JESD47I中文版.docx

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JESD47I中文版

IC集成电路压力测试考核

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STRESSDRIVENQUALIFICATIONOFINTEGRATEDCIRCUITS

IC集成电路压力测试考核

（FromJEDECBoardBallot,JCB-12-24,formulatedunderthecognizanceoftheJC14.3SubmitteeonSiliconDevicesReliabilityQualificationandMonitoring.）

通过JEDEC委员会JCB-12-24号投票，在JC14.3硅晶圆器件可靠性考核和监控小组委员会审理后系统地阐述和制定

1ScopeX围

Thisstandarddescribesabaselinesetofacceptancetestsforuseinqualifyingelectronicponentsasnewproducts,aproductfamily,orasproductsinaprocesswhichisbeingchanged.

这个文档描述了用于考核新产品、同族器件或工艺变更的可接受的基准测试标准

Thesetestsarecapableofstimulatingandprecipitatingsemiconductordeviceandpackagingfailures.Theobjectiveistoprecipitatefailuresinanacceleratedmannerparedtouseconditions.FailureRateprojectionsusuallyrequirelargersamplesizesthanarecalledoutinqualificationtesting.Forguidanceonprojectingfailurerates,refertoJESD85MethodsforCalculatingFailureRatesinUnitsofFITs.Thisqualificationstandardisaimedatagenericqualificationforarangeofuseconditions,butisnotapplicableatextremeuseconditionssuchasmilitaryapplications,automotiveunder-the-hoodapplications,oruncontrolledavionicsenvironments,nordoesitaddress2ndlevelreliabilityconsiderations,whichareaddressedinJEP150.Wherespecificuseconditionsareestablished,qualificationtestingtailoredtomeetthosespecificrequirementscanbedeveloped,usingJESD94thatwillresultinabetteroptimizationofresources.

这些测试用于加速和诱发半导体器件和封装的失效。

目的是通过比使用环境相比加速的方式来促成失效。

相比考核测试，失效率的预测需要更多的样品数量。

如果需要计算预期的失效率，请参考JESD85MethodsforCalculatingFailureRatesinUnitsofFITs。

本考核标准用于制定一系列适用于一般使用环境下的通用考核标准，而不是用于例如军工应用，汽车电子，或者不受控的航天电子等极端使用环境；同时本标准也不解决JEP150标准中提出的2nd等级可靠性问题。

在确定具体使用条件的情况下，可以使用JESD94开发适合于满足这些特定要求的考核测试，从而更好地优化测试资源。

Thissetoftestsshouldnotbeusedindiscriminately.Eachqualificationprojectshouldbeexaminedfor:

a）Anypotentialnewanduniquefailuremechanisms.

b）Anysituationswherethesetests/conditionsmayinduceinvalidoroverstressfailures.

注意：

不要不加选择地使用本文档中的测试。

应对每个考核项目进行确认：

a）是否存在任何潜在的新的和独特的失效机制。

b）任何测试或使用条件可能导致的失效或过应力失效情况。

Ifitisknownorsuspectedthatfailureseitherareduetonewmechanismsorareuniquelyinducedbytheseverityofthetestconditions,thentheapplicationofthetestconditionasstatedisnotremended.Alternatively,newmechanismsoruniquelyproblematicstresslevelsshouldbeaddressedbybuildinganunderstandingofthemechanismanditsbehaviorwithrespecttoacceleratedstressconditions（Ref.JESD91,“MethodforDevelopingAccelerationModelsforElectronicponentFailureMechanisms”andJESD94,“ApplicationSpecificQualificationusingKnowledgeBasedTestMethodology”）.

ConsiderationofPCboardassembly-leveleffectsmayalsobenecessary.Forguidanceonthis,refertoJEP150,Stress-Test-DrivenQualificationofandFailureMechanismsAssociatedwithAssembledSolidStateSurface-Mountponents.

Thisdocumentdoesnotrelievethesupplieroftheresponsibilitytoassurethataproductmeetsthepletesetofitsrequirements.

如果已知或怀疑失效是由于新机制或者独特的严苛测试条件引起，则不建议使用本文档描述的测试条件。

作为一种选择，可以通过理解器件在加速应力条件下的失效机制和表现，来解决新的失效机制或独特的失效问题（参考JESD91，“电子元器件失效机制加速模型的研究方法”和JESD94，“基于测试方法学的特殊考核“）。

 必须需要考虑PCB板级封装的影响。

有关这方面的指导，请参阅JEP150，与SMT贴装元件相关的压力测试考核和失效机制。

 本文件并不免除供应商确保产品符合其全部要求的责任。

2Referencedocuments参考文件

Therevisionofthereferenceddocumentsshallbethatwhichisineffectonthedateofthequalificationplan.

