Advanced Thermal Management Materials.docx
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Advanced Thermal Management Materials.docx
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AdvancedThermalManagementMaterials
AdvancedThermalManagementMaterials
1.IntroductiontoThermalManagementinMicroelectronicsPackaging
1.5.1 Low-power-deviceThermalManagementMaterials
a. ThemostwidelyusedmaterialsareKovar,Invaralloys,andepoxyresinpackages
b. metalssuchasFe,Cu,W,Mo,andothers
1.5.2 High-power-deviceThermalManagementMaterials
a. SecondgenerationmaterialsW/Cu,Mo/Cu,AlSiC,andAlSi
1.5.3 Ultra-high-power-deviceThermalManagementMaterials
TheyincludecompositematerialsmadewithdiamondandCfiberwithveryhighthermalconductivity.Thecommercializedrepresentativesincludediamond/copper,diamond/aluminum,carbonfibercopper,andcarbonfiberaluminum
2.RequirementsofThermalManagementMaterials
2.1 Thermalconductivity
2.1.3MeasurethermalConductive
a. therearetwomethodstodeterminethermalconductivity:
steady-stateanddynamicmethods.
b. AccordingtotheFourierone-dimensionalsteady-stateheatconductionmodel,thermalconductivityiscalculatedbymeasuringtheheatfluxthroughasample,thetemperaturedifferenceatbothendsofthesample,andthethicknessofthesample.
c. Thedynamicmethodisdividedintoahot-wiremethodandalaserflashmethod.Themeasurementspeedishigh,buttheaccuracyisnot(5%).Thedynamicmethodissuitableforhigh-thermal-conductivitymaterialsorinhigh-temperatureconditions.Alaserflashisgenerallyusedtomeasurethethermalconductivityofthermalmanagementmaterials.
2.2Coefficientofthermalexpansion
2.2.2MethodsformeasuringCTE
TraditionalmethodsformeasuringtheCTEofsolidmaterialsincludepush-roddilatometer,opticalleverdilatometer,thedirectobservationmethod,opticalinterferometry,C-raymethod,thecapacitancemethod,andothers.
2.3HermeticityRequirementofThermalManagementMaterials
Inahermeticpackage,therequiredhermeticityislessthan1~5×10−9Pa.m3/s.
heairtightnessperformanceofmanydensemetalssuchasKovarisgood,andnoextratestingisrequired;butforcompositethermalmanagementmaterialssuchastherefractorymetalseriesW(Mo)–CuandthealuminummatrixcompositeseriesSiC(Si)/Al,whicharepreparedbypowdermetallurgy,achievinggoodairtightnessisoneofthekeytechnicalprocesschallenges.Iftheprocessisnotcontrolledproperly,problemsrelatedtotightnessqualitycouldoccur,causingtheentirebatchofproductstobescrapped.Inspectionofairtightnessduringtheproductionprocessisrequired.
2.4 OtherPerformanceRequirementsofThermalManagementMaterials
Electronicpackagingmaterialsmusthavehighmechanicalstrengthandgood
processingpropertiesinordertobeprocessedintoavarietyofcomplex-shapeparts.
Intheaerospacefieldandinsomeportableelectronicdevices,electronicpackaging
materialsmusthavelowerdensityinordertominimizetheweightofthedevices.
Inaddition,lowcostisrequiredformassproduction.
2.5 AppearanceQualityRequirementsofThermalManagementMaterials
2.5.1 SurfaceLayerofNickelandGoldPlatingPerformanceRequirements
componentsurfacesneedtobegoldplated.Beforetheyaregoldplated,thesurfacesneedtobe nickelplated.Forcertaindevices,nickelplatingcanfacilitatesilverandcoppersoldering.
Foranickelplatinglayer,athicknessofbetween100and
300micron.isrequired.
foragoldplatinglayer,athicknessofbetween50and100micron.isrequired.
2.5.2 QualityRequirementsofSurfaceAppearance
3.OverviewofTraditionalThermalManagementMaterials
2016年1月8日
13:
46
3.1CeramicMatrixConventionalThermalManagementMaterials
3.1.1 Al2O3ThermalManagementMaterials
Forpackagingapplications,99porcelainisthemostwidelyusedmaterial.
Ithas99.5Al2O3thermalmanagementmaterialsaremainlyusedasathick-filmcircuitsubstrate,thin-filmcircuitsubstrate,andmultilayersubstrate.%Al2O3content.
3.1.1.1Thick-filmSubstrate
Thick-filmcircuitsubstratesarefoundinapproximately90–97%ofAl2O3ceramics.
3.1.1.2Thin-filmSubstrate
SurfaceroughnAl2O3thick-filmceramicsubstrateshaveasurfaceroughnessof0.13–0.20mm.
Surfaceoughnessshouldbebelow0.025mmorbetter.
Al2O3withsmallergrainsandhigherpurityhasa
bettersurfacefinish.
3.1.1.3MultilayerSubstrateIntegratedCircuits
3.1.2BeOThermalManagementMaterials
BeOceramicsaredividedinto95,98,and99%BeOceramic
BeOceramicdustishighlytoxicandexpensive.
ThesinteringtemperatureofpureBeOceramicsis1,900°Cormore.Toreducethesinteringtemperature,Al2O3andMgO,andotheragentsareoftenadded.However,thermalconductivitycandropby15%withanadditional1%SiO2intheBeOceramic.
3.1.3AlNThermalManagementMaterials
3.1.4SiCThermalManagementMaterial
3.1.5MulliteThermalManagementMaterials
MullitemadeofAl2O3andSiO2istheonlystablebinarycompoundatnormalpressure.
Itschemicalformulais3Al2O3·2SiO2.
