Eagle lake ME Plan Rev03文档格式.docx

Eagle lake ME Plan Rev03文档格式.docx

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Mar28，2008

REVISIONHISTORY:

RevLevel

What’sIn

What’snot

0.1

InitialRelease

02

Updatedproductcodeandbeatrateinformation,AddthedifferencebetweenNBandTF,andtheDFM

0.3

Updatedpackinginformation

TheaboverevisionscheduleissubjecttochangeoneachMEPlan.ThisscheduleservesonlyasaguidetodirecttheactingMEinthetimelycreationandreleaseofthisdocumenttoit’sreaders.Revisionlevelsmaybeinsertedorappendedasnecessary.Revisionlevelsnumericallybetweenlevelsintheabovetablemaybeused;

thisindicatesthatcontenthasbeenaddedtoapriorrelease,atthelowerrevisionlevel,butisinsufficienttodeclareafullrevincrement.

EXECUTIVESUMMARY:

ProductHighlights:

TheEaglelakeproductincludedinthisMEPlanreleasedisATXNobletown（G43）andTopsfield（P43）．Theboardisdoublesided（SMTonlyonbottomside）inFABA,singleinFABB,allwithanImmersionsilversurfacefinish.BothNobletownandTopsfieldwilluseGreensoldermask.

TheNobletownandTopsfieldwillutilizeEaglelakeplatformutilizingICH10.AllproductsrepresentedinthisMEplanareATX11.6’’x9.60”.

MaindifferencebetweenNBandTFinfeatureisthatNBhasVGAandDVI-D,whileTFnot.

ManufacturingHighlights:

1.LGA775–TheLGA775issameaswhatiscurrentlybeingusedforallGrantsdale/AlderwoodandLakeport/Glenwood/Broadwaterproducts.Nonewmanufacturingtechnologiestobeincluded.

2.MCHHeatsinkwithTIMPCM45F–MCHheatsinkissameaswhatisbeingusedforBearlakeproducts.TheHSattacheswithtwoplasticramps,awireclipand4WSanchors.

3.MCH–ballcountis1254,0.7mmminimumvariablepitchedpackageballBGA（34mm2）withcircularandovalpad（12*14*16mils）.

4.ICH10–ballcountis676,1.0mmminimumvariablepitchedpackageballBGA（31mm2）.Itwillhavebothcircularandovalshapepad.Theovalshape（14x22mil）willbeat3outerrowswhilecircularshape（18mil）ontheremainingball.

5.LeadFree–AllPCBswillbeLFandrequireLFcomponentsandmanufacturingprocess.

6.LCC–LeadlessChipCarrierandSMTcomponentswillbeusedatlocationsU27（LCC40）,U6（LCC48）,U5（LCC56）,U26（LCC32）,andU20（LCC56）.Aspecialnozzleandreworkprofilecouldberequired.

7.UseforkDIMMconnectors（nopeglocks）,soassemblyfixtureisrequired.

DIMMsuppliersmustbethesameoneveryboard.Ifswitchingtoanalternatesupplier,alllocationsmuchswitchtothesamealternatesupplier.DIMMconnectorshouldbecolorcodedsothatDIMM0forchannelA&

B=blueandDIMM1forchannelA&

B=black,DIMMtabsmustbewhite（shownasbelowfigure）:

DFM–refertoDFMsection.

NOTE:

allnewtechnologies/highlightswillbediscussedinupcomingsectionsoftheMEPlan.

Customers:

channel

SKUMATRIX:

EaglelakeGeneric–Nobletown（Classic）

ProductCode

MM#

TA#

AA#

PBA

PB

LAN

BOXDG43NB

897538

E35609-100

E34877-101

n/a

Yes

BLKDG43NB

897539

E35610-100

Yes

BOXDG43NBPP

897540

E35608-100

EaglelakeGeneric–Topsfield（Classic）

BOXDP43TF

897798

E36020-100

E34878-101

BLKDP43TF

897799

E36021-100

BOXDP43TFPP

897800

E37277-100

DESIGNPROFILE:

Processor:

Pentium4

Socket:

LGA775socket

Chipset:

EaglelakeGMCH/ICH10Chipset

FormFactors

ATX（11.6”x9.6”）

MANUFACTURINGPROFILE:

PBATechnology:

SMTType2,SingleSided

PBTechnology:

Trace/Space:

Primarily0.005/0.005

LayerCount:

4

LeadFreeFAB

SurfaceFinish:

ImAg

PBSize:

11.6”x9.6”ATX

PanelConfiguration:

Single-Image

UniqueSMTPackages:

0.7mmpitchBGA,0.5mmpitchLCC,14x22milovalpadICH

LeadFreeAssembly:

AllEaglelakegenerationboardswillbeleadfree.

LeadFreeDefinition:

∙100%leadfreebillofmaterials（componentshaveleadfree2ndlevelinterconnectleadsandterminals）.

∙LeadfreePCBsurfacefinish.ForIntelmotherboardstheleadfreesurfacefinishwillbeSilverImmersion（ImAg）.

∙Leadfreeassemblysolders.Thisincludesleadfreesolderpaste,wavesolder,andreworksolder.

LeadFreeManufacturingEnablingandSiteCertification:

∙Thisinvolves:

oProcessoptimization（solderpaste,wavesolder,reworksolder,andprofilesforeacharea）

oManufacturingreadinessassessment

oReliabilityBuild

oReliabilityTesting（TCS,shock,vibe）

oYieldassessmentonpilotbuildsattheODM

∙HVMbuildsCANNOTtakeplacepriortothesuccessfulcompletionofSiteCertification.

LeadFreeBoardMarkings:

∙Intelmotherboardswillbemarke