JSTDD中英文对照版.docx
- 文档编号:26478359
- 上传时间:2023-06-19
- 格式:DOCX
- 页数:23
- 大小:31.67KB
JSTDD中英文对照版.docx
《JSTDD中英文对照版.docx》由会员分享,可在线阅读,更多相关《JSTDD中英文对照版.docx(23页珍藏版)》请在冰豆网上搜索。
JSTDD中英文对照版
J-STD-020D
Moisture/ReflowSensitivityClassificationforNonhermeticSolidStateSurfaceMountDevices
非密封固态表面贴装元件湿度/回流焊敏感度分级
1PURPOSE(目的)
Thepurposeofthisstandardistoidentifytheclassificationlevelofnonhermeticsolidstatesurfacemountdevices(SMDs)thataresensitivetomoisture-inducedstresssothattheycanbeproperlypackaged,stored,andhandledtoavoiddamageduringassemblysolderreflowattachmentand/orrepairoperations.
本标准旨在识别非密封固态表面贴装元件的湿度敏感等级以便其能合适的封装,储存,作业以避免在回流和维修作业中被损伤.
Thisstandardmaybeusedtodeterminewhatclassification/preconditioninglevelshouldbeusedforSMDpackagequalification.Passingthecriteriainthistestmethodisnotsufficientbyitselftoprovideassuranceoflong-termreliability
本标准用于判定合格的SMT封装应使用何种等级/预处理水平.依据本测试方法且通过对应判定标准的元件并不能保证其长期可靠性
Scope(范围)
ThisclassificationprocedureappliestoallnonhermeticsolidstateSurfaceMountDevices(SMDs)inpackages,which,becauseofabsorbedmoisture,couldbesensitivetodamageduringsolderreflow.ThetermSMDasusedinthisdocumentmeansplasticencapsulatedsurfacemountpackagesandotherpackagesmadewithmoisture-permeablematerials.ThecategoriesareintendedtobeusedbySMDproducerstoinformusers(boardassemblyoperations)ofthelevelofmoisturesensitivityoftheirproductdevices,andbyboardassemblyoperationstoensurethatproperhandlingprecautionsareappliedtomoisture/reflowsensitivedevices.IfnomajorchangeshavebeenmadetoapreviouslyqualifiedSMDpackage,thismethodmaybeusedforreclassificationaccordingto.
此分类程序适用于所有非密封固体表面贴装元件,此部分元件由于吸收湿气而在回流焊接中容易损伤.本文件所提及的术语“SMD”指的是塑封或本体为吸湿材料的元件.分类的目的是为了让元件制造商能告知元件使用者(PCBA组装)其产品的湿敏等级,确保元件使用者能恰当作业,如果对之前认证过的SMD封装没有重大更改,依据此方法亦可用于元件的再次分类.
Thisstandardcannotaddressallofthepossiblecomponent,boardassemblyandproductdesigncombinations.However,thestandarddoesprovideatestmethodandcriteriaforcommonlyusedtechnologies.Whereuncommonorspecializedcomponentsortechnologiesarenecessary,thedevelopmentshouldincludecustomer/manufacturerinvolvementandthecriteriashouldincludeanagreeddefinitionofproductacceptance.
此标准不能涵盖所有与设计,组装相关联的元件.但是,此标准为通用技术提供了一个测试方法和标准.如果使用特殊技术或特殊元件,则需客户以及相关的制造方定义一个双方同意的产品接受标准.
SMDpackagesclassifiedtoagivenmoisturesensitivitylevelbyusingProceduresorCriteriadefinedwithinanypreviousversionofJ-STD-020,JESD22-A112(rescinded),orIPC-SM-786(rescinded)donotneedtoberevisionunlessachangeinclassificationlevelorahigherpeakclassificationtemperatureisdesired.AnnexBprovidesanoverviewofmajorchangesfromRevisionCtoRevisionDofthisdocument.
在使用之前版本J-STD-020,JESD22-A112(已作废),IPC-SM-786(已作废)标准中已分级的湿敏元件除非敏感等级变更或耐温峰值提高,否则无须重新分级.附件B提供了版本C升级到版本D的主要变更.
Note:
Iftheproceduresinthisdocumentareusedonpackageddevicesthatarenotincludedinthisspecification’sscope,thefailurecriteriaforsuchpackagesmustbeagreeduponbythedevicesupplierandtheirenduser
备注:
当封装元件未在本标准规格范围内,如需使用此文件中的流程判定,则不良标准需元件供应商和其客户同意.
