PCBA检验规范Word文件下载.docx
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PCBA检验规范Word文件下载.docx
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Itfitsallproduct(containingproductandPCBA)appearanceinspection,includingPCBAmadebyselforbyotherpanyandother、
3名词解释(Wordsexplanation)
无(None)
4参考文件(Referencedocument)
ANS/IPC-A-610D
5职责(Responsibility)
5.1生产单位(Productionunit):
负责产品检验之执行、
Beresponsiblefordoingproductinspection
5.2质量管理部(Qualityunit):
负责产品规格之制定及产品品质之抽样检验管制
Beresponsibleformakingproductspecificationandcontrollingthespotcheckofproductquality
6作业流程及内容(Flowchartandcontent)
6、1检验前得准备(preparationforinspecting):
检验前须先确认所使用得工具,材料,胶,清洁剂等,就是否合乎规定、检验PCBA时必须配戴防静电手套或防静电手环,而成品有外壳部分则不在此限、
Beforeinspecting,besureofthetool,material,glue,cleanser,etc、OperatorshouldhavewriststraporelectrostaticgloveforpreventionESD(ElectronicstaticDischarge),butthefinishedgoodwith。
6、2
若有检验标准未规范得异常现象发生时,不代表该产品允收或拒收,应向值班工程师询问。
Itisnotmeanstheproductacceptorrejectthatthestandardofinspectionhavesomeabnormal,butshouldfeedbacktoengineertoconfirm、
6、3
检验环境要求光线充足,以目视为主,辅以放大镜与卡尺
6、4
外观检验项目基准参见附件一~三。
TheitemofcosmeticinspectionstandardreferenceAppendix1to3、
7修订权限(Authorityofmodification)
本规范由质量管理部工程师撰写,经研发单位及生产单位会签,由质量管理部最高主管核准后实施,修改程序亦同、
ThiscriteriaispreparedbyQualityunitengineerandsignedoffwithR&
D(ResearchandDevelopdepartment)andProductionunit,andthenapprovebyQualitymanager、Modifyprocedureasthesameabove、
8附件Attachment(含记录表单)
8、1附件一:
PCBA
Appendix1:
PCBA
8、2附件二:
机构类
Appendix2:
Mechanical
8、3附件三:
其它
Appendix3:
Other
附件预览总表
附件一:
PCBA类
附件二:
机构类(Mechanical)
附件三:
其它(Other)
1SMT零件(SMTponent)
1-1焊点规格(Soldering
SPEC)
1-2焊点异常(Soldering
abnormal)
1-3零件损坏(ponent
damage)
1-4点胶(Stakingadhesive
gluing)
1外壳(Housing)
1标签(Label)
2托架,承座(Chassis)
2Barcode
3铭板(Overlay)
3包装袋(PEbag)
4散热片(Heatsink)
4外箱(Carton)
5绝缘片(Insulator)
5Housing
6螺丝,螺帽,垫片(Screwnut)
7DCseriesconverter系列成品外观检验标准
2Dip零件(DIPponent)
2-1焊点规格(DIPSPEC)
2-2引脚突出(Leadprotrusion)
2-3通孔(PTH)
2-4插件外观(Appearance)
2-5点胶(Adhesivegluing)
2-6DIP高翘(DIPponent
lifted)
8Transformer
9Shieldingcover外观检验标准
6PCB
3-1marking
3-2外观(Surface
appearance)
3-3焊锡性(Solderability)
7Connector,PIN&
金手
指(Goldenfinger)
8其它(Other)
5-1螺丝(Screw)
5-2跳线(Jump)
1-1焊点规格(SolderingSPEC)
1-1-1Chip零件(Chipponent)
Defect
Sideoverhang(D)isgreaterthan50%ponentterminationwidth(W)or50%landwidth(P)whicheverisless
零件偏移D>
50%W或D>
50%P拒收
Defect
Anyendoverhang(B)
零件超出pad拒收
ponentinreservedtolacquertogotocircuittoformashortcircuit
零件在有保护漆之线路上造成短路拒收
Acceptable
Endjointwidth(C)isminimum50%ofponentterminationwidth(W)or50%landwidth(P)whicheverisless
零件焊点宽度C>
50%WorC>
50%P允收
Maximumfilletheight(E)mayoverhangthelendorextendontotheoftheendcapmetallization,butnotextendfurtherontotheponentbody
锡高超过金属端,但未延伸至零件本体允收
Solderfilletextendsontotheponentbody
锡延伸到零件本体上拒收
Minimumfillethigh(F)islessthan25%terminationhigh(H),orfillethigh(F)islessthan0、5mm
Highvoltagecapacitanceminimumfillethigh(F)islessthan50%terminationhigh(H),orfillethigh(F)islessthan0、75mm
爬锡高度F<
25%H或F<
0、5mm拒收
高压电容爬锡高度F<
50%H或F<
0、75mm拒收
Insufficientsolder
锡不足拒收
Insufficientendoverlap
空焊拒收
1-1-2圆柱体零件(CylindricalEndCapTermination)
Sideoverhang(A)isgreaterthan50%ofponentdiameter,(W),orlandwidth(P),whicheverisless
零件直径突出A>
50%Wor>
50%P、拒收
Endjointwidth(C)isminimum50%ponentdiameter(W)orlandwidth(P),whicheverisless
零件连接直径宽度C≧50%Wor50%P允收
Sidejointlength(D)isminimum50%lengthofponenttermination(T)orlandlength(S),whicheverisless
侧面焊点长度D≧50%Tor50%S允收
