"对我们来说太难控制了。
Thetoleranceoftheboardthicknessisspecified+/-0.007"inlayupdetailwhichisdifferentformNOTES1+/-0.005".Wesuggest0.062"+/-0.007"isacceptablefor+/-0.005"isverytoughforustocontrol.
4.外形公差要求+/-0.1mm,这超出了我们生产,建议按+/-0.2mm控制。
Thetoleranceoftheoutlineisspecified+/-0.1mm.It'saboveus.Wesuggest+/-0.2mminstead.
5.v-cut留厚公差为+/-0.06mm上下偏移公差为+/-0.05mm,这两个公差都太紧,建议两个公差都按+/-0.1mm控制。
Theremaintoleranceofv-cutisspecified+/-0.06mmandoffsettoleranceis+/-0.05mm.theyaretootightforus,wesuggestbothtoleranceare+/-0.1mminstead.
6.孔位公差为0.05mm,这是太紧对我们,建议用+/-0.076mm替代。
Thetoleranceoftheholepositionisspecified0.05mm.It'stootightforus,Wesuggest+/-0.076mminstead.
7.角度公差为+/-0.5mm,这是太紧对我们,v-cut角度我们将控制在30+/-5度。
Thetoleranceofangleis+/-0.5degree,itistightforus,wewouldliketocontroltheangleofv-cutwithin30+/-5degree.
8.在1MB5476-01.pdf文件中要求孔到板中心的公差是+/-0.05mm,这是太紧对我们,建议安IPC二级。
Itisspecialthatthetoleranceoftheholetoboardcenteris+/-0.05mminthe1MB5476-01.pdffile,itistootightforus,wesuggestasperIPCclass2.
9.要求线宽和线间距公差为+/-0.03,这是太紧对我们,请确认放松到+/-20%。
Itstatedthatconductorwidthandspacingshallbewithin+/-0.03(0.001)ofgerberdata,itistightforus,wewouldliketorelaxto+/-20%.Plsconfirm.
10.Φ3.0的孔径公差要求+0.05mm,这太紧对我们,请确认放松到+0.1/-0mm。
Thetoleranceoftheholeswithdiameter3.0mmisrequiredtocontrolwithin+0.05mm,itistightforus,wewouldliketorelaxto+0.1/-0mm.Plsconfirm.
三、线路层
1.两个孔到外形很近,这将引起露铜和破孔,建议允许露铜与破孔。
Twoholesareneartheoutline,itwillcausecopperexposedandholebroken,wesuggestcopperexposedandholebrokenispermitable.
2.有些盘离外形很近,建议削铜皮0.4mm,避免露铜。
Somepadsareclosetotheoutline.Wesuggestshavingthepadsabout0.4mmavoidtothecopperexposure.
3.焊盘延伸出板外,如按原设计,板边将会露铜,建议允许露铜。
Thecopperpadextendtotheboardoutline,itwillleadtocopperexposedifwefollowGerbertodo,Wesuggestcopperexposedisacceptable.
4.有三个盘离v-cut线很近将会引起露铜,建议削焊盘0.4mm避免露铜。
Thethreepadsaresoclosetothev-cutthattheywillcausecopperexposure.Wesuggestshavingthepads0.4mmavoidtothecopperexposure.
5.底层有些地方线路网格间距仅有0.178mm,这种网格间距我们生产无法做到,建议减小线宽使间距达到0.2mm.
Thecoppergridsonbottomsideisonly0.178mminsomeplaces,wecannotdoitperthisgap,sowesuggestdecreasingthetrace widthtomakecoppergridsto0.2mm.
6.既然没有功能上的影响,我们建议所有层附边均加些铜皮以提高电镀质量。
Wesuggestputtingsomeextracopperonthewastetabinalllayerstoimproveplatingqualitysincethisisnofunctioneffect.
7.建议加在顶层空白区域加些铜以提高电镀质量。
Wesuggestputtingsomecopperinblankareaontopsidetoimproveplatedquality.
8.我们发现有两处铜皮间距仅有0.013mm,建议把它们连接起来。
Wehavefoundthatthegapbetweentwoblockcopperisonly0.013mmonbottomside,wesuggesttheyareconnected.
9.两个光标点处在v-cut线上,它们将被削到,我们建议向左边移1.0mm。
Thetwofiducialmarksareoverv-grooveline.Theywillbecut.Wesuggestmovingthem1.0mmtowardtheleft.
四、孔层
1.两个直径2.0MM的孔,4个直径4.0MM的孔,4个直径1.3MM的孔双面没有焊盘,但它们被定义成PTH孔,我们建议做NPTH孔
The2holeswithdia.2.0mm,4holeswithdia.4.0mmand4holeswithdia.1.3mmhavenopadsontopandbottomcopperlayer.ButtheyarespecifiedPTHindrillchart.WesuggestbuildthemasNPTH.
2.这些孔(直径1.4MM,1.6mm,1.8mm,2.5mm)被定义成PTH孔,但它们的焊盘与孔径等大,我们建议做NPTH孔。
Theseholes(1.4mm,1.6mm,1.8mm,2.5mm)arespecifiedPTH.Buttheyhavepadswhicharethesameastheholesincopperlayer.WesuggestthemNPTH.
3.六个直径0.25MM的孔在分孔图中定义为NPTH孔,但它们的线路焊盘比孔大,我们建议做PTH孔。
The6holeswithdia.0.25mmarespecifiedNPTHindrillchart.Buttheyhavepadswhicharelargerthantheholesincopperlayers.WesuggetthemPTH.
4.直径0.11“的孔对应的焊盘比孔大,但它们被定义成NPTH孔,我们建议沿孔边削铜皮0.3MM,请确认
Theholewithdia.0.11"havepadwhichislargerthantheholeintopandbottomcopperlayer.Butit'sspecifiedNPTH.wesuggestshavingthepads0.3mmaroundthehole.Plsconfirm.
5.GERBER中孔的类型没有定义,2个直径0.120“的孔双面没有焊盘,我们想确认这2个直径0.120”的孔为NPTH孔。
Theholetype(PTHorNPTH)didnotbedefineintheGerber,thetwoholesofdiameter0.120inchhavenotcopperpadsonbothsides,wewouldliketoconfirmthetwoholesofdiameter0.120incharenon-platingholes,pleaseconfirm.
6.一些1.5mm的孔靠得非常近,建议把他们制成槽孔。
Someholeswithdia.1.5mmareverycloseeachother,wesuggestdoingthemovalhole.
7.有两个Φ0.991、Φ0.762重叠在一起,建议保留一个0.991mm的孔。
Therearetwoholeswithdia.0.991mmanddia.0.762mmoverlapeachotherinoneplace,wesuggestonlydia.0.991mmremainthere.
8.在DRD孔表中直径0.012英寸孔数是291,而在钻孔文件中孔数是290,请确认孔数是290而不是291。
Thequantityofdiameter0.012inchintheholechartoffileDRDis291,but(thruhole,tap)itisonly290.pleaseconfirmthequantityofd
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