ESL电子纸屏说明书英文版.docx
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ESL电子纸屏说明书英文版.docx
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ESL电子纸屏说明书英文版
TECHNICALSPECIFICATION
MODELNO:
WF021-01B
Thecontentofthisinformationissubjecttochangedwithoutnotice.
PleasecontactWForitsagentforfurtherinformation.
□Customer’sConfirmation
Customer:
Date:
By:
□WF’sConfirmation
ConfirmedBy:
PreparedBy:
RevisionHistory
Rev.
IssuedDate
RevisedContents
Jul.1,2011
Preliminary
1.MechanicalDrawingofEPDmodule
2.Delete7-3-1-2)MCUParallel6800-seriesInterface
3.Delete7-3-1-3)MCUParallel8080-seriesInterface
4.Delete7-3-2)TimingCharacteristicsof6800-SeriesMCUParallelInterface
5.Delete7-3-3)TimingCharacteristicsof8080-SeriesMCUParallelInterface
6.Figure.7-6
(1)Modify41pinconectorto24pinconnector
TECHNICALSPECIFICATION
CONTENTS
NO.
ITEM
PAGE
-
Cover
1
-
RevisionHistory
2
-
Contents
3
1
Application
4
2
Features
4
3
MechanicalSpecifications
4
4
MechanicalDrawingofEPDmodule
5
5
Input/OutputTerminals
6
6
CommandTable
10
7
ElectricalCharacteristics
13
8
TypicalOperatingSequence
21
9
OpticalCharacteristics
23
10
Handling,SafetyandEnvironmentRequirements
25
11
Reliabilitytest
26
12
BlockDiagram
27
1.OverView
ThedisplayisaTFTactivematrixelectrophoreticdisplay,withinterfaceandareferencesystemdesign.
The2.04”activeareacontains172×72pixels,andhas1-bitand2-bitfulldisplaycapabilities.Anintegratedcircuitcontainsgatebuffer,sourcebuffer,interface,timingcontrollogic,oscillator,DC-DC.SRAM.LUT,VCOM,andborderaresuppliedwitheachpanel.
2.Features
◆Highcontrast
◆Highreflectance
◆Ultrawideviewingangle
◆Ultralowpowerconsumption
◆Purereflectivemode
◆Bi-stable
◆Commercialtemperaturerange
◆Landscape,portraitmode
◆Antiglarehard-coatedfront-surface
◆Lowcurrentdeepsleepmode
◆OnchipdisplayRAM
◆WaveformstoredinOn-chipOTP
◆Serialperipheralinterfaceavailable
◆On-chiposcillator
◆On-chipboosterandregulatorcontrolforgeneratingVCOM,Gateandsourcedrivingvoltage.
◆I2CSignalMasterInterfacetoreadexternaltemperaturesensor
◆AvailableinCOGpackageICthickness250um
3.MechanicalSpecifications
Parameter
Specifications
Unit
Remark
ScreenSize
Inch
DisplayResolution
172(H)×72(V)
Pixel
Dpi:
95
ActiveArea
(H)×(V)
Mm
PixelPitch
×
Mm
PixelConfiguration
Rectangle
OutlineDimension
(H×(V)×(D)
Mm
Weight
4±
g
4.MechanicalDrawingofEPDmodule
5.Input/OutputTerminals
5-1)PinoutList
Pin#
Type
Single
Description
Remark
1
NC
DonotconnectwithotherNCpins
KeepOpen
2
O
GDR
N-ChannelMOSFETGateDriveControl
3
O
RESE
CurrentSenseInputfortheControlLoop
4
C
VGL
NegativeGatedrivingvoltage
5
C
VGH
PositiveGatedrivingvoltage
6
O
TSCL
I2CInterfacetodigitaltemperaturesensorClockpin
7
I/O
TSDA
I2CInterfacetodigitaltemperaturesensorDatepin
8
I
BS1
Busselectionpin
Note5-5
9
O
BUSY
Busystateoutputpin
Note5-4
10
I
RES#
Reset
Note5-3
11
I
D/C#
Data/Commandcontrolpin
Note5-2
12
I
CS#
ChipSelectinputpin
Note5-1
13
I/O
D0
serialclockpin(SPI)
14
I/O
D1
serialdatapin(SPI)
15
C
VDDIO
Powerforinterfacelogicpins
16
I
VCI
PowerSupplypinforthechip
17
VSS
Ground
18
C
VDD
Corelogicpowerpin
19
C
VPP
PowerSupplyforOTPProgramming
20
C
VSH
PositiveSourcedrivingvoltage
21
C
PREVGH
PowerSupplypinforVGHandVSH
22
C
VSL
NegativeSourcedrivingvoltage
23
C
PREVGL
PowerSupplypinforVCOM,VGLandVSL
24
C
VCOM
VCOMdrivingvoltage
Note5-1:
ThispinisthechipselectinputconnectingtotheMCU.ThechipisenabledforMCUcommunicationonlywhenCS#ispulledLOWinparallelinterface.WhenCS#isnotinuse,pleaseconnecttoVCIorVSS.
