Method of supplying slurry and a slurry supply appWord下载.docx
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Method of supplying slurry and a slurry supply appWord下载.docx
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BACKGROUNDOFTHEINVENTION
1.FieldoftheInvention
Thepresentinventionrelatestogenerallytosupplyingslurryinmanufacturingprocessesand,moreparticularly,toamethodofsupplyingslurryandaslurrysupplyapparatusforsupplyingslurrytoachemicalmechanicalpolishing(CMP)machineusedinplanarizingsurfacesofsemiconductordevicesduringsemiconductorfabrication.
2.DescriptionofRelatedArt
Assemiconductordevicesbecomemorehighlyintegrated,aplanarizationtechniqueusingachemicalmechanicalpolishing(CMP)machineistypicallyemployed.TheCMPmachinetypicallyusesaslurrycomprisedofanabrasivematerialandadilutingagentandpossiblyacuringagenttocreateasolutionthathasapolishingselectivitywithrespecttoanunderlyinglayerthatactsasaCMPstoppinglayer.Selectionofaparticularslurrydependsonthesemiconductorlayerstobepalanarized.Forexample,asilica-based(SiO2)slurryistypicallyusedforplanarizingasiliconoxidelayerwithasiliconnitridelayerbeingusedastheCMPstoppinglayer,whileanalumina-based(Al2O3)slurryiswidelyusedforplanarizingacopperlayeroratungstenlayer.Similarly,aceria-based(CeO2)slurrymaybeusedforapplicationswhereahigherpolishingselectivitythanthatofthesilica-basedslurryisrequired.
AconventionalslurrysupplyapparatusforsupplyingtheslurrytotheCMPmachinecomprisesamixingtankwhereinundilutedslurryisdilutedwithde-ionizedwater.Themixingtankmayincludeoneormoresensorsformeasuringandcontrollingthecompositionoftheresultingslurry.TheconventionalslurrysupplyapparatusmayfurtherincludeasupplytankthatstoresthedilutedslurrycreatedinthemixingtankuntilitisdeliveredtoapolishingpadoftheCMPmachineviadeliveryconduits.
Disadvantageously,unlesstheslurriesarekeptinanagitatedorsuspensionstate,abrasiveparticleswillprecipitateoutofthesolutionandsolidifyininterconnectingconduitsofthedeliverysystem.Further,suchprecipitatedparticlesflowoutoftheslurrysupplyapparatusinanirregularmanner,therebydegradingtheuniformityofthechemicalmechanicalpolishingprocess.Asaresult,itisdifficulttosupplyslurryhavingauniformconcentrationanduniformmixingratiotothepolishingpadandthusdifficulttoperformauniform,reliableandstableCMPprocess.
Conventionalapproachestoresolvingtheproblemsassociatedwithprecipitationandcoagulationofparticulateshavebeentoeither:
1)addare-circulationlooptotheconduitdeliverysystem;
or2)combinetheseparateslurrycomponentsolutionsasclosetoapointofuse(POU)aspossible(i.e.atthepolishingpadoftheCMPsystem.)Inthere-circulationloopapproach,additionalconduitsarearrangedtoformare-circulationloop,whereinthepre-mixeddilutedslurrysolutioniscontinuouslypumpedthroughthesystemconduitstokeepthesolutioninanagitatedornon-precipitatingstate.Asaquantityofsolutionisrequiredatthepolishingpad,itisportedviaadispensingbranchorconduittoadispensingnozzle,andthencetothepolishingpad.Alternatively,withthePOUsystem,theseparatechemicalsarenotmixeduntilafinalstageofthesupplyconduitsystem,thusrequiringnocontinuousagitationmechanism.
BothoftheseapproacheshavesignificantdisadvantagesthateffectoverallCMPsystemperformanceandquality.Inthepre-mixedre-circulationsystem,slurrycompositioncannotbeeasilymodifiedassystemrequirementschange(i.e.todeliverapolishingabrasivehavingadifferentratioofun-dilutedslurrytodilutingagent.)InthePOUsystem,deliveryofaproperlymixedsolutionatthepolishingpadcannotbeguaranteed,resultinginaportionofadevicebeingplanarizedusingaverycoarseandpredominatelyun-dilutedslurrywhileanotherportionofthedeviceisplanarizedsolelywiththenon-abrasivedilutingsolution.Further,whenacuringagentisused,thepre-mixedslurrysolutionmustbedeliveredandusedwithinapredeterminedperiodoftime,beforetheslurrycures.
Toovercomethepre-mixedslurryproblemofthere-circulatedapproachandparticularlythetimelimitationsduetothecuringadditive,theCMPoperationwouldnecessarilybehaltedwhilethesolutioneitherwaschangedentirelyorwasre-mixedandre-circulatedtoattainanewsolutionmixratio.Ineitherevent,any“old”solutionthatmayremainintheconduitsbeyondthere-circulationlooptowardthepolishingpadwouldhavetoberemovedtoavoidcontaminationatthepolishingpadbeforeanewsolutionhastraversedthedispensingconduitandnozzle.
