品质管理英语词汇分类大全Word格式.docx
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品质管理英语词汇分类大全Word格式.docx
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Nicks;
32Stickingofpartsinthemold刮伤成品离模不良13SilverStreaking33ColdFlow银条冷流14ShortShot(Filling)34Warpage填充不足翘曲15SurfacePeeling35FlashMark表面剥落亮斑16Void36Colorstain气泡异色点17WeldLine;
KnitLine37Oil;
Grease;
结合线油污18FingerPrints(Marks)38WhiteSpot(Mark)指印(痕)白点(斑)19PaintAdhesion39粘漆变形20ColorMismatch40色不匹配2.MetalPartsNo.No.中文名称
英文名称中文名称英文名称1Corrosion5PoorCoating腐蚀,铁锈外被不良2Scratches6SharpEdges(sawburrs)刮伤毛刺3Bumps7PoorPlating踫伤电镀不良4Stains污点CablePartsNo.No.中文名称英文名称中文名称英文名称1Grease;
Oils7ObviousBurrsattheSleeves油污套子毛边2OverstressedCurls8UnclearLetter,Pictograms卷曲印字图案不清3UnfunctionalBandages9Skew绑带过松印刷歪斜4DamagedPlugs10ColorStain插头损坏色斑5PoorVulcanizationofSR11FingerPrints(Marks)
SR硫化不良指痕612IncompleteCasingPoorCrimpingofconn.外被不完整Conn缝合不良Manuals,Packages,PrintedInformationandTypeLablesNo.No.中文名称英文名称中文名称英文名称17FoldsUncompleteness折皱内容不完整28FlawsWrongTint
裂纹色彩错误3CoverageUnclearLetter,Pictograms9覆盖印字图案不清410PoorPrintingSkew印刷不良印刷歪斜511IncorrectFontPoorLayerCongruence字体错误一致性不佳612BubbleBurrsandgrainsfromcutting起泡裁边毛边及纸屑ProcessDefectTerms1.SolderingQuality
No.No.中文名称英文名称中文名称英文名称1ExcessSolder7SplitSolder包焊锡裂2ColdSolder8SolderBridge冷焊锡桥3FloatingSolder9Open浮焊开路4EmptySolder10Short空焊
短路5Icing11MissingComponent冰柱掉件,漏件6SolderTip12InveraciousSoldering锡尖突出虚焊OperationalDefectTermsNo.No.中文名称英文名称中文名称英文名称1MissingParts(component)6Bumps漏插踫伤2WrongPart7PaintAdhesion错件粘胶3BackwardPart8MisalignedPart零件插反零件错位4ForeignPart9BrokenPart异物零件损坏5Scratches10OpenSolder刮伤漏焊ICTFailCauseandRepairActionsNo.No.
中文名称英文名称中文名称英文名称1Short11SolderBridge短路桥焊2WrongPart12SolderAdded错件加锡3BackwardPart13SolderRemoved零件插反去锡4MissingPart14PartReplaced掉件换零件5PCBDefect15PartAddedPCB缺陷加零件6BrokenPart16PartRepaired零件损坏零件修复7DefectivePart17BoardSentForAnalysis零件缺陷板送去分析8PCBOpen18BoardRepairedPCB开路板修复9BrokenPart19BoardScrapped零件损坏板报废10OpenSolder20BoardLost漏焊板丢失Tools,Jigs,andEquipmentNo.No.中文名称英文名称中文名称
英文名称1SolderingIron12UltrasonicWeldingMachine电铬铁超声波焊接机2De-solderGun13SlidingCallipers吸锡枪
游标卡尺3WaveSolderingMachine14MicroMeterCallipers波峰炉螺旋测微器4ReflowOven15DigitalTorqueMeter回焊炉
数字扭力器5ScrewDriver16GroundContinuityTester电锁接地阻抗测试仪AC/DCWithstandingVoltage6SmartElectronicLoad17电子负载高压测试仪Tester7Oscilloscope18ElectroacousticAnalyzer示波器电声分析仪8Multimeter19Temperature/HumidityChamber万用表恒温恒湿机9PowerMeter20Oven功率表烤箱1021FunctionGeneratorLeakageCurrentMeter信号发生器漏电流测试仪11Push-PullScale22HotStampingMachine推拉力器烫金机SafetyandEMCNo.简称英文名称中文名称1EMCElectro-MagneticCompatibility电磁兼容2EMIElectro-MagneticInterference电磁干扰3EMSElectro-MagneticSusceptibility电磁耐受4EMPElectro-MagneticPulse电磁脉冲5ESDElectro-StaticDischarge静电放电