2.1Military军工级

MIL-STD-883,TestMethodsandProceduresforMicroelectronics

MIL-PRF38535

2.2Industrial工业级

UL94,TestsforFlammabilityofPlasticMaterialsforPartsinDevicesandAppliances.

ASTMD2863,FlammabilityofPlasticUsingtheOxygenIndexMethod.

IECPublication695,FireHazardTesting.

J-STD-020,JointIPC/JEDECStandard,Moisture/ReflowSensitivityClassificationforNonhermeticSolidStateSurface-MountDevices.

JP-001,FoundryProcessQualificationGuidelines（WaferFabricationManufacturingSites）.

JESD22Series,ReliabilityTestMethodsforPackagedDevices

JESD46,GuidelinesforUserNotificationofProduct/processChangesbySemiconductorSuppliers.

JESD69,InformationRequirementsfortheQualificationofSiliconDevices.

JESD74,EarlyLifeFailureRateCalculationProcedureforElectronicponents.

JESD78,ICLatch-UpTest.

JESD85,MethodsforCalculatingFailureRatesinUnitsofFITs.

JESD86,ElectricalParametersAssessment.

JESD94,ApplicationSpecificQualificationusingKnowledgeBasedTestMethodology.

JESD91,MethodsforDevelopingAccelerationModelsforElectronicponentFailureMechanisms.

JEP122,FailureMechanismsandModelsforSemiconductorDevices.

JEP143,SolidStateReliabilityAssessmentQualificationMethodologies.

JEP150,Stress-Test-DrivenQualificationofandFailureMechanismsAssociatedwithAssembledSolidStateSurface-Mountponents.

JESD201,EnvironmentalAcceptanceRequirementsforTinWhiskerSusceptibilityofTinandTinAlloySurfaceFinishes

JESD22A121,TestMethodforMeasuringWhiskerGrowthonTinandTinAlloySurfaceFinishes

3Generalrequirements通用要求

3.1Objective目标

Theobjectiveofthisprocedureistoensurethatthedevicetobequalifiedmeetsagenerallyacceptedsetofstresstestdrivenqualificationrequirements.Qualificationisaimedatponentsusedinmercialorindustrialoperatingenvironments.

本考核流程目的是确保器件能够通过一套通用的可接受的压力测试要求。

主要考核目标是针对在商业或工业工作环境中使用的器件

3.2Qualificationfamily同族考核

Whilethisspecificationmaybeusedtoqualifyanindividualponent,itisdesignedtoalsoqualifyafamilyofsimilarponentsutilizingthesamefabricationprocess,designrules,andsimilarcircuits.Thefamilyqualificationmayalsobeappliedtoapackagefamilywheretheconstructionisthesameandonlythesizeandnumberofleadsdiffers.Interactiveeffectsofthesiliconandpackageshallbeconsideredinapplyingfamilydesignations.

虽然本规X用于单个器件的考核，但也可用于验证使用相同晶圆制造工艺，设计规则和相似电路设计的同族器件。

同时也可以用于验证结构相同但只有尺寸和管脚数量不同的封装类别。

使用同族定义时应考虑硅晶圆和封装的相互作用。

3.3Lotrequirements批次需求

Testsamplesshallpriserepresentativesamplesfromthequalificationfamily.Manufacturingvariabilityanditsimpactonreliabilityshallbeassessed.Whereapplicablethetestsampleswillbeposedofapproximatelyequalnumbersfromatleastthree（3）nonconsecutivelots.Otherappropriatemeansmaybeusedtoevaluatemanufacturingvariability.Samplesizeandpass/failrequirementsarelistedinTables1-3.TablesAandBgiveguidanceontranslatingpass/failrequirementstolargersamplesizes.

GenericdataandlargersamplesizesmaybeemployedbaseduponaChiSquareddistributionusingatotalpercentdefectiveata90%confidencelimitforthetotalrequiredlotandsamplesize.ELFRrequirementsshallbeassessedata60%confidencelevelasshowninTableB.Ifasingleuniqueandexpensiveponentistobequalified,areducedsamplesizequalificationmaybeperformedusing1/3thesamplesizelistedinthequalificationtables.

测试样品应包含同族器件中的代表性样品，需要评估生产波动性对可靠性的影响。

在适当的情况下，需要从至少三个非连续批次中抽取相同数量的样品，或者使用其他适合评估生产波动性的方法。

表1-3中列出了测试样本量和合格/不合格的要求。

表A和B给出了更大样本量情况下的合格/不合格要求。

对于所有需要评估的批次和样品，可以基于卡方分布（90%可信度的总失效率），使用通用的数据和更大的样品数量。

ELFR要求按照表B所示的60％可信度进行评估。

如果要对一个独特且昂贵的器件进行考核评估，则可以使用考核表中列出的1/3样本量。

3.4Productionrequirements产品要求

Alltestsamplesshallbefabricatedandassembledinthesameproductionsiteandwiththesameproductionprocessforwhichthedeviceandqualificationfamilywil