导电光纤之特性研究Word文档格式.docx
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导电光纤之特性研究Word文档格式.docx
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Wun-HsingLee*李文興*,Che-MingHu胡哲明,S.T.Lin林世聰,
Yen-FeiHwang黃燕飛,andAlexZone鄒明宏
國立臺北科技大學機械工程系
ABSTRACT
Twodifferentconductiveopticalfibers(COF)weresuccessfullyproducedbythemethodsofsputtering,electrolessandelectroplating.Thesingle-modeplasticcoatingopticalfiberwasstrippedoffandthenimmersedintosolutionforsensitizationandactivationtreatment.TheconductivityofopticalfiberwasthenobtainedbyelectrolessorsputteringcoatingofNiorCu.Finally,amaximumthicknessof62.5μmNiorCumetalcoatinglayerisobtainedinthenickel-sulphamateandcopperplatingsolution.Michelsoninterferometerexperimentwasusedtoinvestigatethepossiblemicrocracks,voidformationordepletionattheinterfaceofmetalandglass-plate.AsuccessfulNi-Nicoatedopticalfiberweldedwith40μmAlwireontheCuplatewasobtained.Fortheweldabilityofthismetal-coatedopticalfiber’sdevelopment,anetworkofseveralfibersensorscanbesafelyembeddedthroughoutdifferentlocationsinabuildingcouldactasa“nervous“systemforstructuresupplyinginformationonitsstateofhealth.Fromtheresultsofnumericalcalculations,thechangesoftemperature,coefficientofthermalexpansion,modulusofelasticityandcoatingthicknessofmetalwouldaffectthemicrobendingloss.TheeffectsofdifferentCTEbetweenfiberandmetal-coatedlayerwillbeprofoundincomparisonwiththatofplasticcoatingcondition.Ni-NicoatingfiberhasabettertransmissionintensitythanthatofCu-Nicoating.
Keywords:
conductiveopticalfiber(COF),Ni,Cu,interferometer,weldability,microbendingloss.
摘要
本研究已成功的利用濺鍍、無電鍍、以及電鍍的方式製造出導電光纖並研究其焊接性、以及溫度對光傳輸的影響性,首先將單模塑膠光纖被覆剝皮後,浸入溶液中進行敏化和活化處理。
接著以無電鍍鎳或是無電鍍銅或是濺鍍的方式將光纖進行導體化處理,最後利用電鍍將光纖加厚至62.5m。
並以Michelson干涉實驗檢驗金屬與試片間可能會出現的孔洞與剝離的現象。
研究中成功的將Ni—Ni導電性光纖焊接在銅片上。
因為導電性光纖的可焊接性。
將來可將這種光纖以網路的方式佈置在結構體上,使成為有感結構以便線上得知該結構物的使用狀況。
從理論計算得知溫度、熱膨脹係數、導電材質彈性係數、厚度都會影響光纖的微曲損(microbendingloss)值。
而且光纖與金屬導體間熱膨脹係數差異性的影響比塑膠-光纖來的大,實驗結果顯示Ni-Ni鍍層光纖比Cu-Ni鍍層有較佳的光傳輸強度。
關鍵詞:
導電性光纖、鎳、銅、干涉、焊接性、微曲損。
投稿受理時間:
89年10月13日 審查通過時間:
89年12月7日
I.INTRODUCTION
1.1.Opticalfiberanditsapplications
Opticalfibercableshavebeenemployedextensively.Whentheyareusedinunclearpowerorchemicalplants,atolerancetoheatisspeciallyrequired.However,plasticcoatingsasconventionalmeansburntodecomposeunderfiresothatopticalfiberswouldbebrokeneasily.Conventionalplastic-coatedfibercannotbeemployedinhightemperatureconditions,orunderconditions,whichrequiresmechanicalstrengthandelectricalconduction[1].
Theopticalfibercanbeusednotonlyasacommunicationcablebutalsoasasensor,sincesomeengineeringfactors,suchasstrain,temperature;
willaffectthephysicalpropertiesoffibertransmission.Recently,opticalfibersensorsisbeingconsideredtobeembeddedwithincompositesforthemeasurementofinternalstrainandthedetectionofstructuraldamageinaerospaceapplicationsandcivilengineeringhasprovedtobeaneffectivenon-destructiveevaluation(NDE)techniqueandbecomethesubjectofsubstantialresearch[2].Opticalfibers,becausetheirsmallsizeandlightweight,offerthepossibilitytobeembeddedwithincementorconcretewithoutaffectingtheirpropertiesandusedassensitive,butrugged,transducersofmechanicalperturbations.Thebasicprinciplebehindembeddedfiberstocharacterizethestateofacompositematerialisthatlightsentthroughthefiberhasitsintensity,phase,wavelengthorpolarizationalteredbychangesinthemechanicalandthermalstateofthesurroundinghost.Inthisrespect,fibershavetheabilitytoprovideahighresolutiontemperatureandstrainmeasurements,detecttheonsetandgrowthofcracks,aswellastomonitorcreepandthermalstress[3,4].
1.2.Manufacturingprocessofconductiveopticalfiber
SeveralresearchershadattemptedtomakefibersconductivewithmetalscoatingsuchasAl[5],Pb[6]andSn[7]toformconductiveopticalfiber(COF).Itiswellknownthataconventionalmethodforformingmetalcoatingsforopticalfibers,topassfibersthroughabathcontainingmetalmeltinfiberdrawingprocess.Thisdippingmethod,however,suffersfromadisadvantageofagenerationofamicrobent,whichcausesanincreaseofatransmissionloss.Besides,thedegradationofthefiberstrengthiscausedbythereactionbetweenmoltenmetalandsilicafibersurface.Tanaka[7]discloseatechnologywherebyanadditionalstresscorrespondingtoastresscausingthemicrobentduringthecoolingofthedipmaterial,suchasaluminum(meltingtemperatureisabout700oC),isappliedtoanopticalfibertocompensatethemicrobent.Thus,thedippingmethodhasnotyetfoundwideacceptance.
