世界半导体生产机台安全设计验收标准.docx

世界半导体生产机台安全设计验收标准.docx

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世界半导体生产机台安全设计验收标准

世界半导体生产机台安全设计验收标准

精品汇编资料

GlobalSemiconductorSafetyServices,LLC

SEMIS2-93AProductSafetyAssessment

FinalReport

世界半导体生产机台安全设计验收标准

AppliedMaterials

ChemicalMechanicalPolishingSystem

Model:

MirraTrak

CMP工艺应用材料

June19,1998

Preparedfor:

AppliedMaterials

3111CoronadoDrive

SantaClara,CA95054

Preparedby:

GlobalSemiconductorSafetyServices,LLC

1313GenevaDrive

Sunnyvale,CA94089

GS3JobNo.980029

GS3DocumentNo.980029F2

Client-Confidential

保密合约

TheinformationusedtopreparethisreportwasbasedoninterviewswithAppliedMaterials’engineers.TheinformationwasalsobasedoninspectionsoftheChemicalMechanicalPolishingSystem,Model:

MirraTrak.ThisinformationwasgatheredovertheperiodbetweenFebruary2,1998andFebruary4,1998,andduringare-inspectionofthesystemonJune3,1998.ApreliminaryassessmentofthesystemwasalsoperformedonSeptember25,1996throughSeptember26,1996andtheresultsofthisevaluationwerealsoused.AllobservationsandrecommendationsarebasedonconditionsanddescriptionsoftheChemicalMechanicalPolishingSystem,Model:

MirraTrak,duringthetimeofdatacollectionanduponinformationmadeavailabletoGlobalSemiconductorSafetyServices.Thisreport'ssignificanceissubjecttotheadequacyandrepresentativecharacteristicsoftheChemicalMechanicalPolishingSystem,Model:

MirraTrak,andtothecomprehensivenessofthetests,examinationsand/orsurveysmade.

ReferencetoGlobalSemiconductorSafetyServices,includingreproductionofGlobalSemiconductorSafetyServices’servicemark,inpromotionalmaterials,ispermittedonlywithGlobalSemiconductorSafetyServices’expresswrittenconsent.

Theserviceperformedhasbeenconductedinaccordancewiththestandardscurrentlyacceptedinourprofession,andatthehighlevelofskillandcareexercisedbyGlobalSemiconductorSafetyServices’staff.

Lastly,thisreporthasbeenpreparedasaClient-Confidentialdocument,intendedfortheexclusiveuseofAppliedMaterialsandforthepurposeofdocumentationtoSEMIS2-93A.Therefore,nooutsidedistributionwilloccurunlesswrittenauthorizationisprovidedbytheclient.

TABLEOFCONTENTS

SectionPageNo.

Section1.0MANAGEMENTSUMMARY（管理摘要）

Section2.0SCOPE（范围）

Section3.0SYSTEMDESCRIPTION（系统描述）

Section4.0ASSESSMENT&TESTINGMETHODOLOGIES（试验方法）

Section5.0SAFETYASSESSMENT（安全评估）

5.1PURPOSE（目的）

5.2SCOPE（适用范围）

5.3SAFETYPHILOSOPHY（安全体系）

5.4GENERALGUIDELINES（指导方针）

5.5SAFETY-RELATEDINTERLOCKS（安全互锁）

5.6CHEMICALS（化学品）

5.7IONIZINGRADIATION

5.8NON-IONIZINGRADIATION

5.9NOISE（噪音）

5.10VENTILATIONANDEXHAUST（通风与排凤）

5.11ELECTRICAL

5.12EMERGENCYSHUTDOWN（紧急停机）

5.13HEATEDCHEMICALBATHS

5.14HUMANFACTORSENGINEERING

5.15ROBOTICAUTOMATION

5.16HAZARDWARNING（危险警告）

5.17EARTHQUAKEPROTECTION（地震警告）

5.18DOCUMENTATION（文件）

5.19FIREPROTECTION（消防保护）

5.20ENVIRONMENTALGUIDELINES（环境方针）

Section6.0RECOMMENDATIONS

Section7.0-ILLUSTRATIONS

ILLUSTRATION1-MirraTrakSystemLayout

ATTACHMENTONE-SURFACELEAKAGECURRENTTEST（泄漏测试）

ATTACHMENTTWO-GROUNDINGRESISTANCETEST（接地电阻测试）

ATTACHMENTTHREE-VERIFICATIONOFEMO（紧急按钮确认）

ATTACHMENTFOUR-SOUNDPRESSURELEVELSURVEY（声压测试）

ATTACHMENTFIVE-ERGONOMICCHECKLIST（人体功力检查表）

ATTACHMENTSIX-MANUALHANDLINGLIFTANALYSIS（手动操作分析）

ATTACHMENTSEVEN-揥HAT-IF?

”HAZARDANALYSIS（危险分析）

ATTACHMENTEIGHT-SEMIS10-1296RISKASSESSMENTGUIDELINEMETHODOLOGY

CONCLUSION

Section1.0MANAGEMENTSUMMARY

Afollow-upsafetyassessmentoftheAppliedMaterials’ChemicalMechanicalPolishingSystem,Model:

MirraTrak（hereafterreferredtoastheMirraTrak）,wasperformedfromFebruary2,1998throughFebruary4,1998.Afurtherre-inspectionofthesystemwasperformedonJune3,1998.ApreliminaryevaluationofthesystemwasalsoperformedonSeptember25,1996throughSeptember26,1996,andtheresultsofthisevaluationwerealsoutilizedinthisreport.Notethatthisreportcoversonlytheconcernsraisedbyintegratingthreeseparatesystems,theAppliedMaterialsFABSandMirraCMP,andtheOnTrakSynergyIntegra,whichtogetherformtheMirraTraksystem.Forfurtherinformationconcerningtheindividualcomponents,referencetheindividualSEMIS2-93Areportsfortheseunits.（GS3ReportNo.970668TF,datedJanuary30,1998fortheFABSsystem;GS3ReportNo.7-0100,datedSeptember2,1997fortheMirraCMPsystem;andGS3ReportNo.980094F,fortheOnTrakSynergyIntegra.）ThisreviewwasperformedusingthecriteriaestablishedbytheSemiconductorEquipmentandMaterialsInternationalSafetyGuidelinesforSemiconductorManufacturingEquipment（SEMIS2-93AGuidelines）.

GS3hasusedtheSEMIS10-1296GuidelineMethodologytoperformaRiskAssessmentofanyIssuesremainingafterthereviewoftheinformationprovidedbyAppliedMaterials.NotethattheseveritywasrankedbyGS3;theLikelihood（expectedrateofoccurrence）wasprovidedbyAppliedMaterials.Itemswhichwererankedonlyasa揕ow”or揝light”riskassessmentcategorymaybeconsideredasacceptablewithoutcorrectiveaction,baseduponcriteriaintheSEMIS10-1296Guidelines.

DuringthesafetyassessmentofMirraTrak,GS3identifiedseveralpositiveengineeringdesigns,aswellasseveralissuesthatwillneedtobeaddressedinordertoachievefullcompliancewithSEMIS2-93AGuidelines.Thisdescriptionofbothpositiveengineeringdesignandnon-conformanceissuesarecomprehensivelydescribedinSection5.0ofthisreport.ReferenceSection