MulliteisanalternativematerialtoAl2O3andhasbeenextensivelydeveloped.Thedielectricconstant,CTE,ubstratedeformation,andstresscanbereducedbyaddingMgO.
3.1.6 MultilayerCofiredCeramics
3.2 TraditionalPlastic-basedThermalManagementMaterials
Epoxymoldingcompounds(EMCs)arecomposedofphenolicepoxyresin,phenolresin,filling(SiO2),moldreleaseagents,curingagents,dyes,etc.
Siliconerubberhasgoodheatagingresistance,UVagingresistance,andinsulatingproperties.ItismainlyusedinsemiconductorandLEDpackaging.
Polyimidecanwithstandtemperaturesofupto350–450°C.Ithasgoodinsulation,gooddielectricproperties,ndgoodresistancetoorganicsolventsandmoisture.Ithasbeenwidelyusedinthesemiconductorandmicroelectronicsindustry.
3.3PureMetalorAlloyTraditionalThermalManagementMaterials
3.3.1CuandAl
3.3.2RefractoryMetalsTungstenandMolybdenum
3.3.3KovarAlloy
3.3.4#10Steel
4.DevelopmentofAdvancedThermalManagementMaterials
2016年1月8日
15:
35
4.1introduction
4.2DevelopmentofAdvancedThermalManagementMaterials
Thedevelopmentofnewcompositematerialsforthermalmanagementisfocusedontwotypesofcompositematerials:
polymer-matrixcompositesandmetal-matrixcomposites.
Dependingonthecompositestructure,theycanbeclassifiedintoparticle-reinforced,fiber-reinforced,and“sandwich”-reinforcedstructures.
4.3Particle-enhancedThermalManagementMaterials
4.3.1 W-CuThermalManagementMaterial
4.3.2 Mo-CuThermalManagementMaterial
4.3.3ComparisonBetweenMo-CuandW-CuPackagingMaterials
Density
CTE
Specific
CopperWettability
moltencopperwetstungstenbetterthanmolybdenum
4.3.4AlSiCandAlSiThermalManagementMaterials
AlSiC
AlSi
4.3.5Cu/SiCandCu/SiThermalManagementMaterials
SiC/Cu
Cu/Si
4.3.6NegativeThermalExpansionMaterials,ThermalManagementMaterials
4.4 Fiber-reinforcedThermalManagementMaterials
BoronFiber
CarbonFiber
SiliconCarbideFiber
AluminaFiber
Cu/CfComposite
AluminumGraphiteMaterials
4.5SandwichStructureofCompositeMaterials
Copper/molybdenum/copper(CMC)andCopper/molybdenum-copper/copper(CPC)Materials
CIC(Cu/Invar/Cu)ThermalManagementMaterials
5.PropertiesofWCu,MoCu,andCu/MoCu/CuHigh-performanceHeatSinkMaterialsandManufacturingTechnologies
5.1PropertiesofWCu,MoCu,andCu/MoCu/Cu
5.1.1W-CuThermalManagementMaterial
5.1.2CopperMolybdenum(MoCu)ThermalManagementMaterials
5.1.3CMCCu/Mo/Cu
5.1.4Cu/Mo70Cu/Cu(CPC)
5.2WCuCompositeManufacturingTechnologies
5.2.1High-temperatureLiquid-phaseSintering
5.2.2ReactiveSintering反应烧结
5.2.3Infiltration渗透
5.3MoCuCompositeManufacturingTechnologies
MostMoCucompositesarefabricatedusingpowdermetallurgy,andtheprocessisverysimilartothatofW-Cu.
5.4CMC/CPCCompositeManufacturingTechnologies
Themostcommonlyusedmanufacturingtechnologiesincludehotrollinglamination,explosiveforming,andlasercladding
AresearchdiagramofW-CuandMoCumicroelectronicspackagingmaterialmanufacturingtechnologiesisgiveninFig.5.7.
6.NovelMethodsforManufacturingofW85-CuHeatSinksforElectronicPackagingApplications
TheresultantWskeletonafterprocessinginHVCattheelevatedtemperaturedisplayedsignificantlyhigherdensity,eliminatingtheneedforspecialformingandlubricatingagentsandotherpowder-heatingdevices。
Disadvantage
7.ImprovedManufacturingProcessofCu/Mo70-Cu/CuCompositeHeatSinksforElectronicPackagingApplications
Cu/Mo70Cu/CuisalaminatematerialwithMo70CusandwichedbytwothinlayersofCu.Duringtherollinglaminationprocess,MoparticlesinsidetheMo70CucompositeiselongatedintheX-direction(therollingdirection).TheresultantCu/Mo70Cu/Cuisanisotropic.TheX-directionhasalowerCTE(like7.0ppm/°Cfora1:
4:
1ratio),andtheY-directionhasahigherCTE(~9.0ppm/°Cfora1:
4:
1ratio).Materialphysicsstillworkshere,coupledwithrelativelyhighTC(upto300W/mKforthroughthickness),butthisuniquematerialfeaturemakesitveryattractiveforlongandthindieslikeLDMOS.Thischapterprovidesadetaileddiscussionofthebackgroundandfabricationofthismagicalmaterial.
8.AlSiCThermalManagementMaterials
8.2TypesofAluminumMatrixComposites
AMCscanbeclassifiedintofourtypesdependingonthetypeofreinforcement
(a)Particle-reinforcedAMCs
(b)Whisker-orshortfiber-reinforcedAMCs
(c)Continuousfiber-reinforcedAMCs
(d)Monofilament-reinforcedAMCs
8.3.4AluminumSiliconCarbide(AlSiC)forAdva
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