6ULUnderwritersLaboratoriesInc.美国安规(担保实验室)7CSACanadianStandardsAssociation加拿大标准协会8FCCFederalCommunicationCommission美国联邦通讯委员会9IECInternationalElectrotechnicalCommission国际电工委员会10TUV德国技术监护委员会(莱茵公司)11CE欧洲共同市场标准12CCEE/CCIB中国电工产品安全认证委员会13VDE
德国电气标准14CBCertificationBody全球性相互认证体系15NCBNationalCertificationBody国家认证机构QATestNo.No.中文名称英文名称中文名称英文名称1ColdTest9Cord/StrainReliefDurability冷藏实验吊重测试2DryHeatTest10DropTest干热实验落下实验3DampHeatTest11SweepVibrationTest湿热实验扫频振动实验412RandomVibrationTestTemp.CyclingTest随机振动实验温度循环实验temp./humidityStorage
储藏温湿循环513Poweron/offTest开/关冲击实验CyclingTest实验Operatingtemp./humidity工作温湿循环614SwitchDurabilityTest开关寿命测试cyclingTest实验7ThermalShock
Test15LabelDurabilityTest温度冲击实验标签耐磨测试8BurninTest16PrintingDurabilityTest烧机实验印字耐磨测试六.AbbreviationNo.简称英文名称中文名称1MTBFMeanTimeBetweenFailure平均失效间隔时间2FMEAFailureModeandEffectsAnalysis失效模式与效应分析3GR&
RGaugeRepeatabilityandReproducibility量规仪器重复性与再现性4APQPAdvancedProductQualityPlanning前期产品质量规划5CaCapabilityofAccuracy制程准确度6CpCapabilityofPrecision制程精密度7EIAElectronicIndustriesAssociation电子工作协会8ISOInternationalOrganizationforStandard国际标准组织9SMTSurfaceMountingTechnology表面组装技术10SMDSurfaceMountingDevice表面组装设备11PDPProductDevelopmentProcedure
产品开发流程12DVTDesignVerificationTest设计验证测试13MVTManufacturingVerificationTest生产验证测试14MBOManagementByObject目标管理15RMAReturnedMerchandiseAccess退货16MDRMaterialDefectReport材料不良报告17DPMODefectPerMillionOpportunities每百万机会的不良次数18KPIKeyPerformanceIndicating主要绩效指标19BSCBalancedScoreCard平衡绩分卡20OOBAOutOfBoxAudit开箱检验21PPMPiecesPerMillion每百万中的不良数22RPNRiskPriorityNumber风险优先指数23ESGEnergySystemsGroup
Motorola的一个事业部的名称
24ESPEmployeeSuggestionProgram员工提案制度25BOMBillofMaterial料单26QIIQualityInspectionInstruction
质量检验说明书27MOIManufacturingOperationInstruction作业指导书MIManualInProcess手插件28ICTInCircuitTest在线测试29MSDSMaterialSafetyDataSheet材料安全数据表30SPCStatisticalProcessControl统计制程管制31DOEDesignof
Experiments实验设计1.缺件(MISSINGPARTS)
2.错件(WRONGPARTS)3.多件(EXCESSIVEPARTS)
4.短路(SHORT)5.断路(OPEN)6.线短(WIRESHORT)
7.线长(WIRELONG)8.拐线(WIREPOORDDRESS)
9.冷焊(COLDSOLDER)10.包焊(EXCESSSOLDER)
11.空焊(MISSINGSOLDER)12.锡尖(SOLDERICICLE)
13.锡渣(SOLDERSPLASH)14.锡裂(SODERCRACK)
15.锡洞(PINHOLE)16.锡球(SOLDERBALL)
17.锡桥(SOLDERBRIDGE)18.滑牙(SCREWLOOSE)
19.氧化(RUST)20.异物(FOREIGNERMATERIAL)
21.溢胶(EXCESSIVEGLUE)22.锡短路(SOLDERBRIDGE)23.锡不足(SOLDERINSUFFICIENT)24.极性反(WRONGPOLARITY)25.脚未入(PINUNSEATED)26.脚未出(PINUNVISIBLE)27.脚未剪(PINNOCUT)28.脚未弯(PINNOTBENT)29.缺盖章(MISSINGSTAMP)30.缺标签(MISSINGLABEL)31.缺序号(MISSINGS/N)32.序号错(WRONGS/N)33.标签错(WRONGLABEL)34.标示错(WRONGMARK)35.脚太短(PINSHORT)36.J1不洁(J1DIRTY)
37.锡凹陷(SOLDERSCOOPED)38.线序错(W/LOFWIRE)
39.未测试(NOTEST)40.VR变形(VRDEFORMED)
41.PCB翘皮(PCBPEELING)42.PCB弯曲(PCBTWIST)
43.零件沾胶(GLUEONPARTS)44.零件脚长(PARTSPINLONG)45.浮件(PARTSLIFT)46.零件歪斜(PARTSTILT)47.零件相触(PARTSTOUCH)48.零件变形(PARTSDEFORMED)49.零件损坏(PARTSDAMAGED)