Background(背景)
Thevaporpressureofmoistureinsideanonhermeticpackageincreasesgreatlywhenthepackageisexposedtothehightemperatureofsolderreflow.Undercertainconditions,thispressurecancauseinternaldelaminationofthepackagingmaterialsfromthedieand/orleadframe/substrate,internalcracksthatdonotextendtotheoutsideofthepackage,bonddamage,wirenecking,bondlifting,dielifting,thinfilmcracking,orcrateringbeneaththebonds.Inthemostseverecase,thestresscanresultinexternalpackagecracks.Thisiscommonlyreferredtoasthe‘‘popcorn’’phenomenonbecausetheinternalstresscausesthepackagetobulgeandthencrackwithanaudible‘‘pop.’’SMDsaremoresusceptibletothisproblemthanthrough-holepartsbecausetheyareexposedtohighertemperaturesduringreflowsoldering.ThereasonforthisisthatthesolderingoperationmustoccuronthesamesideoftheboardastheSMDdevice.Forwave-solderedthrough-holedevices,thesolderingoperationoccursundertheboardthatshieldsthedevicesfromthehotsolderthrough-holedevices,thesolderingoperationoccursundertheboardthatshieldsthedevicesfromthehotsolderThroughholedevicesthataresolderedusingintrusivesolderingor‘‘pininpaste’’processesmayexperiencethesametypeofmoisture-inducedfailuresasSMTdevices.
非密封元件封装在回流高温条件下,其内部水蒸气压力猛增.在某一件下,压力将导致封装从内部分层或者内裂,邦定受损。
更为严重的情况下,压力将导致外部封装开裂.此称之为“爆米花”现象,即由于内部压力引起封装膨胀并且伴随“砰,砰”声而裂开.相对于通孔元件,由于SMD元件需更高的温度回流,因此此种情况尤为敏感.其原因为,SMT元件在PCB同一面回流因而受热更多。
而对于通孔元件,其通常在在PCB之上,因而避免直接高温。
如使用印刷回流制程的通孔元件则可能与出现SMD元件一样失效.
TermsandDefinitions(术语与定义)
acceleratedequivalentsoak–Asoakatahighertemperatureforashortertime(comparedtothestandardsoak),toprovideroughlythesameamountofmoistureabsorption.Seealsosoak
快速浸泡:
相对标准浸泡而言,使用更高温度在更短时间内浸泡
acousticmicroscope–Equipmentthatcreatesanimageusingultrasoundtoviewaspecimen’ssurfaceorsubsurfacefeatures,includingdefectsanddamage.SeeJ-STD-035formoreinformation.
声学显微镜:
使用超声波对元件表面和内部特征(包括不良和损伤)进行查看并产生图像的设备
areaarraypackage–Apackagethathasterminationsarrangedinagridonthebottomofthepackageandcontainedwithinthepackageoutline.
classificationtemperature(Tc)–ThemaximumbodytemperatureatwhichthecomponentmanufacturerguaranteesthecomponentMSLasnotedonthecautionand/orbarcodelabelperJ-STD-033
依据J-STD-033元件制造商在警告标签物料标签上所标示的元件本体最高耐温.
crack–Aseparationwithinabulkmaterial.SeealsoDelamination
开裂:
元件内部分离
damageresponse–Allirreversiblechangescausedbyexposuretoareflowsolderingprofile.
损伤反应:
由回流引起的所有不可逆的的改变.
dead-bug(orientation)–Theorientationofthepackagewiththeterminalsfacingup.元件封装术语:
元件引脚朝上的封装(如下图1)
.delamination–Aninterfacialseparationbetweentwomaterialsintendedtobebonded.Seealsocrack
分层:
两种物料结合部位的分离,参考裂开
downbondarea–Anareaforawirebondonthediepaddle,whosedimensionsequalthoseofasinglebondpadonthedie.
floorlife–Theallowabletimeperiodafterremovalfromamoisturebarrierbag,drystorageordrybakeandbeforethesolderreflowprocess.
车间寿命:
元件从从防潮袋,干燥箱,或烘烤后取出到回流之间允许的时间
fullbodyhotairrework–Theprocessofheatingapackagebydirectingheatedgasatthepackagebodyinordertomeltonlythatpackage’ssolderconnections.
本体热风返工:
使用热风直接给整个元件本体加热而使元件焊点融化的过程
live-bug(orientation)–Theorientationofthepackagewhenrestingonitsterminals
封装术语:
元件引脚朝下的的封装
manufacturer’sexposuretime(MET)–Themaximumcumulativetimeafterbakethatcomponentsmaybeexposedtoambientconditionspriortoshipmenttotheenduser.
