刚性PCB检验标准.docx
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刚性PCB检验标准.docx
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刚性PCB检验标准
刚性PCB检验标准
华为技术有限公司企业技术标准
Q/DKBA3178.1-2004
代替Q/DKBA3178.1-2003
刚性PCB检验标准
2004年03月29日发布2004年04月01日实施
华为技术有限公司
HuaweiTechnologiesCo.,Ltd.
版权所有XX
Allrightsreserved
密级:
秘密Q/DKBA3178.1-2004
目次
前言..................................................................101范围...................................................................12
1.1范围.............................................................12
1.2简介.............................................................12
1.3关键词...........................................................122规范性引用文件.........................................................123术语和定义.............................................................124文件优先顺序...........................................................135材料品质...............................................................13
5.1板材..............................................................13
5.2介质厚度公差......................................................14
5.3金属箔............................................................14
5.4镀层..............................................................14
5.5可撕胶(PeelableSolderMask)....................................15
5.6阻焊膜(SolderMask).............................................15
5.7标记油墨..........................................................15
5.8最终表面处理......................................................156外观特性...............................................................16
6.1板边..............................................................16
6.1.1毛刺/毛头(burrs)..........................................16
6.1.2缺口/晕圈(nicks/haloing).................................162016-06-06华为文档,未经许可不得扩散第2页,共58页Page2,Total58
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板角/板边损伤..............................................176.1.3
6.2板面..............................................................17
6.2.1板面污渍...................................................17
6.2.2水渍.......................................................17
6.2.3异物(非导体).............................................17
6.2.4锡渣残留...................................................17
6.2.5板面余铜...................................................17
6.2.6划伤/擦花(Scratch).......................................17
6.2.7压痕.......................................................18
6.2.8凹坑(PitsandVoids).......................................18
6.2.9露织物/显布纹(WeaveExposure/WeaveTexture,...............186.3次板面............................................................18
6.3.1白斑/微裂纹(Measling/Crazing)..............................19
6.3.2分层/起泡(Delamination/Blister)............................19
6.3.3外来夹杂物(ForeignInclusions).............................20
6.3.4内层棕化或黑化层擦伤.......................................216.4导线..............................................................21
6.4.1缺口/空洞/针孔.............................................21
6.4.2镀层缺损...................................................21
6.4.3开路/短路..................................................21
6.4.4导线压痕...................................................21
6.4.5导线露铜...................................................212016-06-06华为文档,未经许可不得扩散第3页,共58页Page3,Total58
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铜箔浮离...................................................216.4.6
6.4.7补线.......................................................216.4.8导线粗糙...................................................226.4.9导线宽度...................................................236.4.10阻抗.......................................................236.5金手指............................................................236.5.1金手指光泽.................................................236.5.2阻焊膜上金手指.............................................236.5.3金手指铜箔浮离.............................................236.5.4金手指表面.................................................236.5.5金手指接壤处露铜...........................................246.5.6板边接点毛头...............................................246.5.7金手指镀层附着力(AdhesionofOverplate)...................246.6孔................................................................256.6.1孔与设计不符...............................................256.6.2孔的公差...................................................256.6.3铅锡堵孔...................................................256.6.4异物(不含阻焊膜)堵孔.....................................266.6.5PTH导通性..................................................266.6.6PTH孔壁不良................................................266.6.7爆孔.......................................................266.6.8PTH孔壁破洞................................................26
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孔壁镀瘤/毛头(Nodules/Burrs)..............................276.6.9
6.6.10晕圈(Haloing)............................................286.6.11粉红圈(PinkRing).........................................286.6.12表层PTH孔环(ExternalAnnularRing-SupportedHoles)........286.6.13表层NPTH孔环(ExternalAnnularRing-UnsupportedHoles).....296.7焊盘..............................................................296.7.1焊盘露铜...................................................296.7.2焊盘拒锡(Nonwetting).....................................296.7.3焊盘缩锡,Dewetting,......................................306.7.4焊盘损伤...................................................306.7.5焊盘脱落、浮离.............................................306.7.6焊盘变形...................................................316.7.7焊盘尺寸公差...............................................316.7.8导体图形定位精度...........................................316.8标记及基准点......................................................316.8.1基准点不良.................................................316.8.2基准点漏加工...............................................316.8.3基准点尺寸公差.............................................316.8.4字符错印、漏印.............................................316.8.5字符模糊...................................................326.8.6标记错位...................................................326.8.7标记油墨上焊盘.............................................32
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其它形式的标记.............................................326.8.8
6.9阻焊膜............................................................326.9.1导体表面覆盖性(CoverageOverConductors).................326.9.2阻焊膜厚度.................................................336.9.3阻焊膜脱落,SkipCoverage)................................336.9.4阻焊膜起泡/分层(Blisters/Delamination)....................336.9.5阻焊膜入孔(非塞孔的孔)...................................346.9.6阻焊膜塞孔.................................................346.9.7阻焊膜波浪/起皱/纹路(Waves/Wrinkles/Ripples)..............356.9.8吸管式阻焊膜浮空,SodaStrawing,..........................356.9.9阻焊膜的套准...............................................356.9.10阻焊桥.....................................................366.9.11阻焊膜物化性能.............................................376.9.12阻焊膜修补.................................................376.9.13印双层阻焊膜...............................................376.9.14板边漏印阻焊膜.............................................376.9.15颜色不均...................................................376.10外形尺寸.........................................................386.10.1板厚公差...................................................386.10.2外形尺寸公差...............................................386.10.3翘曲度.....................................................386.10.4板软.......................................................38
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拼板.......................................................386.10.5
6.11阶梯孔、阶梯板的特殊要求.........................................39
6.11.1阶梯孔的要求...............................................39
6.11.2阶梯板.....................................................406.12碳浆及银浆(线路及贯孔).........................................40
6.12.1开路/短路..................................................40
6.12.2导线宽度...................................................40
6.12.3阻值要求...................................................40
6.12.4银浆贯孔厚度要求...........................................40
7可观察到的内在特性.....................................................417.1介质材料.........................................................41
7.1.1压合空洞(LaminateVoids).................................41
7.1.2非金属化孔与电源/地层的空距................................41
7.1.3分层/起泡(Delamination/Blister)...........................42
7.1.4过蚀/欠蚀(Etchback)......................................42
7.1.5介质层厚度(Layer-to-LayerSpacing)........................43
7.1.6树脂内缩(ResinRecession)................................437.2内层导体.........................................................43
7.2.1孔壁与内层铜箔破裂(PlatingCrack-InternalFoil)...........44
7.2.2镀层破裂(PlatingCrack)..................................44
7.2.3表层导体厚度...............................................44
7.2.4内层铜箔厚度...............................................452016-06-06华为文档,未经许可不得扩散第7页,共58页Page7,Total58
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地/电源层的缺口/针孔.......................................457.2.5
7.3金属化孔.........................................................45
7.3.1内层孔环(AnnularRing-InternalLayers)....................45
7.3.2PTH孔偏....................................................46
7.3.3孔壁镀层破裂...............................................46
7.3.4孔角镀层破裂...............................................46
7.3.5渗铜(Wicking)..............................................47
7.3.6隔离环渗铜(Wicking,ClearanceHoles)........................47
7.3.7层间分离(垂直切片)(InnerlayerSeparation—Vertical
Microsection)....
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