Asanalternativetotheabove-mentioneddippingmethod,anunexaminedpatentpublicationdisclosesamethodofformingametalcoatingbyapplyinganelectroless(chemical)platingprocessonanopticalfiber[8].Theelectrolessplatingiscarriedoutatarelativelylowtemperature,whichisfreefromshrinkage,andthusamicrobentwillnotbecaused.Theformingofthemetalcoatingbytheelectrolessplatingprocess,however,suffersfromadisadvantageofalowmetalformationspeedwhenformingthemetalcoatingtoapredeterminedthicknessrequiredasacoating.Andthustheopticalfibermustbedippedintoanelectroless-platingbathforalongtime.Thelattercausesanincursionofhydrogenand/orwatertotheopticalfiber,whichcausesatransmissionlossoftheopticalfiberand/orreducesthemechanicalstrengthoftheopticalfiber.
Recentlydevelopednickelsulphamatesolutionsarewidelyusedinelectroformingandelectroplatingoperationstoobtainthick,ductile,adherentcoatingswithlowinternalstress[9].Atraditionalcoppercoatingisformedbyabrightcoppersulfateelectroplatingprocess.Bothofthesetwoplatingbathsaresimple,easytomaintain,andrelativelyinsensitivetoimpurities.
II.EXPERIMENTAL
2.1.Metalcoatingprocess
Single-modeopticalfiberssuppliedbyPrimeOpticalFiberCo.(POFC)werefirstcoatedwithmetaltobecomeconductive.Sincefiberisnotaconductivematerial,itisoughttoproceedconductingprocessinthebeginning.NiandCuamongvariousmetalelementswerespeciallychosenasconductivecoatingsincetheycanresistheatfairlywellcomparedtoothermaterials.Therearetwomajorwayshavebeenused.Oneisthephysicalvapordeposition,andtheotheristheelectrolessplating.Andafterconductingprocess,thethicknessofmetalcoatinglayerwillbeincreasedbythemethodofelectricalplating.
2.1.1.Conductingopticalfiberbythemethodofphysicalvapordeposition
Thereceivedopticalfiberisfirstlycutinto300mminlengthandthenstrippedoff.Priortodepositionthefiberswerecleanedultrasonicallyinacetoneandblowndrywithnitrogen,andimmediatelyplacedinthesputteringsystem.ApureNiorCutargetofsuppliedbyTargetMaterialsInc.wasusedasthesputteringsource.Rightbeforedeposition,thesputteringchamberwasevacuatedto1.0x10-7Paandthenbackfilledwithultrahighpurityargon(Ar).AllconductiveNiorCumetalwasdepositedat0.1PapartialpressureandArflowrateof100sccm.Theconductivefilmontheopticalfiberisoperatedat70oCfor30-60mintoachieveapproximately4-10μmmetalthickness.
2.1.2.Conductingopticalfiberbythemethodofelectrolessplating
Thereisanotherwaytoconducttheopticalfiber,whichiselectrolessplatingprocess.TheformationmechanismofelectrolessplatinghasbeenproposedbyPrasitSricharoenchaikit[10]in1993.Generalspeaking,itseemsimpossibletocoatsubstratewithathicknessover10μmbyusingelectrolessplatingmethod.Itisthereforenecessarytoapplyelectricalplatingtoincreasethethicknessofcoatinglayerifweexpect.Afterthenecessarycleaningprocess,sensitizationandactivationtreatment,solutionofNiklade25v/owithwaterbalanceisusedtoprocessNielectrolessplatingatthetemperatureof90oC.Similarly,asolutionofEC-86AandEC-86B50–50in20v/owithwaterbalanceisusedtoprocessCuelectrolessplatingatthetemperatureof25oC.
2.1.3.Electricalplatingprocess
Thechemicalcompositionsofplatingsolutionandplatingconditionsofelectricalplatingforfiberrefertoformerwork[11].Avolumeof800mlelectrolytewaspreparedinabeakerandultrasonicallydispersedforatleast3minutesbeforeplating.Aconductivefiberwaspositionedasacathode.Simultaneously,theanodewasapureNiorCuplate.Bothofthemwerepositionedintheelectrolyticcellverticallyandthetreatingtimeisapproximately50mintoachieveatotalthicknessof62.5μm.
2.2.ExaminationofCOF’sProperties
Thestructureofthedepositedfilms,intermsoftheextentofcrystallinity,wasanalyzedbyanX-raydiffractometer(Siemens,CuKa).Surfacemorphologiesofthemetalcoatingwereexaminedunderandopticalmicroscope(Nikon),ascanningelectronmicroscope(Jeol5300)anditsattachedEDXelementanalyzer.Thebondingphenomenonattheinterfaceofglassandmetal-coatinglayerwillbeexaminedbyamonochromatic0.633μminwavelengthemittedfromalightsourceofHe-NelaserofMichelsoninterferometer.Fig.1showstheschematicdiagramoftheapparatusarrangedinourlab.ThesystemconsistsofaHe-Nelaserlightsource,lens,spectroscope,mirror,andcamera.Aglassplatewithsizeof30mmx40mmx2mmwaselectrolessplatedwithNiorCuelementfor10mintoachieveacertainthickness,andthereafterelectricallyplatedwithNi.ThenthiscoatedglassplatewasputonthespecificpositionofMchelsoninterferometertoinspectthelightinterferredst
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