ETP910C001GE文件集成.docx
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ETP910C001GE文件集成.docx
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ETP910C001GE文件集成
1.ETP#910C001ETPTitleELECTRONICSRELIABILITYETee
ETPType:
Revision#0RevisionDate12/08/03RevisionAuthorJHolmes,LucasMallory
(Seesection13forrevisionhistory)
SupersededDoc#(ifapplicable)SI700000
SI700002
SI700003
ApplicableProductLine(s):
and/or(enterotherhere)
Platform:
Subsystem:
Electronics
Component:
Boardassembliesandcomponents
Keywords:
ReliabilityLife
ElectronicsALT
85/85TemperatureCycling
HumidityCyclicTemperature
EvaluationHALT
FlatnessVibrational
WarpageEmbrittlement
DesignMargin
IonicChromeotography
StaticRose
CouponTin
WhiskerPrinted
CircuitAccelerated
HighlyChamber
Contents
1Introduction3
2AcceleratedLifeTesting4
3HighlyAcceleratedLifeTesting16
4TinWhisker31
5CircuitBoardAssemblyFlatness37
6CircuitBoardEmbrittlement42
7HighlyAcceleratedStressAudit46
8DesignMarginEvaluation51
9CyclicReliability56
10IonicChrometography61
11StaticROSETesting66
12CouponSampling69
13ThermalCycleReliabilityAuditTesting74
1
Introduction
Acceleratedlifetestingconsistsofvariousteststhatacceleratedifferentfailuremodes.Forexample,thevibrationtestingmayacceleratesolderjointfailuresthatcanbearesultofpoorworkmanship.GECIPusesafamilyofdifferentteststhatexercisevariousfailuremodesthatcanoccurinelectronicsassemblies.Thetablebelowshowsasummaryofthefailuremodesexercisedbythedifferenttestsinthisdocument.
Thisdocumentcontainstestproceduresthatareusedtoevaluatethereliabilityandqualityofelectronicassemblies.Eachtestprocedureaccomplishesadifferenttask.Insomecases,twoormoretestprocedureswilltestforthesamefailuremodeormodes.
Thefollowingtableoutlinescommonelectronicsdesignandqualificationscenarios,aswellastheteststhatareappropriateforthatintent.
SnPbDesignQualification
SnPbDesign,withPbFreeComponentsQualification
PbFree/RoHSApprovedDesign
Reliability/QualityAudit
AcceleratedLife
X
X
X
X
HighlyAcceleratedLife
X
X
X
TinWhisker
X
X
*
PCBFlatness
X
PCBEmbritllement
X
HighlyAcceleratedStressAudit
X
DesignMarginEvaluation
X
X
X
CyclicReliability
X
X
X
IonicChromeotography
X
X
X
StaticROSE
X
CouponSampling
X
ProductSpecific**
X
X
X
X
ThermalCycleReliabilityAudit
X
X
X
X
Reliabilityaudittestsdefinedinthetableabovearethemaximumamountoftestingthatcouldbedone.Eachprogramwillspecifywhichoftheabovetestsaretobeusedintheirqualityauditplan.Allproductsbuiltwithleadfreesoldershouldusethethermalcyclereliabilityaudittestasaproductionauditwithaninitialbaselinerundoneduringtheinitialproductlaunch.
*Itisrecommendedthatthetinwhiskertestbedoneonavendorbyvendorbasis,ratherthanaprogrambyprogrambasis.
**Inadditiontothetestsdefinedinthisdocument,thereareotherproductspecificteststhatmayberequiredintheproductspecification.Someofthosetestsmayincluderacklife,slat,saltspray,acidfog,HCC(underthebag),etc.
2AcceleratedLifeTesting
2.1ETPObjective
Purpose:
IntroductiontoCyclicTemperature,Power&HumidityEvaluation(ALT)
TheprocesselementstosuccessfullyimplementandperformCyclicTemperature,Humidity&Powercycletestingaredefinedinthissection.ThissectionoftheETPwilldescribethemethodology,requirementsandprocedureforAcceleratedLifeTesting(ALT).
Forcertainprojects,anelectromigrationtestmayberequired(asopposedtothecompleteALTtest).Whenthistestisrequired,theALTprocedureshouldbefollowedwithatestdurationof2weeks.Uponcompletionofthetwoweektestafullmicroscopicexamoftheunitsundertestshouldbedone.Thisexaminationshouldfocusonanyevidenceofdendriticgrowth.
Limitations:
Anyfailuresfoundduringthistestingshouldbefullyinvestigateduntilrootcauseisfound.Therearecomponentsthatcannotoperatewithoutfailureinhightemperatures.ThesetypesoffailureswillnolongerfollowtheArrheniusequation.Theywillinfactbespecialcausefailuresforwhichnoaccelerationcanbecalculated.
.
2.2KeyParameters&RequirementInputs
Thetestvariables,whichimpactproductperformance,caneitherbeclassifiedasKeyNoiseParametersorKeyControlParametersasdescribedbelow.Theymaybesetastestinputs,recordedforanalysisorbothasspecifiedforthisETPinthefollowingcharts.
