报表分析研究7.ppt
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报表分析研究7.ppt
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1財務報表分析-半導體設備指導教授:
王淑芬第五組學生:
邱靖雯.黃嘉興.劉順吉.王譽璇.中華民國九十六年十二月國立交通大學財務金融研究所在職專班12報告章節半導體設備產業簡介主要設備廠商財報分析半導體設備商產業特色結論23半導體設備產業簡介34半導體產業結構4556AMDFabAnnouncementfrom2003AMDBreaksGroundon300MillimeterManufacturingFacilityinDresden,GermanyMovetoExpandManufacturingCapacityDrivenbyPositiveCustomerResponseandIncreasedMarketOpportunitiesforAMD64ProcessorsSUNNYVALE,CAANDDRESDEN,GERMANY-November20,2003-AMD(NYSE:
AMD)announcedtodaythatithasbrokengroundona300millimeter(mm)manufacturingfacility(or“fab”).Thefacility,namedAMDFab36,ispartofAMDDresdenFab36LLC&Co.KGandwillbelocatedinDresden,Germany,adjacenttoAMDFab30.AMDFab36isexpectedtobeinvolumeproductionin2006.Thenewfacilityisexpectedtorequireapproximately1,000employees,mostofthemhighlyskilledengineersandtechnicians.“PositivecustomerresponseandincreasingmomentumforourAMD64processorsmakeitclearthatthetimeisrighttoexpandourmanufacturingcapacityinordertoeffectivelymeetfuturedemand,”saidHectorRuiz,presidentandCEOatAMD.“Ouraggressivepushintotheenterprisecomputingmarketcontinuestogaintraction,asevidencedbySunsrecentadoptionoftheAMDOpteronprocessorandthegrowingsuccessofserverandworkstationsolutionsfromIBM,FujitsuSiemensandothers.”“BybuildinginDresden,weareabletoleveragetheoutstandingcapabilitiesofourexistingAMDFab30andgainaccesstothemostsubstantialgovernment-backedfinancialincentivespackageavailabletous,”saidBobRivet,chieffinancialofficeratAMD.“WeexpectAMDFab36willcostapproximatelyUS$2.4billionoverthenextfouryears.Wehavearrangedexternalfinancingandgovernmentsupportofapproximately$1.5billionduringthatperiod.WebelieveAMDFab36offersthebestsolutionformeetingfuturecustomerdemandwhileadvancinglong-termshareholdervalue.”67FabEquipmentAllocationTotalcost$2600M25%building$650M,$1950forEquipmentHowdoesthe$1950dividedbetweenthedifferentequipmenttypeLitho:
$410M(ASML,Nikon,Canon)Track(Coater,Developer):
$97M(TEL)Removal(EtchandCMP):
$487M(Lam,TEL,AMAT,Ebara)Deposition:
$390M(AMAT)Thermal(Furnace,RTP):
$78M(TEL,AMAT)Implant:
$78M(Variant)Processcontrol(Inspectionandmetrology):
$292M(KLA-Tencor)FactoryAutomation:
$78M(BrooksAutomation,ASYST)78NewAMDFabAnnouncementFORIMMEDIATERELEASE:
June23,2006GOVERNORPATAKIANDAMDSCEORUIZANNOUNCEPLANSFORMULTI-BILLIONDOLLAR300MMSEMICONDUCTORMANUFACTURINGPLANTPlanWouldAllowfortheLargestPrivateInvestmentinNYSHistoryMostAdvancedPlantintheWorld,CreatingOver1,200High-TechJobs,ThousandsofConstructionJobsandMoreThan3,000IndirectJobsGovernorGeorgeE.Pataki,Dr.HectorRuiz,ChairmanandCEOofAdvancedMicroDevices(NYSE:
AMD),SenateMajorityLeaderJosephL.BrunoandAssemblySpeakerSheldonSilvertodayannouncedplansforoneofthelargestprivatesectorindustrialinvestmentsinNewYorkStatehistory-amulti-billiondollardealthatwouldenableAMDtobuildandoperatethemostadvancedsemiconductormanufacturingfacilityintheworldattheLutherForestTechnologyPark.Thisunprecedentedeconomicdevelopmentprojectisprojectedtocreatemorethan1,200newhigh-techjobs,thousandsofconstructionjobs,andmorethan3,000indirectjobs.Underthetermsoftheagreement,AMDwouldbeabletoconstructanew,$600million,1.2millionsquarefootfacility,equippedwithapproximately$2.6billioninstate-of-the-arttoolsdesignedtoproduce300mmwafersusing32nmprocesstechnology.89全球主要半導體設備商營收及市占率910前五大半導體設備商簡介CompanyName公司簡介Products/InformationAppliedMaterials(1967)美商台灣應用材料公司,是全球最大半導體製程設備製造公司,也是台灣第一大半導體設備供應商。
其集團己發展至光電業及太陽能產業.A“supermarket”ofequipmentalmostallbutLitho.Recentlyenteredthesolarmarketequipmentbusiness.TEL(1963)日商東京威力,是全球第二大半導體製程設備製造公司。
TEListheJapan“AppliedMaterials”adiversifiedmanufacturer.ASML(1984)荷商艾斯摩爾為全球微影設備最大供應商,在台灣設立全球卓越創新中心。
Thepremiercompanyforstepper.Thelatestimmersion193nmtoolis$26Mbyfarthemostexpensivetoolinthefab.KLA-Tencor(1997,asamergerbetweenKLAandTencor)美商科磊公司為全球最大晶圓量測設備商專精於提昇半導體製程良率及提供製程控管量測整體方案。
KLA-TencoristheAppliedMaterialsoftheinspectionandmetrology.LamResearch(1980)美商科林公司之電漿蝕刻設備為全球銷售之冠。
Thepremiercompanyforetching.1011SEMINorthAmericanBook-to-BillReportSEMIbeganpublishingbook-to-billtrendsforsemiconductorcapitalequipmentin1991.BasedonNorthAmericanheadquarteredcompaniesreportingglobalnetbookingsandbillings.Includessemiconductorapplicationsonly.Book-to-billratiocalculatedfromthreemonthaverageofbookingsdividedbythreemonthaverageofbillings.Individualcompanydatacollectedandcompiledeachmonththroughanindependentthirdpartytoprotectparticipantcompanyconfidentiality.Eventhoughpresentedona3-monthaveragebasis,billingscanbehigherforthequarterendingmonths,especiallyduringanupcycleinthebillingtrends.1112訂單與
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