电路板术语总整理.docx
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电路板术语总整理.docx
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电路板术语总整理
電路板術語總整理
*****A*****
AbieticAcid松脂酸.
AbrasionResistance耐磨性.
Abrasives磨料,刷材.
ABS樹脂.
Absorption吸收(入).
AcImpedance交流阻抗.
AcceleratedTest(Aging)加速老化(試驗).
Acceleration速化反應.
Accelerator加速劑,速化劑.
Acceptability,Acceptance允收性,允收.
AccessHole露出孔,穿露孔.
Accuracy準確度.
AcidNumber(AcidValue)酸值.
AcousticMicroscope(AM)感音成像顯微鏡.
Acrylic壓克力(聚丙烯酸樹脂).
ActinicLight(orIntensity,orRadiation)有效光.
Activation活化.
Activator活化劑.
ActiveCarbon活性炭.
ActiveParts(Devices)主動零件.
Acutance解像銳利度.
AdditionAgent添加劑.
AdditiveProcess加成法.
Adhesion附著力.
AdhesionPromotor附著力促進劑.
Adhesive膠類或接著劑.
Admittance導納(阻抗的倒數).
Aerosol噴霧劑,氣熔膠,氣懸體.
Aging老化.
AirInclusion氣泡夾雜.
AirKnife風刀.
Algorithm演算法.
AliphaticSolvent脂肪族溶劑.
AluminiumNitride(AlN)氮化鋁.
AmbientTamp環境溫度.
Amorphous無定形,非晶形.
Amp-Hour安培小時.
AnalogCircuit/AnalogSignal類比電路/類比訊號.
AnchoringSpurs著力爪.
AngleofContack接觸角.
AngleofAttack攻角.
Anion陰離子.
Anisotropic異向性,單向的.
Anneal韌化(退火).
AnnularRing孔環.
Anode陽極.
AnodeSludge陽極泥.
Anodizing陽極化.
ANSI美國標準協會.
Anti-FoamingAgent消泡劑.
Anti-pitAgent抗凹劑.
AOI自動光學檢驗.
Apertures開口,鋼版開口.
AQL品質允收水準.
AQL(AcceptableQualityLevel)允收品質水準.
AramidFiber聚醯胺纖維.
ArcResistance耐電弧性.
Array排列.
Artwork底片.
ASIC特定用途績體電路器.
AspectRatio縱橫比.
Assembly組裝裝配.
A-stageA階段.
ATE自動電測設備.
Attenuation訊號衰減.
Autoclave壓力鍋.
Axial-lead軸心引腳.
Azeotrope共沸混合液.
*****B*****
BackLight(BackLighting)背光法.
BackTaper反錐斜角.
Backpanels,Backplanes支撐板.
Back-up墊板.
BalancedTransmissionLines平衡式傳輸線.
BallGridArray球腳陣列(封裝).
Bandability彎曲性.
BankingAgent護岸劑.
BareChipAssembly裸體晶片組裝.
Barrel孔壁,滾鍍.
BaseMaterial基材.
BasicGrid基本方格.
Batch批.
Baume波美度(凡液體比重比水重則Be=145-(145÷Sp.Gr)
凡液體比重比水輕則Be=140÷(Sp.Gr-130)
*Sp.Gr為比重即同體績物質對"純水"1g/cm的比值).
Beamlead光芒式的平行密集引腳.
Bed-of-NailTesting針床測試.
BellowsConact彈片式接觸.
BetaRayBackscatter貝他射線反彈散射.
Bevelling切斜邊.
Bias斜張綱布,斜纖法.
Bi-LevelStencil]雙階式鋼板.
Binder粘結劑.
Bits頭(DrillBits).
BlackOxide黑氧化層.
Blanking沖空斷開.
Bleack漂洗.
Bleeding溢流.
BlindViaHole肓通孔.
Blister局部性分層或起泡.
BlockDiagram電路系統塊圖.
Blockout封綱.
Blotting幹印.
BlottingPaper吸水紙.
BlowHole吹孔.
BluePlaque藍紋(錫面鈍化層).
BlurEdge(Circle)模糊邊帶(圈).
BombSight彈標.
BondStrength結合強度.
Bondability結合性.
BondingLayer結合層接著層.
BondingSheet(Layer)接合片.
BondingWire結合線.
Bow,Bowing板彎.
Braid編線.
Brazing硬焊(用含銀的銅鋅合金焊條).
在425℃~870℃下進行熔接的方式).
BreakPoint顯像點.