制造商暴露时间:
元件烘烤后,在运送给终端使用者之前,元件暴露在周边环境中最大允许时间.
moisture/reflowsensitivityclassification–Thecharacterizationofacomponent’ssusceptibilitytodamageduetoabsorbedmoisturewhensubjectedtoreflowsoldering.
湿度/回流敏感分类:
元件由于吸收湿气在回流条件下受损的敏感特性
moisturesensitivitylevel(MSL)–Aratingindicatingacomponent’ssusceptibilitytodamageduetoabsorbedmoisturewhensubjectedtoreflowsoldering
湿敏等级:
对于元件吸湿在回流条件下受损敏感性的分级
packagethickness–Thecomponentthicknessexcludingexternalterminals(balls,bumps,lands,leads)and/ornonintegralheatsinks
封装厚度:
元件除去外部插座,引脚,焊盘,散热片等的厚度
peakpackagebodytemperature(Tp)–ThehighesttemperaturethatanindividualpackagebodyreachesduringMSLclassification.
元件本体最高温度:
在MSL分类中所规定的元件本体最高能承受的温度.
reclassification–Theprocessofassigninganewmoisturesensitivityleveltoapreviouslyclassifieddevice.
重新分类:
对之前已分类的元件重新指定新的湿敏等级
soak–Theexposureofacomponentforaspecifiedtimeataspecifiedtemperatureandhumidity.Seealsoacceleratedequivalentsoak.
浸泡:
在特定的温度和湿度下,元件在特定的时间内暴露.
3APPARATUS(设备)TemperatureHumidityChambersMoisturechamber(s),capableofoperatingat85°C/85%RH,85°C/60%RH,60°C/60%RH,and30°C/60%RH.Withinthechamberworkingarea,temperaturetolerancemustbe±2°CandtheRHtolerancemustbe±3%RH.
恒温恒湿箱:
需满足85°C/85%RH,85°C/60%RH,60°C/60%RH,and30°C/60%RH操作要求,且在箱内工作区域温度误差必须±2°C,湿度误差3%RH.
FullConvection(Preferred)Fullconvectionreflowsystemcapableofmaintainingthereflowprofilesrequiredbythisstandard
全对流
InfraredInfrared(IR)/convectionsolderreflowequipmentcapableofmaintainingthereflowprofilesrequiredbythisstandard.ItisrequiredthatthisequipmentuseIRtoheatonlytheairandnotdirectlyimpingeupontheSMDPackages/devicesundertest.
红外回流
OvensBakeovencapableofoperatingat125+5/-0°C.烤箱(能满足125+5/-0°C)
Microscopes(显微镜)
OpticalMicroscopeOpticalMicroscope(40Xforexternaland100Xforcross-sectionexam,highermagnificationmightberequiredforverification).
光学显微镜:
(40倍用于外部检查,100倍用于切片检查)验证中可能要求更高倍数显微镜.
AcousticMicroscopeTypicallyascanningacousticmicroscopewithC-ModeandThroughTransmissioncapability.Itshouldbecapableofmeasuringaminimumdelaminationof5%oftheareabeingevaluated
声波扫描显微镜:
具备C-Modec穿透功能,且能量测评估区域最小5%的分层的能力.
Cross-Sectioning
切片:
建议采用或其它推荐适用的设备
ElectricalTestElectricaltestequipmentwithcapabilitiestoperformappropriatetestingondevices.
电气测试:
能合适的测试元件
WeighingApparatus(Optional)Apparatuscapableofweighingthepackagetoaresolutionof1microgram.Thisapparatusmustbemaintainedinadraft-freeenvironment,suchasacabinet.Itisusedtoobtainabsorptionanddesorptiondataonthedevicesundertest(seeClause8).
称重仪(可选):
此设备须精度1微克,且放置在无温漂环境下。
此设备用于获取元件吸收和解析数据.
BeadedThermocoupleTemperatureMeasurementRefertoJEP140forguidanceonprocedurestoaccuratelyandconsistentlymeasurethetemperatureofcomponentsduringexposuretothermalexcursions.JEP140guidelineapplicationscaninclude,butisnotlimitedto,temperatureprofilemeasurementinreliabilitytestchambersandsolderreflowoperationsthatareassociatedwithcomponentassembly
- 配套讲稿:
如PPT文件的首页显示word图标,表示该PPT已包含配套word讲稿。双击word图标可打开word文档。
- 特殊限制:
部分文档作品中含有的国旗、国徽等图片,仅作为作品整体效果示例展示,禁止商用。设计者仅对作品中独创性部分享有著作权。
- 关 键 词:
- JSTDD 中英文 对照