preconWord文档格式.docx
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preconWord文档格式.docx
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IPC/JEDECJ-STD-020D.1
March2008
SupersedesIPC/JEDECJ-STD-020D
August2007
Notice
IPCandJEDECStandardsandPublicationsaredesignedtoservethepublic
interestthrougheliminatingmisunderstandingsbetweenmanufacturersand
purchasers,facilitatinginterchangeabilityandimprovementofproducts,and
assistingthepurchaserinselectingandobtainingwithminimumdelaythe
properproductforhisparticularneed.ExistenceofsuchStandardsand
Publicationsshallnotinanyrespectprecludeanymemberornonmember
ofIPCorJEDECfrommanufacturingorsellingproductsnotconforming
tosuchStandardsandPublications,norshalltheexistenceofsuchStandards
andPublicationsprecludetheirvoluntaryusebythoseotherthanIPCor
JEDECmembers,whetherthestandardistobeusedeitherdomestically
orinternationally.
RecommendedStandardsandPublicationsareadoptedbyIPCorJEDEC
withoutregardtowhethertheiradoptionmayinvolvepatentsonarticles,
materials,orprocesses.Bysuchaction,IPCorJEDECdonotassumeany
liabilitytoanypatentowner,nordotheyassumeanyobligationwhateverto
partiesadoptingtheRecommendedStandardorPublication.Usersarealso
whollyresponsibleforprotectingthemselvesagainstallclaimsofliabilities
forpatentinfringement.Thematerialinthisjointstandardwasdevelopedby
theIPCPlasticChipCarrierCrackingTaskGroup(B-10a)andtheJEDEC
JC-14.1CommitteeonReliabilityTestMethodsforPackagedDevices
ForTechnicalInformationContact:
JEDECIPC
SolidStateTechnologyAssociation3000LakesideDrive,Suite309S
2500WilsonBoulevardBannockburn,Illinois
Arlington,VA22201-383460015-1249
www.jedec.orgTel847615.7100
Fax847615.7105
PleaseusetheStandardImprovementFormshownattheendofthis
document.
©
Copyright2008.JEDEC,Arlington,Virginia,andIPC,Bannockburn,Illinois.AllrightsreservedunderbothinternationalandPan-American
copyrightconventions.Anycopying,scanningorotherreproductionofthesematerialswithoutthepriorwrittenconsentofthecopyright
holderisstrictlyprohibitedandconstitutesinfringementundertheCopyrightLawoftheUnitedStates.
ASSOCIATIONCONNECTING
ELECTRONICSINDUSTRIES®
Supersedes:
IPC/JEDECJ-STD-020D-
IPC/JEDECJ-STD-020C-
July2004
Moisture/Reflow
SensitivityClassification
AjointstandarddevelopedbytheIPCPlasticChipCarrierCrackingTask
Group(B-10a)andtheJEDECJC-14.1CommitteeonReliabilityTest
MethodsforPackagedDevices
Usersofthisstandardareencouragedtoparticipateinthe
developmentoffuturerevisions.
Contact:
IPC/JEDECJ-STD-020B-
July2002
IPC/JEDECJ-STD-020A-
April1999
J-STD-020-October1996
JEDECJESD22-A112
IPC-SM-786A-January1995
IPC-SM-786-December1990
JEDEC
SolidStateTechnologyAssociation
2500WilsonBoulevard
Arlington,VA22201-3834
www.jedec.org
IPC
3000LakesideDrive,Suite309S
Bannockburn,Illinois
60015-1249
Tel847615.7100
ThisPageIntentionallyLeftBlank
TableofContents
1PURPOSE.................................................................1
1.1Scope......................................................................1
1.2Background............................................................1
1.3TermsandDefinitions............................................1
2APPLICABLEDOCUMENTS....................................2
2.1JEDEC....................................................................2
2.2IPC..........................................................................3
3APPARATUS.............................................................3
3.1TemperatureHumidityChambers..........................3
3.2SolderReflowEquipment......................................3
3.2.1FullConvection(Preferred)...................................3
3.2.2Infrared...................................................................3
3.3Ovens......................................................................3
3.4Microscopes............................................................3
3.4.1OpticalMicroscope................................................3
3.4.2AcousticMicroscope..............................................3
3.5Cross-Sectioning....................................................3
3.6ElectricalTest.........................................................4
3.7WeighingApparatus(Optional).............................4
3.8BeadedThermocoupleTemperature
Measurement..............................
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