50.零件脚脏(PINDIRTY)51.零件多装(PARTSEXCESS)
52.零件沾锡(SOLDERONPARTS)53.零件偏移(PARTSSHIFT)54.包装错误(WRONGPACKING)55.印章错误(WRONG
STAMPS)56.尺寸错误(DIMENSIONWRONG)
57.二极管坏(DIODENG)58.晶体管坏(TRANSISTORNG)
59.振荡器坏(X'
TLNG)60.管装错误(TUBESWRONG)
61.阻值错误(IMPEDANCEWRONG)62.版本错误(REVWRONG)63.电测不良(TESTFAILURE)64.版本未标(NONREVLEBEL)65.包装损坏(PACKINGDAMAGED)66.印章模糊(STAMPSDEFECTIVE)67.标签歪斜(LABELTILT)68.外箱损坏(CARTONDAMAGED)69.点胶不良(POORGLUE)70.IC座氧化(SOCKETRUST)71.缺UL标签(MISSINGULLABEL)72.线材不良(WIREFAILURE)73.零件脚损坏(PINDAMAGED)74.金手指沾锡(SOLDERONGOLDENFINGERS)75.包装文件错(RACKINGDOCWRONG)
76.包装数量错(PACKINGQ'
TYWRONG)
77.零件未定位(PARTSUNSEATED)78.金手指沾胶(GLUEONGOLDENFINGERS)79.垫片安装不良(WASHERUNSEATED)80.线材安装不良(WIREUNSEATED)81.立碑(TOMBSTONE)
SMT不良描述中英文对照
1露底材Basematerial
expose2偏位Shift3短路/连锡Short4少锡Insufficientsolder5多锡/包焊Excesssolder6漏印Missingprint7反白Upsidedown8少件Missingcomponent9反向Wrongorientation10错件Wrongcomponent11多件/残件Extracomponent12破损Damaged13空焊Nosolder14立碑Tombstoning15锡珠Solderballs16侧立Sidetermination17零件氧化Partsoxidation18锡尖Solderprojection19浮高Float20翘脚Liftedlead21PAD不上锡PADdiscoloration22针洞Pinholes23压件Covercomponent24残异物Residues25助焊剂残留Fluxresidues26少胶Insufficientglue27溢胶Overflowglue28误判NoFail29其它Other30印刷不良PrintDefect31上盖脱落/断裂Topcovermissing/crack32
掉件/撞件Dropcomponent33内PIN翘起(缺PIN/短PIN/翘PIN)Liftedinside-pin34版本混装Mixededition35线路偏移Circuitshift36错位Errorposition37脚歪/变形Leaddeformed/deformation38混料Mixedmaterial39胶未固化Gluenotbesolidified40烫伤Scald41堵孔Obstacleonvia42
PCB白化/分层PCBDelamination43漏洞Exposedcopper44
无极性Missingpolarity45压伤Crush46漏点胶Missingglue47气泡Airbubble48屏蔽架变形ShieldDeformation49
屏蔽架毛刺ShieldBurr50刮伤Scraped51弹片翘起Springlifted52弹片失效Springfailure53弹片无法复位Springcan’treplace54零件沾锡Solderonparts序号汉语意义英文翻译焊锡质量类1冷焊coldsolder2零件偏移componentshifted3污损contamination4坏件damagedcomponent5锡多excessivesolder6装插不良improperinsertion7绝缘不良insulationdamaged8线脚长leadprotrusionoutofspec9漏点胶missingglue
10漏标示missingmarking11近似短路nearshort
12无线尾noleadprotruded13翘皮peelingoff
14极性反polarityreversed15成型不良poorpreforming
16锡桥solderbridge17锡裂soldercrack18锡尖soldericicle19锡少solderinsufficient20防焊漆胶落soldermaskpeelingoff21锡渣solderspatter
22锡洞soldervoid23错件wrongpartICTFailCauseandRepairActions1短路Short2零件插反BackwardPart3板丢失BoardLost4板修复BoardRepaired5板报废BoardScrapped6
板送去分析BoardSentForAnalysis7零件损坏BrokenPart8零件缺陷DefectivePart9掉件Missingpart
10加零件PartAdded11零件修复PartRepaired12换零件PartReplaced13PCB缺陷PCBDefect14PCB开路PCBOpen15加锡SolderAdded16桥焊SolderBridge17去锡SolderRemovedSoldingquality1空焊EmptySolder2包焊ExcessSolder3浮焊FloatingSolder4冰柱Icing5虚焊InveraciousSoldering6掉件,漏件MissingComponent7开路Open8漏焊OpenSolder9锡桥SolderBridge10
锡尖突出SolderTip11锡裂SplitSolderOperationaldefectterms1零件插反BackwardPart2零件损坏BrokenPar
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