PCB行业专业词汇大全.docx
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PCB行业专业词汇大全.docx
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PCB行业专业词汇大全
PCB行业专业词汇大全—马建整理
*ProcessModule說明:
A.下料(CutLamination)
a-1裁板(SheetsCutting)
a-2原物料發料(Panel)(ShearmaterialtoSize)
B.鑽孔(Drilling)
b-1內鑽(InnerLayerDrilling)
b-2一次孔(OuterLayerDrilling)
b-3二次孔(2ndDrilling)
b-4雷射鑽孔(LaserDrilling)(LaserAblation)
b-5盲(埋)孔鑽孔(Blind&BuriedHoleDrilling)
C.乾膜製程(PhotoProcess(D/F))
c-1前處理(Pretreatment)
c-2壓膜(DryFilmLamination)
c-3曝光(Exposure)
c-4顯影(Developing)
c-5蝕銅(Etching)
c-6去膜(Stripping)
c-7初檢(Touch-up)
c-8化學前處理,化學研磨(ChemicalMilling)
c-9選擇性浸金壓膜(SelectiveGoldDryFilmLamination)
c-10顯影(Developing)
c-11去膜(Stripping)
D.壓合Lamination
d-1黑化(BlackOxideTreatment)
d-2微蝕(Microetching)
d-3鉚釘組合(eyelet)
d-4疊板(Layup)
d-5壓合(Lamination)
d-6後處理(PostTreatment)
d-7黑氧化(BlackOxideRemoval)
d-8銑靶(spotface)
d-9去溢膠(resinflushremoval)
E.減銅(CopperReduction)
e-1薄化銅(CopperReduction)
F.電鍍(HorizontalElectrolyticPlating)
f-1水平電鍍(HorizontalElectro-Plating)(PanelPlating)
f-2錫鉛電鍍(Tin-LeadPlating)(PatternPlating)
f-3低於1mil(Lessthan1milThickness)
f-4高於1mil(Morethan1milThickness)
f-5砂帶研磨(BeltSanding)
f-6剝錫鉛(Tin-LeadStripping)
f-7微切片(Microsection)
G.塞孔(PlugHole)
g-1印刷(InkPrint)
g-2預烤(Precure)
g-3表面刷磨(Scrub)
g-4後烘烤(Postcure)
H.防焊(綠漆):
(SolderMask)
h-1C面印刷(PrintingTopSide)
h-2S面印刷(PrintingBottomSide)
h-3靜電噴塗(SprayCoating)
h-4前處理(Pretreatment)
h-5預烤(Precure)
h-6曝光(Exposure)
h-7顯影(Develop)
h-8後烘烤(Postcure)
h-9UV烘烤(UVCure)
h-10文字印刷(PrintingofLegend)
h-11噴砂(Pumice)(WetBlasting)
h-12印可剝離防焊(PeelableSolderMask)
I.鍍金Goldplating
i-1金手指鍍鎳金(GoldFinger)
i-2電鍍軟金(SoftNi/AuPlating)
i-3浸鎳金(ImmersionNi/Au)(ElectrolessNi/Au)
J.噴錫(HotAirSolderLeveling)
j-1水平噴錫(HorizontalHotAirSolderLeveling)
j-2垂直噴錫(VerticalHotAirSolderLeveling)
j-3超級焊錫(SuperSolder)
j-4.印焊錫突點(SolderBump)
K.成型(Profile)(Form)
k-1撈型(N/CRouting)(Milling)
k-2模具沖(Punch)
k-3板面清洗烘烤(Cleaning&Backing)
k-4V型槽(V-Cut)(V-Scoring)
k-5金手指斜邊(BevelingofG/F)
L.短斷路測試(ElectricalTesting)(Continuity&InsulationTesting)
l-1AOI光學檢查(AOIInspection)
l-2VRS目檢(Verified&Repaired)
l-3汎用型治具測試(UniversalTester)
l-4專用治具測試(DedicatedTester)
l-5飛針測試(FlyingProbe)
M.終檢(FinalVisualInspection)
m-1壓板翹(WarpageRemove)
m-2X-OUT印刷(X-OutMarking)
m-3包裝及出貨(Packing&shipping)
m-4目檢(VisualInspection)
m-5清洗及烘烤(FinalClean&Baking)
m-6護銅劑(ENTEKCu-106A)(OSP)
m-7離子殘餘量測試(IonicContaminationTest)(CleanlinessTest)
m-8冷熱衝擊試驗(ThermalcyclingTesting)
m-9焊錫性試驗(SolderabilityTesting)
N.雷射鑽孔(LaserAblation)
N-1雷射鑽Tooling孔(LaserablationToolingHole)
N-2雷射曝光對位孔(LaserAblationRegistrationHole)
N-3雷射Mask製作(LaserMask)
N-4雷射鑽孔(LaserAblation)
N-5AOI檢查及VRS(AOIInspection&Verified&Repaired)
N-6BlaserAOI(afterDesmearandMicroetching)
N-7除膠渣(Desmear)
N-8微蝕(Microetching)
A/W(artwork)底片Ablation燒溶(laser),切除
abrade粗化abrasionresistance耐磨性
absorption吸收ACC(accept)允收
acceleratedcorrosiontest加速腐蝕acceleratedtest加速試驗
acceleration速化反應accelerator加速劑
acceptable允收activator活化液
activeworkinprocess實際在製品adhesion附著力
adhesivemethod黏著法airinclusion氣泡
airknife風刀amorphouschange不定形的改變
amount總量amylnitrite硝基戊烷
analyzer分析儀anneal回火
annularring環狀墊圈;孔環anodeslime(sludge)陽極泥
anodizing陽極處理AOI(automaticopticalinspection)自動光學檢測
applicabledocuments引用之文件AQLsampling允收水準抽樣
aqueousphotoresist液態光阻aspectratio縱橫比(厚寬比)
Asreceived到貨時backlighting背光
back-up墊板bankedworkinprocess預留在製品
basematerial基材baselineperformance基準績效
batch批betabackscattering貝他射線照射法
beveling切斜邊;斜邊biaxialdeformation二方向之變形
black-oxide黑化blankcontroller空白對照組
blankpanel空板blanking挖空
blip彈開blister氣泡;起泡
blistering氣泡blowhole吹孔
board-thicknesserror板厚錯誤bondingplies黏結層
bow;bowing板彎breakout從平環內破出
bridging搭橋;橋接BTO(BuildToOrder)接單生產
burning燒焦burr毛邊(毛頭)
camcorder一體型攝錄放機carbide碳化物
carlsonpin定位梢carrier載運劑
catalyzing催化catholicsputtering陰極濺射法
caulplate隔板;鋼板calibrationsystemrequirements校驗系統之各種要求
centerbeammethod中心光束法centralprojection集中式投射線
certification認證chamfer倒角(金手指)
chamfering切斜邊;倒角characteristicimpedance特性阻抗
chargetrans
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