Break-awayPanel可斷開板.
BreakdownVoltage崩潰電壓.
Break-out破出.
Bridging搭橋.
BrightDip光澤浸漬處理.
Brightener光澤劑.
BrownOxide棕氧化.
BrushPlating刷鍍.
B-stageB階段.
BuildUpProcess增層法制程.
Build-up堆積.
Bulge鼓起.
Bump突塊.
BumpingProcess凸塊制程.
Buoyancy浮力.
BuriedViaHole埋導孔.
Burn-in高溫加速老化試驗.
Burning燒焦.
Burr毛頭.
BusBar匯電杆.
ButterCoat外表樹脂層.
*****C*****
C4ChipJointC4晶片焊接.
Cable電纜.
CAD電腦輔助設計.
CalenderedFabric軋平式綱布.
CapLamination帽式壓合法.
Capacitance電容.
CapacitiveCoupling電容耦合.
CapillaryAction毛細作?
?
.
Carbide碳化物.
CarbonArcLamp碳弧燈.
CarbonTreatment,Active活化炭處理.
Card卡板.
CardCages/CardRacks電路板構裝箱.
CarlsonPin卡氏定位稍.
Carrier載體.
Cartridge濾心.
Castallation堡型績體電路器.
CatalyzedBoard,CatalyzedSubstrate催化板材.
Catalyzing催化.
Cathode陰極.
Cation陰向離子,陽離子.
CaulPlate隔板.
Cavitation空泡化半真空.
Center-to-CenterSpacing中心間距.
Ceramics陶瓷.
Cermet陶金粉.
Certificate證明書.
CFC氟氫碳化物.
Chamfer倒角.
CharacteristicImpedance特性阻抗.
Chase綱框.
CheckList檢查清單.
Chelate螯合.
ChemicalMilling化學研磨.
ChemicalResistance抗化性.
Chemisorption化學吸附.
Chip晶片(粒).
ChipInterconnection晶片互連.
ChiponBoard晶片粘著板.
ChipOnGlass晶玻接裝(COG).
Chisel鑽針的尖部.
ChlorinatedSolvent含氯溶劑,氯化溶劑.
CircumferentialSeparation環狀斷孔.
Clad/Cladding披覆.
CleanRoom無塵室.
Cleanliness清潔度.
Clearance餘地,餘環.
ClinchedLeadTerminal緊箝式引腳.
Clinched-wireThroughConnection通孔彎線連接法.
ClipTerminal繞線端接.
Coat,Coating皮膜表層.
CoaxialCable同軸纜線.
CoefficientofThermalExpansion熱膨脹係數.
Co-Firing共繞.
ColdFlow冷流.
ColdSolderJoint冷焊點.
CollimatedLight平行光.
Colloid膠體.
ColumnarStructure柱狀組織.
CombPattern梳型電路.
ComplexIon錯離子.
ComponentHole零件孔.
ComponentOrientation零件方向.
ComponentSide組件面.
Composites,(CEM-1,CEM-3)複合板材.
CondensationSoldering凝熱焊接,液化放熱焊接.
Conditioning整孔.
Conductance導電.
ConductiveSalt導電鹽.
Conductivity導電度.
ConductorSpacing導體間距.
ConformalCoating貼護層.
Conformity吻合性,服貼性.
Connector連接器.
ContactAngle接觸角.
ContactArea接觸區.
ContactResistance接觸電阻.
Continuity連通性.
ContractService協力廠,分包廠.
ControlledDepthDrilling定深鑽孔.
ConversionCoating轉化皮膜.
Coplanarity共面性.
Copolymer共聚物.
CopperFoil銅皮.
CopperMirrorTest銅鏡試驗.
CopperPaste銅膏.
Copper-Invar-Copper(CIC)綜合夾心板.
CoreMaterial內層板材,核材.
CornerCrack通孔斷角.
CornerMark板角標記.
Counterboring方型擴孔.
Countersinking錐型擴孔.
CouplingAgent偶合劑.
Coupon,TestCoupon板邊試樣.
Coverlay/Covercoat表護層.
Crack裂痕.
Crazing白斑.
Crease皺折.
Creep潛變.
CrossectionArea截面積.
CrosshatchTesting十字割痕試驗.
Crosshatching十字交叉區.
Crosslinking,Crosslinkage交聯,架橋.
Crossover越交,搭交.
Crosstalk雜訊,串訊.
CrystallineMeltingPoint晶體熔點.
C-StageC階段.
Cure硬化,熟化.
CurrentDensity電流密度.