Minimumfilletheitht(F)issolderthickness(G)plus25%diameter(W)oftheponentendcap
焊锡高度F≧25%(G+W)允收
Endoverlap(J)betweentheponentterminationandthelandisminimum50%thelengthoftheponenttermination(T)
零件末端与PAD重叠部分J≧50%T允收
Endoverlap(J)islessthan50%ofthelengthofponent
零件末端与PAD重叠部分J<
50%T拒收
1-1-3Leadlesschip
Sideoverhang(A)exceeds50%castellationwidth(W)
侧面偏移A>
50%W拒收
Endjointwidth(C)islessthan50%castellationwidth(W)
零件末端焊点宽度C<
Minimumsidejointlength(D)islessthan50%minimumfilletheight(F)orlandlengthexternaltopackage(S),whicheverisless
零件末端焊点长度D<
50%S或50%F拒收
Minimumfilletheight(F)is25%castellationheight(H)
焊锡高度F<
25%H拒收
零件超出pad拒收
1-1-4扁平、L型与翼型引脚(FlatRibbon,L,andGullWingLeads)
Maximumoverhang(A)isnotgreaterthan50%leadwidth(W)
侧面偏移A≦50%W允收
Sideoverhang(A)isgreaterthan50%leadwidth(W)
50%W拒收
Minimumendjointwidth(C)isless50%leadWidth(W)
焊点宽度C<
Sidejointlength(D)islessthan80%ofleadlength(L)
焊锡长度D<
4/5L拒收
Soldertouchesthebodyorendsealofhigh-leadconfigurationponent
焊锡延伸至零件本体上或封装末端拒收
爬锡高度:
Fillet接触到正面吃锡面允收
Soldertouchespackagebody
锡延伸到零件本体上拒收
Transformerhighvoltagepin’ssolderisovertheAcornerportion,butexnofunctionpin(forallinverters,exceptspecialcase)
变压器高压Pin吃锡度已达到A处(第一弯角处)允收
Acceptable
SolderisovertheBportion(forallinverters,exceptspecialcase)
吃锡度超出B处允收
SolderisalreadyovertheBportion,andbobbinhadBeendamagedbyiron、
Bobbin被烙铁烫伤拒收
Minimumheelfilletheight(F)islessthan25%leadthickness(T)
25%T拒收
Sideoverhang(A)isgreaterthan50%leadwidth/diameter(W)
零件偏移A>
Minimumendjointwidth(C)islessthan50%leadwidth/diameter(W)
焊锡宽度C<
Sidejointlength(D)islessthan80%leadlength
焊锡长度D小于4/5引脚长度拒收
Soldertouchesthepackageorendseal
焊锡延伸至零件本体上或封装末端拒收
Minimumsidejointheight(Q)islessthansolderthickness(G)plus50%diameter(W)ofroundleador50%thicknessofleadatjointside(T)forcoinedlead
焊锡高度Q<
G+50%WorQ<
G+50%T拒收
1-1-6J形引脚(JLeads)
Sideoverhang(A)isgreaterthan50%W
偏移宽度A>
Minimumendjointwidth(C)is50%leadwidth(W)
焊锡宽度C≧50%W允收
Sidejointfillet(D)lessthan150%leadwidth
焊锡宽度(D)小于150%引脚宽度(W)拒收
Solderfillettouchespackagebody
焊锡延伸至零件本体上拒收
1-1-7I形引脚(Butt/IJoints)
Anytoeoverhang(B)
侧边突出拒收
Endjointwidth(C)islessthan75%leadwidth(W)
75%W拒收
Filletheight(F)islessthan0、5mm[0、02inch]
焊锡高度(F)小于0、5mm拒收
1-1-8向内L型引脚(InwardformedL-shapedribbonleads)
Endjointwidth(C)islessthan50%leadwith(W)
Sideoverhang(A)isgreaterthan50%W
Minimumfilletheight(F)islessthan25%E
焊锡宽度C<
50%W拒收
偏移宽度A>
焊锡高度F<
25%拒收
Minimumendjointwidth(C)isgreaterthan50%leadwith(W)
焊锡宽度C≧50%W允收
1-1-9BGA零件(Areaarray/Ballgridarray)
Morethan50%overhang
偏移50%拒收
Solderbridge
锡桥拒收
DarkspotsinX-Rayviewthebridgebetweensolderjoints
在X-Ray下焊点间桥接或拒收
Solderopen
锡散开拒收
Missingsolder
漏锡拒收
Solderball(S)thatbridgemorethan25%ofthedistancebetweentheleads
锡珠超出焊点间距25%拒收
Fracturesolderconnection
锡裂拒收
1-2焊点异常(Solderingabnormal)
1-2-1侧立(Mountingonside)
Chipresistancemountingonside
电阻侧立拒收
Chipcapacitance&
Inductanceminimumtypeislessthan1206,mountingonsideandnomorethanfive(5)chiponeachassemblyaremountedsideways
电容,电感类零件小于1206(含)以下,且单面少于5pcs允收
1-2-2翻件(Mountingupsidedown)
ElementofchipponentwithexposeddepositedelectricalElementismountedtowardboard
能导通允收
1-2-3墓碑(Tombstone)
Chipponentstandingontheirterminalend(Tombstone)
墓碑拒收
1-2-4共平面(Coplanarity)
Oneleadorseriesofleadsonponentisoutalignmentandfailstomakepropercontactwiththeland
零件得一个或多个引脚变形,不能与pad正常接触拒收
1-2-5锡未完全熔化(Reflownotplete)
Inpletereflowofsolderpaste
锡未完全熔化拒收
1-2-6空焊(Nonwetting)
Solderhasnotwettedtothelandortermination
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