Toovercomethenon-uniformmixingproblematthedispensingnozzleofthePOUapproach,theindividualslurrycomponentsolutionsmaybecombinedataconduitlocationafurtherdistancebackfromthedispensingnozzle.Thisallowsmoreturbulencemixingtooccurbeforetheslurryisdispensed.WhilesuchadisplacementallowsforanengineeringtradeoffbetweenaPOUmix-changeflexibilitywithmoreuniformmixingpriortothedispensingnozzle,thefurtherawayfromthedispensingnozzle,thegreaterthechanceofoccurrenceoftheaforementionedchanged-solutioncontaminationandprecipitationoftheparticulatesintheun-agitateddilutedslurry.
SUMMARYOFTHEINVENTION
Intheembodimentsofthepresentinvention,aslurrymixinganddispensingsystempreferablycomprisesoneormoreelementsforthestorage,mixing,pumping,filtering,androutingofamixtureofpolishingslurryforapplicationsinachemicalmechanicalpolishing(CMP)apparatus.Primaryfeaturesinclude1)re-circulationloopsforkeepingaslurrysolutioninanagitatedandsuspendedstate,and2)providingefficientmixingofchemicaladditives,suchastime-sensitivecuringchemicalsonlyatornearthepointofuse.Bymaintainingseparatere-circulatingloopsforeachchemicaltobesuppliedasacomponentpartofaCMPpolishingcompound,mixtureuniformitycanbeattained.Thisallowsfordelayedmixing,whichinsuresthatunusedpre-mixedpolishingcompoundisnotlostuponoperationalchangesinaslurrycompositionormixture.Eachre-circulationloopmayincludepumps,valves,filters,andconduitsfortheportingandtransferofslurryandadditivesolution.
Inafirstembodimentaccordingtothepresentinvention,asystempreferablycomprisesasourceofanun-dilutedslurrysolution,asourceofadilutingsolution,andasourceofachemicaladditivesolution,withnecessaryinterconnectingconduits,valves,filters,andpumpsforselectivelydeliveringthesolutionstoanin-linemixinganddispensingunit.Inthefirstembodiment,anun-dilutedslurrystoragetankispreferablyconnecteddirectlytothein-linemixinganddispensingunit.Thedilutingsolutionsourceandthechemicaladditivesourceisalsoconnecteddirectlytothein-linemixinganddispensingunit.AcomputerpreferablycontrolstheprocessfortransferringandmixingthevariouschemicalsinadesiredratioasrequiredbyaparticularCMPoperation.
Afirstembodimentofamethodforcirculatinganddispensingapolishingsolutionontoasurfaceofasemiconductorwaferaccordingtothepresentinventioncomprises:
1)introducinganundilutedslurrysolutiontoastoragetank,2)pumpingtheundilutedslurrysolutionfromthestoragetanktoanin-linemixingunitandthenbacktothestoragetank,and3)inresponsetoafirstsignalfromthecontroller,dispensingacontrolledamountoftheundilutedslurrysolutionontothesurfaceofthesemiconductorwaferthroughthedispensingconduitviaafirstsolutionflowcontrolvalveinthein-linemixingunit.
Additionally,inresponsetoasecondsignalfromthecontroller,asecondsolutionflowcontrolvalveinthein-linemixingunitmaybeusedtointroduceanadditivesolutionformixingwiththeundilutedslurrysolutiontoformafirstmixedsolution,whichisdispensedontothesurfaceofthesemiconductorwaferthroughthedispensingconduit.Theadditivemaybeselectedfrompolymericsolutionsandoxidizingsolutions.
Moreover,inresponsetoathirdsignalfromthecontroller,athirdsolutionflowcontrolvalvemaybeusedtointroduceathirdsolutiontothein-linemixingunittobemixedwiththefirstandsecondsolutiontoformasecondmixedsolution,whichisdispensedontothesurfaceofthesemiconductorwaferthroughthedispensingconduit.Thethirdsolutionmaybe,e.g.,de-ionizedwater.
Aslurryre-circulatinganddispensingsystemaccordingtoanalternateembodimentofthepresentinventioncomprises:
1)astoragetank,havingare-circulationloop,forreceivingandlocallyre-circulatinganun-dilutedslurrysolution,2)amixingtankformixingtheun-dilutedslurrywithadilutingsolution,suchasde-ionizedwater,tocreateadilutedslurrysolution,and3)anin-linemixingunitforreceivingthedilutedslurrysolutionandoptionallymixingitwithachemicaladditivetoformthesecondmixedsolution,whichisdispensedontothesurfaceofthesemiconductorwaferviaaminimizedlengthdispensingconduit.
Analternatemethodforcirculatinganddispensingasolutionontoasurfaceofasemiconductorwaferaccordingtothepresentinventioncomprises:
1)introducinganundilutedslurrysolutiontoastoragetank,2)inresponsetoafirstmixingcontrolsignalfromthecontroller,pumpingtheundilutedslurrysolutionfromthestoragetanktoamixingtanktocreateamixedsolution,i.e.,adilutedslurrysolution,byaddingadilutingsolution,suchasde-ionizedwater,3)pumpingthemixedsolutionfromthemixingtanktoanin-linemixingunitand
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