KeyNoiseParameters-Akeynoiseparameter(KNP)isanyproductusageorinteractionvariablewhichcannotbecontrolledbydesign(i.e.voltage,ambienttemperature,waterquality,etc.).Notethatforthepurposesofthistest,theparametermaybecontrolled(i.e.specifiedasaninputbelow)inordertounderstandtheimpactoftheKNPuponproductperformance.
KeyNoiseParameter
(KNPasdefinedbyP-diagram)
SetasTestInput
(Settothislevelfortest)
RecordasTestOutput
(Measureresultsandrecord)
A.
Voltage
Nominal
B.
Temperature
SeeProfiles
C.
Humidity
SeeProfiles
D.
PowerLineStability
SeeProfiles
E.
Electromigration
MicroscopicExamination
F.
ProductSpecific
KeyControlParameters-Akeycontrolparameter(KCP)isanyproductusageorinteractionvariablewhichcanbecontrolledbydesign(dimensions,operatingrange,material,etc.).
KeyControlParameter
(KCPasdefinedbyP-diagram)
SetasTestInput
(Settothislevelfortest)
RecordasTestOutput
(Measureresultsandrecord)
A.
PowerDissipation
B.
Dimensions
C.
PowerSupplyVoltage
D.
ElectricalTiming
E.
ProductSpecific
2.3TestEquipmentandSupplies
Equipment/TestDevice
(Mostgenerictitle&descriptionincludinganyinputspecs)
Measurement
(Deviceoutputrequirements,includeunits)
Range
(Min/maxmeasurementcapability)
Resolution
(Maximummeasurementincrements)
Expected
GageError
(Variabilityofgage,e)
A.
Temperature/HumidityChamber
-20to105degreesC
B.
ProgrammableLinePowerSupply
100to300VAC
SupplyItem
(Mostgenerictitle)
Quantity
UnitofMeasure
ConsumableorReusable?
Comments
A.
SimulatedLoadsorTestBoxesasappropriatefortheProduct
SeeSampleSize
B.
HighTemperatureWiring
SeeSampleSize
C.
MechanicalFixture
SeeSampleSize
2.4ExpectedTestDuration
(Basedonaverageconditions;mayvarysignificantlydependinguponlabload)
Set-up:
1Day
TestProcedures:
Severalweeks.TheLabshallinspecttheUUTseachdayforthedurationofthetest.Durationisdependentontheusageprofileoftheproduct&theaccelerationfactor.
Post-test/Cleanup:
1Day
Documentation:
0.5Day
TotalExpectedTestDuration:
SeveralWeeks,DependentonUsageProfile&accelerationfactor.
2.5TestSamples
SampleSize
Samplesizeshallbeselectedtosupporta90%C.I.ofbeing90%reliable.Ifappropriate,alternativeconfidenceintervalsandreliabilitytargetsmaybechosen.ThesamplesizecalculationshallbereviewedwiththeSCEaspartofthetestplanreview.Thereliabilitysamplesize,assuminganexponentialdistribution,canbecalculatedusing:
n=(L/(T*Af))*(ln(1-CI))/(ln(R))
L:
SpecifiedproductlifeinHours
T:
Totalnumberofhoursontest
Af:
Accelerationfactor(Seetheaccelerationfactorcalculator)
CI:
Confidenceinterval
R:
Reliability
e.g.,toget90%CI,90%RWhereT*Af=Ltherequiredsamplesizeis22.
Qualification/Preconditioning/Setup
CompletionofReliability10StepProcess
Priortostartinganyacceleratedlifetestingacompletionofthefirst8stepsinthe10stepprocessisrequired.Thesestepsarenecessaryinordertounderstandwhattypesofenvironmentsandthelifetimeusageconditionsareforthesystembeingtested.The10stepprocessislocatedattheReliabilityHomepage
Temperaturesusedintestingshouldincorporatetemperaturesthatwillbeseeninreallifeapplications.(e.g.,105C.forcooktopapplications.)
Assembliesshallbetestedfortwicelifeor20yearsoflife,whicheverofthe2choicesisless.Additionally,alternativetestrequirementsmaybeacceptedwithpriorreviewandapprovaloftheelectronicschiefengineer.
Requestfortesting
Arequestfortestingmustbesubmittedpriortotestingtheboards.Thisshouldbesubmittedassoonastherequirementfortestingisdetermined.Themethodofsubmittingatestrequestvariesbysite.Typicaltestrequestinformationmayinclude:
-Engineer(s)inchargeofelectricaldesign.
-Completeitemnameand/ordesignation.
-Dateboardswillbeavailable.
-Requestedcompletiondatesandreasonsforthatdate(i.e.E-Review)forprioritizingpurposes.
RequiredforTest
-Calculationsofsamplesize
>UsetheReliabilitywebsite(availablefromtechnet)orAltaprogram
-HardcopyofAccelerationcalculationtobeattachedtothefrontofthechamber.
>
-Electricalinterfacebox:
-Completeschematicofcircuitboardandtestbox.
-Load(s)requiredforoperation.
-FunctionalTestProcedure.
-MechanicalFixture.
-Informationsheetwiththedescriptionofthetest,starttime,stoptimeandwhotocontactincaseof
emergency.Thiswillalsobepostedonthefrontofthetestchamber.
2.6TestProcedure
Theelectricalcontrolsystemisusedtoverifytheoperationofthecomponentsthatmakeuptheunitsbein
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