通信类外文翻译中英文翻译Word文档格式.docx

通信类外文翻译中英文翻译Word文档格式.docx

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JinghongChen*,JunZou**,ChangLiu**andSung-Mo（Steve）Kang***

AgereSystems,Holmdel,NJ07733

DepartmentofElectricalandComputerEngineering,

UniversityofIllinoisatUrbana-Champaign,Urbana,IL61801JackBaskinSchoolofEngineering,UniversityofCalifornia,SantaCruz

ABSTRACT

Thispaperpresentstheresultsofthedevelopmentofaverticalplanarcoilinductor.Theplanarcoilinductorisfirstfabricatedonsiliconsubstrateandthenassembledtotheverticalpositionbyusinganovel3-Dimensionalbathscaleself-assemblyprocess（PlasticDeformationMagneticAssembly（PDMA））.Inductorsofdifferentdimensionsarefabricatedandtested.TheS-parametersoftheinductorsbeforeandafterPDMAaremeasuredandcompared,demonstratingsuperiorperformanceduetoreducedsubstrateeffectsandalsoincreasedsubstratespacesavingsfortheverticalplanarcoilinductors.

Keywords:

MEMS,planarcoilinductor,qualityfactor,PDMA,resonancefrequency.

1INTRODUCTION

Withthedevelopmentofintegratedwirelesscommunicationsystems,on-chipinductorswithsatisfactoryperformance（enoughqualityfactorandselfresonantfrequency）arerequired.However,theconventionalplanarcoilinductorsuffersfromsubstratelossesandparasiticssinceitisdirectlyfabricatedontoconductivesubstrateoveraverythindielectriclayer[1].

Inrecentyears,muchefforthasbeenmadetoimprovetheperformanceofplanarcoilinductors.Metalmaterialswithhigherconductivityorthickermetallayersareutilizedtodecreasetheresistanceofthecoil.Meanwhile,differentmethodsareproposedtoreducethesubstratelossandparasitics,includingremovingthesubstrateunderneaththeinductor[2],applyingathickpolymidelayertoseparatetheinductorfartherawayfromthe

substrate[3],etc.Morerecently,planarcoilinductorslevitatedabovethesubstratearerealizedusingasacrificialmetallicmode（SMM）process[4].3-Dimensionalsolenoidon-chipinductorsdevelopedbyusing3-Dlaserlithographyorsurfacemicromachiningtechnologyhavealsobeendemonstrated[5,6].Thispaperreportsverticalplanarcoilinductorsdevelopedbyusinganovel3-Dself-assemblyprocess-PlasticDeformationMagneticAssembly（PDMA）.Experimentalresultsshowthattheverticalplanarcoilinductorsufferslesssubstratelossandparasiticsthantheconventionalhorizontalcounterparts,andthuscanachieveahigherquality（Q）factorandself-resonantfrequency.Anothermajoradvantageoftheverticalinductorsisthattheyhavealmostzerofootprintsandthusoccupymuchsmallersubstratespace.

2PLASTICDEFORMATIONMAGNETICASSEMBLY（PDMA）

Fig.1AschematicillustrationofaPlasticDeformation

MagneticAssemblyprocess（PDMA）

PDMAisthekeytechnologytorealizetheverticalplanarcoilinductors.Adetaileddiscussionofthisassemblyprocesswillbepresentedinotherpublications.AbriefintroductionofPDMAisgivenbelowbyusinga

cantileverbeamasanexample.Notethattheregionnearthefixedendisintentionallymademoreflexible.First,acantileverbeamwithapieceofmagneticmaterialattachedtoitstopsurfaceisreleasedfromthesubstratebyetchingawaythesacrificiallayerunderneath（Fig.1（a））.Next,a

magneticfieldHextisapplied,themagneticmaterialpieceismagnetizedandthecantileverbeamwillberotatedoffthesubstratebythemagnetictorquegeneratedinthemagneticmaterialpiece（Fig.1（b））.Ifthestructureisdesignedproperly,thisbendingwillcreateaplasticdeformationintheflexibleregion.Thecantileverbeamwillthenbeabletoremainatacertainrestangle（φ）abovethesubstrateevenafterHextisremoved（Figure1（c））.Byusingductilemetal（e.g.gold）intheflexibleregion,agoodelectricalconnectionbetweentheassembledstructureandthesubstratecanbeeasilyachieved,whichissuitableforRFapplications.Aftertheverticalassembly,thestructurescanbefurtherstrengthenedandthemagneticmaterialcanberemovedifnecessary.Ifthemagneticfieldisappliedglobally,then

allthestructuresononesubstratecanbeassembledinparallel.

3DESIGNANDFABRICATION

Thecorestructureoftheverticalplanarcoilinductorisidenticaltotheconventionalhorizontalone,whichconsistsoftwometallayersandonedielectriclayerbetween.Asageneralrule,highconductivitymetaland

lowlossdielectricmaterialshouldbeused.Inadditiontothisrequirement,thestructureoftheinductorshouldfacilitatetheimplementationofPDMA.

Theverticalplanarcoilinductorutilizesone-portcoplanarwaveguide（CPW）configurationwith3testpads（Ground-Signal-Ground）withapitchof150μm.Thethreetestpadsalsoserveastheanchoroftheverticalinductorsonthesubstrate.

3.1MaterialConsideration

Goldisuse