Current-CarryingCapability載流能力.
CurtainCoating濂塗法.
*****D*****
DaisyChainedDesign菊瓣設計.
DatumReference基準參考.
DaughterBoard子板.
Debris碎屑,殘材.
Deburring去毛頭.
DeclinationAngle斜射角.
Definition邊緣逼真度.
Degradation劣化.
Degrasing脫脂.
DeionizedWater去離子水.
Delamination分離.
DendriticGrowth枝狀生長.
Denier丹尼爾(是編織紡織所用各種紗類直徑單位,
定義9000米紗束所具有的重量(以克米計)).
Densitomer透光度計.
Dent凹陷.
Deposition皮膜處理.
Desiccator乾燥器.
Desmearing去膠渣.
Desoldering解焊.
Developer顯像液,顯像機.
Developing顯像.
Deviation偏差.
Device電子元件.
Dewetting縮錫.
D-glassD玻璃.
DiazeFilm偶氮棕片.
Dichromate重鉻酸鹽.
Dicing晶片分割.
Dicyandiamide(Dicy)雙氰胺.
Die沖模.
DieAttach晶粒安裝.
DieBonding晶粒接著.
DieStamping衝壓.
Dielectric介質.
DielectricBreakdownVoltage介質崩潰電壓.
DielectricConstant介質常數.
DielectricStrength介質強度.
DifferentialScanningCalorimetry(DSC)微差掃瞄熱卡分析法.
DiffusionLayer擴散層.
Digitizing數位化.
DihedralAngle雙反斜角.
DimensionalStability尺度安定性.
Diode二極體.
DipCoating浸塗法.
DipSoldering浸焊法.
DIP(DualInlinePackage)雙排腳封裝體.
Dipole偶極,雙極.
Direct/IndirectStencil直接/間接版膜.
DirectEmulsion直接乳膠.
DirectPlating直接電鍍.
DiscreteCompenent散裝零件.
DiscreteWiringBoard散線電路板,複綫板.
DishDown碟型下陷.
Dispersant分散劑.
DissipationFactor散失因素.
DisspationFactor散逸因數.
DisturbedJoint受擾焊點.
DoctorBlade修平刀,刮平刀.
DogEar狗耳.
Doping摻雜.
DoubleLayer雙電層.
DoubleTreatedFoil雙面處理銅箔.
DragIn/DragOut帶[進/帶出.
DragSoldering拖焊.
Drawbridging吊橋效應.
Drift漂移.
DrillFacet鑽尖切削麵.
DrillPointer鑽針重磨機.
DrilledBlank已鑽孔的裸板.
Dross浮渣.
DrumSide銅箔光面.
DryFilm幹膜.
DualWaveSoldering雙波焊接.
Ductility展性.
DummyLand假焊墊.
Dummy,Dummying假鍍(片).
Durometer橡膠硬度計.
DYCOstrate電漿蝕孔增層法.
DynamicFlex(FPC)動態軟板.
*****E*****
E-Beam(ElectronBeam)電子束.
EddyCurrent渦電流.
EdgeSpacing板邊空地.
Edge-BoardConnector板邊(金手指)承接器.
Edge-BoardContact板邊金手指.
Edge-DipSolderabilityTest板邊焊錫性測試.
EDTA乙二胺四乙酸.
Effluent排放物.
E-glass電子級玻璃.
Elastomer彈性體.
ElectricStrength(耐)電性強度.
Electrodeposition電鍍.
Electro-depositionPhotoresist電著光阻,電泳光阻.
Electroforming電鑄.
Electroless-Deposition無電鍍.
ElectrolyticToughPitch電解銅..
Electrolytic-Cleaning電解清洗.
Electro-migration電遷移.
Electro-phoresis電泳動,電滲.
Electro-tinning鍍錫.
Electro-Winning電解冶煉.
Elongation延伸性,延伸率.
Embossing凸出性壓花.
EMF(ElectromotiveForce)電動勢.
EMI(ElectromagneticInterference)電磁干擾.
Emulsion乳化.
EmulsionSide藥膜面.
Encapsulating膠囊.
Encroachment沾汙,侵犯.
EndTap封頭.
Entek有機護銅處理.
Entrapment夾雜物.
EntryMaterial蓋板.
EpoxyResin環氧樹脂.
EtchFactor蝕刻因數.
Etchant蝕刻劑(液).
Etchback回蝕.
EtchingIndicator蝕刻指針.
EtchingResist蝕刻阻劑.
EuteticComposition共融組成.