Note5-2:
ThispinisData/CommandcontrolpinconnectingtotheMCU.WhenthepinispulledHIGH,thedataat[7:
0]willbeinterpretedasdata.WhenthepinispulledLOW,thedataatD[7:
0]willbeinterpretedascommand.
Note5-3:
Thispinisresetsignalinput.
ActiveLow.
Note5-4:
ThispinisBusystateoutputpin.WhenBusyisHigh,theoperationofchipshouldnotbeinterrupted,commandshouldnotbesent..,ThechipwouldputBusypinHighwhen
-Outputtingdisplaywaveform;or
-ProgrammingwithOTP
-Communicatingwithdigitaltemperaturesensor
Note5-5:
Table:
Businterfaceselection
6.CommandTable
D/C#=0,R/W#(WR#)=0,E(RD#=1)unlessspecificsettingisstated.
7.ElectricalCharacteristics
7-1)Absolutemaximumrating
Parameter
Symbol
Rating
Unit
LogicSupplyVoltage
VCI
to+
V
LogicInputVoltage
VIN
toVCI+
V
LogicOutputVoltage
VOUT
toVCI+
V
OperatingTemp.range
TOPR
0to+50
℃
StorageTemp.range
TSTG
-25to+70
℃
7-2)PanelDCCharacteristics
Thefollowingspecificationsapplyfor:
VSS=0V,VCI=,TA=25℃
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
Singleground
VSS
-
-
0
-
V
LogicSupplyVoltage
VCI
-
V
Highlevelinputvoltage
VIH
-
-
-
V
Lowlevelinputvoltage
VIL
-
-
-
V
Highleveloutputvoltage
VOH
IOH=-100uA
-
-
V
Lowleveloutputvoltage
VOL
IOH=100uA
-
V
Maximumpowerpanel
PMAX
--
-
-
mW
Standbypowerpanel
TSTBY
-
-
-
TBD
mW
Typicalpowerpanel
PTYP
-
-
-
mW
Operatingtemperature
-
-
0
-
50
℃
Storagetemperature
-
-
-25
-
70
℃
Maximumimageupdate
Timeat25℃
-
-
-
1000
-
ms
Deepsleepmodecurrent
VCI
DC/DCoff
Noclock
Noinputload
Ramdatanotretain
-
2
5
uA
Sleepmodecurrent
VCI
DC/DCoff
Noclock
Noinputload
Ramdataretain
-
35
50
uA
-TheTypicalpowerconsumptionismeasuredwithfollowingpatterntransition:
fromhorizontal4grayscalepatterntovertical4grayscalepattern.(Note7-1)
-Thestandbypoweristheconsumedpowerwhenthepanelcontrollerisinstandbymode.
-Thelistedelectrical/opticalcharacteristicsareonlyguaranteedunderthecontroller&waveformprovidedbyWF
-Vcomisrecommendedtobesetintherangeofassignedvalue±.