Exotherm放熱(曲線).
Exposure曝光.
Eyelet鉚眼.
*****F*****
Fabric綱布.
FaceBonding反面朝下結合.
Failure故障.
FanOutWiring/FanInWiring扇出佈線/扇入佈線.
Farad法拉.
Farady法拉第.
FatigueStrength抗疲勞強度.
Fault缺陷.
FaultPlane斷層面.
FeedThroughHole導通孔.
Feeder進料器.
FiberExposure玻纖顯露.
FiducialMark基準記號.
Filament纖絲.
Fill緯向.
Filler填充料.
Fillet內圓填角.
Film底片.
FilmAdhesive接著膜,粘合膜.
Filter篩檢程式.
FineLine細線.
FinePitch密腳距,密線距,密墊距.
Fineness粒度,純度.
Finger手指.
Finishing終修(飾).
FiniteElementMethod有限要素分析法.
FirstArticle首產品.
FirstPass-Yield初檢良品率.
Fixture夾具.
Flair刃角變形.
FlamePoint自燃點.
FlameResistant耐燃性.
FlammabilityRate燃性等級.
Flare扇形崩口.
FlashPlating閃鍍.
Flashover閃絡.
FlatCable扁平排線.
FlatPack扁平封裝(之零件).
Flatness平坦度.
FlexiblePrintedCircuit(FPC)軟板.
FlexuralFailure撓曲損壞.
FlexuralModule彎曲模數,抗撓性模數.
FlexuralStrength抗撓強度.
FlipChip覆晶,扣晶.
Flocculation絮凝.
FloodStrokePrint覆墨衝程印刷.
FlowSoldering(WaveSoldering)流焊.
Fluorescence螢光.
FlurocarbonResin碳氟樹脂.
FlushConductor嵌入式線路,貼平式導體.
FlushPoint閃火點.
Flute退屑槽.
Flux助焊劑.
FoilBurr銅箔毛邊.
FoilLamination銅箔壓板法.
Foot殘足(幹膜殘餘物).
FootPrint(LandPattern)腳墊.
ForeignMaterial外來物,異物.
Form-to-List佈線說明清單.
FourPointTwisting四點扭曲法.
FreeRadical自由基.
Freeboard幹舷.
Frequency頻率.
Frit玻璃熔料.
Fully-AdditiveProcess全加成法.
FungusResistance抗黴性.
FusedCoating熔錫層.
Fusing熔合.
FusingFluid助熔液.
*****G*****
G-10由連續玻纖所織成的玻纖布與
環氧樹脂粘結劑所複合成的材料.
Gage,Gauge量規.
GalliumArsenide(GaAs)砷化鎵.
GalvanicCorrosion賈凡尼式腐蝕(電解式腐蝕).
GalvanicSeries賈凡尼次序(電動次序).
Galvanizing鍍鋅.
GAP第一面分離,長刃斷開.
GateArray閘列,閘極陣列.
GelTime膠化時間.
GelationParticle膠凝點.
GerberData,GerberFile格博檔案(是美商Gerber公司專為PCB面線路
圖形與孔位元,所發展一系列完整的軟體檔案).
GhostImage陰影.
Gilding鍍金(現為:
GlodPlating).
GlassFiber玻纖.
GlassFiberProtrusion/Gouging,Groove玻纖突出/挖破.
GlassTransitionTemperature,Tg玻璃態轉化溫度.
Glaze釉面,釉料.
GlobTop圓頂封裝體.
GloubleTest球狀測試法.
Glycol(EthyleneGlycol)乙二醇.
GoldenBoard測試用標準板.
GrainSize結晶粒度.
GrassLeak大漏.
Grid標準格.
GroundPlane/EarthPlane接地層.
GroundPlaneClearance接地空環.
GuidePin導針.
Gull/WingLead鷗翼引腳.
*****H*****
Halation環暈.
HalfAngle半形.
Halide鹵化物.
Haloing白圈,白邊.
Halon海龍,是CFC"氟碳化物"的一種商品名.
HardAnodizing硬陽極化.
HardChromePlating鍍硬鉻.
HardSoldering硬焊.
Hardener(CuringAgent)硬化劑(或CuringAgent).
Hardness硬度.
Haring-BlumCell海固槽.
Harness電纜組合.
HayWire跳線.
HeatCleaning燒潔.
HeatDissipation散熱.
HeatDistortionPoint(Temp)熱變形點(溫度).
HeatSealing熱封.
HeatSinkPlane散熱層.
HeatTransfe
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