Note7-1
TheTypicalpowerconsumption
7-3)PanelACCharacteristics
Thefollowingspecificationsapplyfor:
VSS=0V,VCI=,TA=25℃
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
InternalOscillatorfrequency
Fosc
VCI=to
1
MHz
7-3-1)MCUInterface
Note7-2:
LisconnectedtoVSS
Note7-3:
HisconnectedtoVCI
7-3-1-1)MCUInterfaceSelection
MCUinterfaceconsistof2data/commandpinsand3controlpins.ThepinassignmentatdifferentinterfacemodeissummarizedinTable7-1.DifferentMCUmodecanbesetbyhardwareselectiononBS1pins.Thedisplaypanelonlysupportsspi4orspi3interfacemode.
PinName
Data/CommandInterface
ControlSignal
Businterface
D1
D0
CS#
D/C#
RES#
SPI4
SDin
SCLK
CS#
D/C#
RES#
SPI3
SDin
SCLK
CS#
L
RES#
MCUinterfaceassignmentunderdifferentbusinterfacemode
7-3-1-2)MCUSerialInterface(4-wireSPI)
TheserialinterfaceconsistsofserialclockSCLK,serialdataSDIN,D/C#,CS#.InSPImode,D0actsasSCLK,D1actsasSDIN.
Function
CS#
D/C#
SCLK
WriteCommand
L
L
↑
Writedata
L
H
↑
ControlpinsofSerialinterface
Note7-9:
↑standsforrisingedgeofsignal
SDINisshiftedintoan8-bitshiftregisteroneveryrisingedgeofSCLKinorderofD7,D6,C#issampledoneveryeighthclockandthedatabyteintheshiftregisteriswrittentotheGraphicDisplayDataRAM(RAM)orcommandregisterinthesameclock.
Underserialmode,onlywriteoperationsareallowed.
7-3-1-3)MCUSerialInterface(3-wireSPI)
The3-wireserialinterfaceconsistsofserialclockSCLK,serialdataADINandCS#.
In3-wireSPImode,D0actsasSCLK,D1actsasSDIN,ThepinD/C#canbeconnectedtoanexternalground.
Theoperationissimilarto4-wireserialinterfacewhileD/C#pinisnotused.Therearealtogether9-bitswillbeshiftedintotheshiftregisteroneveryninthclockinsequence:
D/C#bit,D7toD0bit.TheD/C#bit(firstbitofthesequentialdata)willdeterminethefollowingdatabyteinshiftregisteriswrittentotheDisplayDataRAM(D/C#bit=1)orthecommandregister(D/C#bit=0).Underserialmode,onlywriteoperationsareallowed.
Function
CS#
D/C#
SCLK
WriteCommand
L
TieLOW
↑
Writedata
L
TieLOW
↑
Controlpinsof3-wireSerialinterface
Note7-10:
↑standsforrisingedgeofsignal
7-3-2)TimingCharacteristicsofSeriesInterface
◆SeriesInterfaceTimingCharacteristics
(VCI-VSS=Vtov,TA=25℃,CL=20pF)
Symbol
Parameter
Min
Typ
Max
Unit
tcycle
ClockCycleTime
250
-
-
ns
tAS
AddressSetupTime
150
-
-
ns
tAH
AddressHoldTime
150
-
-
ns
tCSS
ChipSelectSetupTime
120
-
-
ns
tCSH
ChipSelectHoldTime
60
-
-
ns
tDSW
WriteDataSetupTime
50
-
-
ns
tDHW
WriteDataHoldTime
15
-
-
ns
tCLKL
ClockLowTime
100
-
-
ns
tCLKH
ClockHighTime
100
-
-
ns
tR
RiseTime[20%~80%]
-
-
15
ns
tF
FallTime[20%~80%]
-
-
15
ns
◆Seriesinterfacecharacteristics
7-4)PowerConsumption
Parameter
Symbol
Conditions
TYP
Max
Unit
Remark
Panelpowerconsumptionduringupdate
-
-
56
80
mW
-
Powerconsumptioninstandbymode
-
-
-
TBD
mW
-
7-5)ReferenceCircuit
Figure.7-5
(1)
Figure.7-5
(2)
Figure.7-5(3)
Figure.7-5(4)
8.TypicalOperatingSequence
Initializedisplay:
Command22H
Data83H
Command20H
CommandF0H
Data
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